• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.40 no.11
• /
• pp.45-53
• /
• 2003

This paper describes a Unified Voltage Generator that merges the pumping capacitors of boosted voltage generator (VPP) and substrate voltage generator (VBB) for DRAM. This unified voltage generator simultaneously supplies VPP and VBB voltages by using one pumping capacitor and one oscillator. The proposed generator is realized by 0.14${\mu}{\textrm}{m}$DRAM process. The generator reduces the power consumption to 30%, the area of total generator to 40% and the area of pumping capacitor to 29.6%, and improves the pumping efficiency to 13.2% at 2.0V supply voltage. In addition, the generator adopts the charge recycling technique for precharging the pumping capacitor during the period of precharge, thatcan reduces the precharge current to 75%.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2007.10a
• /
• pp.776-780
• /
• 2007

In this paper, the charge pump circuit of a VPP generator for a low voltage DRAM is newly proposed. The proposed charge pump is a 2-stage cross coupled charge pump circuit. The charge transfer efficiency is improved, and Distributed Clock Inverter is located in each charge pump stage to reduce clock period so that the pumping current is increased. In addition, the precharge circuit is located at Gate node of charge transfer transistor to solve the problem which is that the Gate node is maintained high voltage because the boosted charge can't discharge, so device reliability is decreased. The simulation result is that pumping current, pumping efficiency and power efficiency is improved. The layout of the proposed VPP generator is designed using $0.18{\mu}m$ Triple-Well process.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.10 no.7
• /
• pp.1266-1274
• /
• 2006

A non-overlap boosted-clock charge pump(NBCCP) with internal pumping capacitor, an advantageous circuit from a minimizing point of TFT-LCD driver IC module, is proposed in this paper. By using the non-overlap boosted-clock swinging in 2VDC voltage, the number of pumping stages is reduced to half and a back current of pumping charge from charge pumping node to input stage is also prevented compared with conventional cross-coupled charge pump with internal pumping capacitor. As a result, pumping current of the proposed NBCCP circuit is increased more than conventional cross-coupled charge pump, and a layout area is decreased. A proposed DC-DC converter for TFT-LCD driver IC is designed with $0.18{\mu}m$ triple-well CMOS process and a test chip is in the marking.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.4
• /
• pp.137-145
• /
• 2008

In this paper, novel CMOS charge pump having NMOS and PMOS transfer switches and a bulk-pumping circuit has been proposed. The NMOS and PMOS transfer switches allow the charge pump to improve the current-driving capability at the output. The bulk-pumping circuit effectively solves the bulk forward problem of the charge pump. To verify the effectiveness, the proposed charge pump was designed using a 80-nm CMOS process. The comparison results indicate that the proposed charge pump enhances the current-driving capability by more than 47% with pumping speed improved by 9%, as compared to conventional charge pumps having either NMOS or PMOS transfer switch. They also indicate that the charge pump reduces the worst-case forward bias of p-type bulk by more than 24%, effectively solving the forward current problem.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.328.1-328.1
• /
• 2014

MOSFET degradation의 대부분은 hot-carrier injection에 의한 interface state (Dit)의 생성에서 비롯되며 따라서 본 연구에서는 신뢰성에 대한 한 가지 방법으로 Charge pumping method를 이용하여 MOSFET의 interface trap(Dit)의 변화를 측정하였다. 소스와 드레인을 ground로 묶고 게이트에 펄스를 인가한 후 Icp를 측정하여 Dit를 추출하였다. 온도를 293~343 K까지 5 K씩 가변했을 때 293K의 Icp(${\mu}A$)는 0.12 nA 313 K는 0.112 nA 343 K는 0.926 nA이며 Dit (cm-1/eV-1)는 $1.61{\times}10^{12}$ (Cm-2/eV-1) $1.49{\times}10^{12}$ (Cm-2/eV-1) $1.23{\times}10^{12}$ (Cm-2/eV-1)이다. 측정결과 Dit는 Icp가 높은 지점에서 추출되며 온도가 높아지게 되면 Icp전류가 낮아지고 Dit가 줄어드는 것을 볼 수 있다. 온도가 올라가게 되면 carrier들이 trap 준위에서 conduction band 위쪽에 이동하게 되어서 interface에 trap되는 양이 작아지게 된다. 그래서 이때 Icp를 이용해 추출한 Dit 는 실제로 trap의 양이 줄어든 것이 아니라 Thermal excess 현상으로 인해 측정되는 Icp의 양이 줄어든 것으로 분석할 수 있다.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.5
• /
• pp.50-57
• /
• 2008

