• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.106-109
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• 2003

With the variation of Ag concentration in bath, current density, additive and agitation for electroplating of Sn-Ag solder, the compositions and the morphologies of solder were studied. It was possible to control Ag content in Sn-Ag solder by varying Ag concentration in bath and current density The microstructure size of Sn-Ag solder decreased with increasing current density. Duty cycle of pulse electroplating and quantity of additive affected on Ag content of deposit and surface roughness. In this work eutectic Sn-Ag solder bumps with fine pitch of 30m and height of 15m was formed successfully. The Ag content of electrodeposited solder was confirmed by EDS and WDS analyses and the surface morphologies was analyzed by SEM and 3D surface analyzer.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2005년도 연구개발 발표회 논문집
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• pp.803-809
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• 2005

This paper presents the theoretical model to investigate the effect of Coulomb damping in the sub-structure of a foil bearing. Foil deflection is restricted by friction of bumps. Equivalent viscous damping of the bump foils is derived from the Coulomb friction. Dynamic equation of the bumps is constituted by stiffness and damping terms. This point give the difference from Heshmat's frictionless and simple compliance bump model. The fluid is modeled with the compressible Reynolds equation. A perturbation approach is used to determine the static and dynamic performance of the bearing from the coupled fluid-structural model. The analysis result shows that the static and dynamic performance is enhanced by bump friction. This analysis technique would be extended to development of a high performance bearing.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.384-388
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• 1996

The closed-loop system modeling of an Active/semiactive suspension system has been accomplished through an artificial neural Networks. The 7DOF full model as the system equation of motion has been derived and the output feedback linear quadratic regulator has been designed for the control purpose. For the neural networks training set of a sample data has been obtained through the computer simulation. A 7DOF full model with LQR controller simulated under the several road conditions such as sinusoidal bumps and the rectangular bumps. A general multilayer perceptron neural network is used for the dynamic modeling and the target outputs are feedback to the input layer. The Backpropagation method is used as the training algorithm. The modeling of system and the model validation have been shown through computer simulations.

• 한국자동차공학회논문집
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• 제13권2호
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• pp.29-36
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• 2005

In oder to generate various shock signals in a field study, a passenger car was driven at several speeds over road profiles that included a number of half sine shaped bumps of various heights. A triaxial SAE pad sensor was mounted on the front passenger seat to measure the acceleration signals which might produce subjective discomfort. The measured accelerations were correlated with the subjective assessments of 14 subjects. The magnitude of subjective discomfort was found to be proportional to the VDV and also the peak to peak of the frequency weighted acceleration signal.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.17-24
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• 2012

Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.

• 한국유체기계학회 논문집
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• 제9권1호
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• pp.47-55
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• 2006

This paper presents the theoretical model to investigate the effect of Coulomb damping in the sub-structure of a foil bearing. Foil deflection is restricted by friction of bumps. Equivalent viscous damping of the bump foils is derived from the Coulomb friction. Dynamic equation of the bumps is constituted by stiffness and damping terms. This point give the difference from Heshmat's frictionless and simple compliance bump model. The fluid is modeled with the compressible Reynolds equation. A perturbation approach is used to determine the static and dynamic performance of the bearing from the coupled fluid-structural model. The analysis result shows that the static and dynamic performance is enhanced by bump friction. This analysis technique would be extended to development of a high performance bearing.

• Journal of Welding and Joining
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• 제23권5호
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• pp.49-54
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• 2005

The effective charge number and the critical current density of electromigration in eutetic SnPb and Pb Free $(SnAg_{3.8}Cu_{0.7)$ flip chip solder bumps are studied. The effective charge number of electromigration in eutectic SnPb solder is obtained as 34 and the critical current density is $j=0.169{\times}({\delta}_{\sigma}/{\delta}_x})\;A/cm^2,\;where\;({\delta}_{\sigma}/{\delta}_x})$ is the electromigration-induced compressive stress gradient along the length of the line. While the effect of electromigration in Pb free solder is much smaller than that in eutectic SnPb, the product of diffusivity and effective charge number $DZ^{\ast}$ has been assumed as $6.62{\times}10^{-11}$. The critical length for electromigration are also discussed.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.