• 한국구조물진단유지관리공학회 논문집
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• 제10권5호
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• pp.163-170
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• 2006

최근 피조콘시험은 과거 일반적으로 사용되었던 표준관입시험과 함께 연약지반의 특성을 평가하기 위해 빈번히 사용되고 있다. 본 연구에서는 하부지반의 지층상태를 파악하고 설계를 위한 연약지반 심도 결정 및 시공시 수직배수재 타설심도 결정시 그 신뢰도를 향상시키기 위해서 표준관입시험결과, 선행압밀하중, 수직배수재 타설시 관입에너지와 피조콘시험을 통한 콘 관입저항치와의 관계를 분석하였다. 대상 지역별로 일정한 표준관입저항치를 기준으로 평균 연약지반심도를 결정하여, 동일한 심도에서 피조콘관입저항치를 값을 분석한 결과 qc=(1.09~1.63)N, 선행압밀하중을 고려한 결과 qc=(1.21~1.98)N의 관계를 나타내었다. 또한 수직배수재 타설시 관입에너지와 피조콘시험을 통한 콘 관입저항치(qc)와의 관계를 분석한 결과 평균적으로 피조콘 관입저항치 $10kgf/cm^2$의 경우 수직배수재 타설 시 관입저항치는 약 $65{\sim}70kgf/cm^2$ 의 값을 나타내었다.

• 융합정보논문지
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• 제11권7호
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• pp.104-110
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• 2021

본 핀 채널 전계 효과 트랜지스터에서 낮은 소스/드레인 직렬 저항을 위한 새로운 선택적 산화 방식을 제안하였다. 이 방법을 이용하면, gate-all-around 구조와 점진적으로 증가되는 형태의 소스/드레인 확장영역을 갖는 핀 채널 MOSFET를 얻을 수 있다. 제안된 트랜지스터는 비교 소자에 비해 70% 이상의 소스/드레인 직렬 저항의 감소를 얻을 수 있다. 또한, 제안된 소자는 단채널 효과를 억제하면서도 높은 구동 전류와 전달컨덕턴스 특징을 보인다. 제작된 소자의 포화전류, 최대 선형 전달컨덕턴스, 최대 포화 전달컨덕턴스, subthreshold swing, 및 DIBL은 각각 305 ㎂/㎛, 0.33 V, 13.5 𝜇S, 76.4 𝜇S, 78 mV/dec, 62 mV/V의 값을 갖는다.

• Transactions on Electrical and Electronic Materials
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• 제16권3호
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• pp.139-141
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• 2015

Contact resistance of interface between the channel layers and various S/D electrodes was investigated by transmission line method. Different electrodes such as Ti/Au, a-IZO, and multilayer of a-IGZO/Ag/a-IGZO were compared in terms of contact resistance, using the transmission line model. The a-IGZO TFTs with a-IGZO/Ag/a-IGZO of S/D electrodes showed good performance and low contact resistance due to the homo-junction with channel layer.

• 대한전자공학회논문지SD
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• 제38권7호
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• pp.464-472
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• 2001

집적도 향상을 위해 사용되는 비대칭 n-MOSFET를 0.35 ㎛ CMOS공정으로 제조하여 그 전기적 특성을 조사고 전기적 모델을 제시하였다. 비대칭형 n-MOSFET는 대칭형 n-MOSFET에 비해 포화영역의 드레인 전류는 감소하였으며, 선형영역의 저항은 증가하였다. 그리고 비대칭형 n-MOSFET에서 보다 낮은 기판 전류가 측정되었다. 측정결과를 찬조하여 비대칭 n-MOSFET를 회로설계에 용이하게 사용할 수 있도록 기존의 대칭형 소자 모델을 개선한 새로운 모델을 제시하였다. 이 모델링의 정확성을 MEDICI 시뮬레이션을 통해 확인하였고, 대부분의 게이트 폭 범위에서 계산된 비대칭 n-MOSFET의 포화 전류 값은 측정값과 거의 일치하였다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권3호
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• pp.134-140
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• 2002