In this paper, a high-efficiency charge pump for use in CMOS image sensor(CIS) is proposed. The proposed charge pump pursues high pumping efficiency by minimizing the switching and reversion losses by taking advantage of operation characteristics of CIS. That is, the proposed charge pump minimizes the switching loss by dynamically controlling the size of clock driver, pumping capacitor, and charge transfer switch based on the operation phase of CIS pixel sensor. The charge pump also minimizes the reversion loss by guaranteeing a sufficient non-overlapping period of local clocks using a tri-state local clock driver adapting the schmitt trigger. Comparison results using a 0.13-um CMOS process technology indicate that the proposed charge pump achieves up to 49.1% reduction on power consumption under no loading current condition as compared to conventional charge pump. They also indicate that the charge pump provides 19.0% reduction on power consumption under the maximum loading current condition.

• Electrical & Electronic Materials
• /
• v.7 no.2
• /
• pp.123-129
• /
• 1994

SONOS EEPROM chips, containing several SONOSFET nonvolatile memories of various channel size, have been fabricated on the basis of the existing n-well CMOS processing technology for 1 Mbit DRAM ($1.2\mu\textrm{m}$.m design rule). All the SONOSFET memories have the triple insulated-gate consisting of 30.angs. tunneling oxide, 205.angs. nitride and 65.angs. blocking oxide. The miniaturization of the devices for the higher density EEPROM and their characteristics alterations accompanied with the scaling-down have been investigated. The stabler operating characteristics were attained by increasing the ratio of the channel width to length. Also, the transfer, switching, retention and degradation characteristics of the most favorable performance devices were presented and discussed.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
• /
• v.12 no.3
• /
• pp.312-320
• /
• 2019

In this paper, we design a 512Kb eFlash IP using 110nm eFlash cells. We proposed eFlash core circuit such as row driver circuit (CG/SL driver circuit), write BL driver circuit (write BL switch circuit and PBL switch select circuit), read BL switch circuit, and read BL S/A circuit which satisfy eFlash cell program, erase and read operation. In addition, instead of using a cross-coupled NMOS transistor as a conventional unit charge pump circuit, we propose a circuit boosting the gate of the 12V NMOS precharging transistor whose body is GND, so that the precharging node of the VPP unit charge pump is normally precharged to the voltage of VIN and thus the pumping current is increased in the VPP (boosted voltage) voltage generator circuit supplying the VPP voltage of 9.5V in the program mode and that of 11.5V in the erase mode. A 12V native NMOS pumping capacitor with a bigger pumping current and a smaller layout area than a PMOS pumping capacitor was used as the pumping capacitor. On the other hand, the layout area of the 512Kb eFlash memory IP designed based on the 110nm eFlash process is $933.22{\mu}m{\times}925{\mu}m(=0.8632mm^2)$.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.46 no.12
• /
• pp.80-86
• /
• 2009

In this paper, we present a new charge pump circuit feasible for the implementation with standard twin-well CMOS process technology. The proposed charge pump employs PMOS-switching dual charge-transfer paths and a simple two-phase clock. Since charge transfer switches are fully turned on during each half of clock cycle, they transfer charges completely from the present stage to the next stage without suffering threshold voltage drop. During one clock cycle, the pump transfers charges twice through two pumping paths which are operating alternately. The performance comparison by simulations and measurements demonstrates that the proposed charge pump exhibits the higher output voltage, the larger output current and a better power efficiency over the traditional twin-well charge pumps.

• The Transactions of the Korean Institute of Power Electronics
• /
• v.4 no.6
• /
• pp.515-522
• /
• 1999

Several power factor correction(PFC) circuits are presented to achieve high PF electronic ballast for both v voltage-fed and current-f,어 ek'Ctronic ballast. The proposed PFC circuits use valley-fil[(VF) type DClink s stages modified from the conventional VF circuit to adopt the charge pumping method for PFC operations d during the valley intervals. In voltage-fed ballast, charge pump capacitors are connected with the resonant c capaCltor In current-fed type, the charge pump capacitors are connc'Ctc'Cl with the additional second따y-side of t the power transformer. The measured PF is higher than 0.99 and THD is about 10% for all proposed PFC c circuits. The lamp current CF is also acceptable in the proposed circuits. The proposed circuit is suitable for i implementing cost longrightarroweffective electronic ballast.