• The Journal of the Korean dental association
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• 제55권5호
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• pp.339-350
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• 2017

The aim of the study was to analyze the distribution of dental filling materials for carious permanent teeth of school children in a city. The study was designed as time-serial study, using the data of the dental survey for children aged 8-, 10- and 12-year children living in Gimhae city. The samples were selected by stratified clusters sampling. The number of surveyed samples in depth-analysis for types of dental filling materials were 567 in 2009 and 331 in 2013, respectively. They had dental restorations on one or more teeth. The changing pattern of used dental filling materials was analyzed between 2009 and 2013. Statistical analysis was conducted according to variables related to dental filling material type; DMFT and DMFS index, number of fissure sealed teeth and surface and surveyed year. Amalgam filling rate decreased from 27.9% in 2009 to 18.8% in 2013, while filling rate of tooth-colored materials increased from 56.1% in 2009 and 68.9% in 2013. Amalgam filling rate was a negative correlation with filling rate of tooth-colored materials or gold and number of fissure sealed teeth and a positive correlation with DMFT index. Filling rate of tooth-colored materials was a negative correlation with filling rate of amalgam or gold and DMFT index and a positive correlation with number of fissure sealed teeth. The light-curing composite resin should be included in the reimbursement range of National Health Insurance to solve an inequity of dental health care services.

• Journal of the Microelectronics and Packaging Society
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• 제13권4호
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• pp.57-63
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• 2006

For chip-stack package applications, Cu filling characteristics into trench vias of $75{\sim}10\;{\mu}m$ width and 3 mm length were investigated with variations of electroplating current density and current mode. At $1.25mA/cm^{2}$ of DC mode, Cu filling ratio higher than 95% was obtained for trench vias of $75{\sim}35{\mu}m$ width. When electroplated at DC $2.5mA/cm^{2}$, Cu filling ratios became inferior to those processed at DC $1.25mA/cm^{2}$. Pulse current mode exhibited Cu filling characteristics superior to DC current mode.

• Journal of the Microelectronics and Packaging Society
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• 제21권4호
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• pp.117-123
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• 2014

Cu through-vias, which can be used as thermal vias or vertical interconnects, were formed using bottom-up electrodeposition filling as well as top-down electrodeposition filling into open via-holes and their microstructures were observed. Solid Cu through-vias without voids could be successfully formed by bottom-up filling as well as top-down filling with direct-current electrodeposition. While chemical-mechanical polishing (CMP) to remove the overplated Cu layer was needed on both top and bottom surfaces of the specimen processed by top-down filling method, the bottomup process has an advantage that such CMP was necessary only on the top surface of the sample.

• Restorative Dentistry and Endodontics
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• 제45권2호
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• pp.11.1-11.9
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• 2020

Objectives: This study compared the flow and filling of several retrograde filling materials using new different test models. Materials and Methods: Glass plates were manufactured with a central cavity and 4 grooves in the horizontal and vertical directions. Grooves with the dimensions used in the previous study (1 × 1 × 2 mm; length, width, and height respectively) were compared with grooves measuring 1 × 1 × 1 and 1 × 2 × 1 mm. Biodentine, intermediate restorative material (IRM), and mineral trioxide aggregate (MTA) were evaluated. Each material was placed in the central cavity, and then another glass plate and a metal weight were placed over the cement. The glass plate/material set was scanned using micro-computed tomography. Flow was calculated by linear measurements in the grooves. Central filling was calculated in the central cavity (㎣) and lateral filling was measured up to 2 mm from the central cavity. Results: Biodentine presented the least flow and better filling than IRM when evaluated in the 1 × 1 × 2 model. In a comparison of the test models, MTA had the most flow in the 1 × 1 × 2 model. All materials had lower lateral filling when the 1 × 1 × 2 model was used. Conclusions: Flow and filling were affected by the size of the test models. Higher grooves and materials with greater flow resulted in lower filling capacity. The test model measuring 1 × 1 × 2 mm showed a better ability to differentiate among the materials.