Deep submicron NMOSFETs with elevated source/drain can be fabricated using self-aligned selective epitaxial growth(SEG) of silicon for enhanced device characteristics with shallow junction compared to conventional MOSFETs. Shallow junctions, especially with the heartily-doped S/D residing in the elevated layer, give hotter immunity to Yt roll off, drain-induced-barrier-lowering (DIBL), subthreshold swing (SS), punch-through, and hot carrier effects. In this paper, the characteristics of both deep submicron elevated source/drain NMOSFETs and conventional NMOSFETs were investigated by using TSUPREM-4 and MEDICI simulators, and then the results were compared. It was observed from the simulation results that deep submicron elevated S/D NMOSFETs having shallower junction depth resulted in reduced short channel effects, such as DIBL, SS, and hot carrier effects than conventional NMOSFETs. The saturation current, Idsat, of the elevated S/D NMOSFETs was higher than conventional NMOSFETs with identical device dimensions due to smaller sheet resistance in source/drain regions. However, the gate-to-drain capacitance increased in the elevated S/D MOSFETs compared with the conventional NMOSFETs because of increasing overlap area. Therefore, it is concluded that elevated S/D MOSFETs may result in better device characteristics including current drivability than conventional NMOSFETs, but there exists trade-off between device characteristics and fate-to-drain capacitance.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.36-39
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• 2000

The adaptive learning circuit is designed the basis of modeling of MFSFET (Metal-Ferroelectric-Semiconductor FET) and the numerical results is analyzed. The output frequency of the adaptive learning circuit is inversely proportioned to the source-drain resistance of MFSFET and the capacitance of the circuit. The output frequency modulation of the adaptive learning circuit is investigated by analyzing the source-drain resistance of MFSFET as functions of imput pulse numbers in the adaptive learning circuit and the dimensionality factor of the ferroelectric thin film. From the results, the frequency modulation characteristics of the adaptive learning circuit, that is, adaptive learning characteristics which means a gradual frequency change of output pulse with the progress of input pulse are confirmed.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권5호
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• pp.485-489
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• 2015

An accurate large-signal BSIM4 macro model including new empirical bias-dependent equations of the drain-source capacitance and channel resistance constructed from bias-dependent data extracted from S-parameters of RF MOSFETs is developed to reduce $S_{22}$-parameter error of a conventional BSIM4 model. Its accuracy is validated by finding the much better agreement up to 40 GHz between the measured and modeled $S_{22}$-parameter than the conventional one in the wide bias range.

• JSTS:Journal of Semiconductor Technology and Science
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• 제3권3호
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• pp.139-144
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• 2003

We report the results of extensive mixed mode simulations and theoretical analysis to quantify the contribution of the edge direct tunneling (EDT) current on the total gate leakage current of 80nm NMOSFET with SiO2 gate dielectric. It is shown that EDT has a profound impact on basic analog circuit building blocks such as sample-hold (S/H) circuit and the current mirror circuit. A transistor design methodology with zero gate-source/drain overlap is proposed to mitigate the EDT effect. This results in lower voltage droop in S/H application and better current matching in current mirror application. It is demonstrated that decreasing the overlap length also improves the basic analog circuit performance metrics of the transistor. The transistor with zero gate-source/drain overlap, results in better transconductance, input resistance, output resistance, intrinsic gain and unity gain transition frequency.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.26-29
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• 1999

The I-V characteristics of the n-channel offset gated poly-Si TETs have been systematically investigated in order to analyse the effects of offset region. The on currents are reduced due to the series resistance by the offset length and there is no kink phenomenon in offset devices. The off currents of the offset gated TFTs are remarkably reduced to 10$^{-12}$ A independent of gate and drain voltage because the electric field is weakened by the increase of the depletion region width near the drain region. It is shown that the offset regions behave as a series resistance and reduce lateral and vertical electric field.

• 콘크리트학회지
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• 제28권3호
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• pp.18-22
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• 2016