• Restorative Dentistry and Endodontics
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• 제16권2호
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• pp.118-125
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• 1991

Eighty - eight recently extracted teeth were used to evaluate the leakage characteristics of the following retrofilling materials; amalgam, zinc oxide eugenol cement, glass - ionomer cement, and cermet glass - ionomer cement. Root canals were prepared with step - back method and obturated with gutta percha and zinc oxide eugenol sealer. Root apex were resected 2 mm from apex and class I cavities were prepared with 2 mm or 4 mm depth. The cavities were filled with above materials. After application of varnish on all surface except resected surface, the roots were placed in 1 % methylene blue solution for 6 days. After longitudinal polishing to expose cental parts of filled materials, penetrated depths of dye were measured. The results were as follws. 1. As retrofilling material, glass ionomer cement filling groups showed less leakage than the other groups except zinc oxide eugenol cement filling group(p<0.01). 2. Amalgam filling groups had greater leakage than zinc oxide eugenol cement filling group(p<0.01). 3. 4 mm depth of retrofilled cavity had no effect on leakage characteristics compared with 2 mm depth cavity(p>0.05). 4. Glass ionomer cement and cermet glass ionomer cement filling groups showed less apical leakage than amalgam filling groups. But there was no statistical significance(p>0.05). 5. There was no difference in apical leakage between glass ionomer cement filling groups and cermet glass ionomer cement filling groups(p>0.05).

• Transactions of Materials Processing
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• 제5권3호
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• pp.239-255
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• 1996

A new forming technology has been developed to fabricate near-net shape products using light metal. A semi-solid forming technology has some advantages compared with the conventional forming processes such as die casting squeeze casting and hot/cold forging. In this study the numerical analysis of semi-solid filling for a straight die shape and orifice die shape in gate pattern is studied on semi-solid materials(SSM) of solid fraction fs =30% in A356 aluminum alloy. The finite difference program of Navier-Stokes equation coupled with heat transfer and solidification has been developed to predict a filling pattern and the temperature distribution of SSM. The programdeveloped in this study gives die filling patterns of SSM and final solidifica-tion region.

• Restorative Dentistry and Endodontics
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• 제38권3호
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• pp.119-127
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• 2013

The purpose of a root-end filling is to establish a seal between the root canal space and the periradicular tissues. As root-end filling materials come into contact with periradicular tissues, knowledge of the tissue response is crucial. Almost every available dental restorative material has been suggested as the root-end material of choice at a certain point in the past. This literature review on root-end filling materials will evaluate and comparatively analyse the biocompatibility and tissue response to these products, with primary focus on newly introduced materials.

• Restorative Dentistry and Endodontics
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• 제15권1호
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• pp.97-105
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• 1990

When conventional root canal treatment is failed or contraindicated, retrograde root canal filling following apicoectomy is a valuable procedure, aimed at hermetically sealing the root canal against leakage of irritants from the canal into the periapical tissue. In this in vitro investigation, to analyze apical microleakage electrochemically in teeth with different retrograde filling materials and preparation types, single - rooted tooth was cut 2mm from the apex and each Class I and Slot preparation was prepared. Experimental groups : Group 1. Amalgam filling with cavity varnish in Class I preparation Group 2. Scotchbond 2+Silux filling in Class I preparation Group 3. Gutta percha filling with ZOE cement in Class I preparation Group 4. Amalgam filling with cavity varnish in Slot preparation Group 5. Scotchbond 2+Silux filling in Slot preparation Each specimens was immersed in 1% solution of KCl, and applied a potential of 9V external power supply. Measurements of the current flow were obtained at 1, 2, 3, 7, 9, 12, 14, 18, 21, 25 and 28 day after immerson. Marginal microleakage were compared and evaluated. The results were as follows ; 1. The group filled with composite resin with dentin bonding agent shows lower apical microleakage value than the group filled with amalgam following varnish application (P<0.01). 2. In the group filled with gutta percha, apical microleakage value was the hightest 3. There was no significant difference between Class I cavity and Slot type cavity regardless of the used materials.

• Korean Journal of Metals and Materials
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• 제49권4호
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• pp.334-341
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• 2011

The mechanism behind super-filling of high-aspect-ratio features with Cu by catalyst-enhanced chemical vapor deposition (CECVD) coupled with plasma treatment is described and the metrology required to predict the filling feasibility is identified and quantified. The reaction probability of a Cu precursor was determined as a function of substrate temperature. Iodine adatoms are deactivated by the bombardment of energetic particles and also by the overdeposition of sputtered Cu atoms during the plasma treatment. The degree of deactivation of adsorbed iodine was experimentally quantified. The quantified factors, reaction probability and degree of deactivation of iodine were introduced to the simulation for the prediction of the trench filling aspect by CECVD coupled with plasma treatment. Simulated results show excellent agreement with the experimental filling aspects.

• Journal of Welding and Joining
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• 제32권3호
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.