• Journal of Welding and Joining
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• v.20 no.5
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• pp.99-105
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• 2002

One of the important advantage of adhesive bonded joint can combine the different materials. The joint that bonded by structural adhesive bond must keep a large force and its strength is affected by some environmental factors such as temperature and submergence time in water. In order to advance the fatigue strength of adhesive bonded joint, mostly put a surface treatment on the surface. This study was researched the effect of air temperature, submergence time, submergence temperature and surface treatment on the fatigue strength. We found that submergence temperature has the most effect and low plasma treatment specimens have the most fatigue strength.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.482-486
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• 1996

The progress of microelectronics technology has been requiring agressive developments of device technologies. Also the requirements of the next generation devices is heading to the limits of their functions and materials, and hence asking the very specific silicon wafer such as SOI(Silicon On Insulator) wafer. The talk covers the dome stic and world-wide status of SOI device developments and applications. The presentation will also touch some predictions such as SOI device prgress schedules, impacts on the normal wafer developments, market sizes, SOI wafer prices, and so on. Finally it will cover technical aspects which are silicon oxide conditions for bonding, point defects and, surface contaminations. These points will be hopefully overcome by involved people in microelectronics industry.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.264.2-264.2
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• 2013

Molecular layer deposition (MLD) is sequential, self-limiting surface reaction to form conformal and ultrathin polymer film. This technique generally uses bifunctional precursors for stepwise sequential surface reaction and entirely organic polymer films. Also, in comparison with solution-based technique, because MLD is vapor-phase deposition based on ALD, it allows epitaxial growth of molecular layer on substrate and is especially good for surface reaction or coating of nanostructure such as nanopore, nanochannel, nanwire array and so on. In this study, polyurea film that consisted of phenylenediisocyanate and phenylenediamine was formed by MLD technique. In situ Fourier Transform Infrared (FTIR) measurement on high surface area SiO2 substrate was used to monitor the growth of polyurethane and polyurea film. Also, to investigate orientation of chemical bonding formed polymer film, plan-polarized grazing angle FTIR spectroscopy was used and it showed epitaxial growth and uniform orientation of chemical bones of polyurea films.

• Transactions of the KSME C: Technology and Education
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• v.3 no.4
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• pp.265-271
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• 2015

The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

• The Journal of Advanced Prosthodontics
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• v.8 no.2
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• pp.101-109
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• 2016

PURPOSE. To investigate the void parameters within the resin cements used for fiber post cementation by micro-CT (${\mu}CT$) and regional push-out bonding strength. MATERIALS AND METHODS. Twenty-one, single and round shaped roots were enlarged with a low-speed drill following by endodontic treatment. The roots were divided into three groups (n=7) and fiber posts were cemented with Maxcem Elite, Multilink N and Superbond C&B resin cements. Specimens were scanned using ${\mu}CT$ scanner at resolution of $13.7{\mu}m$. The number, area, and volume of voids between dentin and post were evaluated. A method of analysis based on the post segmentation was used, and coronal, middle and apical thirds considered separately. After the ${\mu}CT$ analysis, roots were embedded in epoxy resin and sectioned into 2 mm thick slices (63 sections in total). Push-out testing was performed with universal testing device at 0.5 mm/min cross-head speed. Data were analyzed with Kruskal-Wallis and Mann-Whitney U tests (${\alpha}=.05$). RESULTS. Overall, significant differences between the resin cements and the post level were observed in the void number, area, and volume (P<.05). Super-Bond C&B showed the most void formation ($44.86{\pm}22.71$). Multilink N showed the least void surface ($3.51{\pm}2.24mm^2$) and volume ($0.01{\pm}0.01mm^3$). Regional push-out bond strength of the cements was not different (P>.05). CONCLUSION. ${\mu}CT$ proved to be a powerful non-destructive 3D analysis tool for visualizing the void parameters. Multilink N had the lowest void parameters. When efficiency of all cements was evaluated, direct relationship between the post region and push-out bonding strength was not observed.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.423-427
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• 2017

In this paper, an anchor design that improves bonding strength uniformity in the silicon-on-glass (SOG) process is presented. The SOG process is widely used in conjunction with electrode-patterned glass substrates as a standard fabrication process for forming high-aspect-ratio movable silicon microstructures in various types of sensors, including inertial and resonant sensors. In the proposed anchor design, a trench separates the silicon-bonded area and the electrode contact area to prevent irregular bonding caused by the protrusion of the electrode layer beyond the glass surface. This technique can be conveniently adopted to almost all devices fabricated by the SOG process without the necessity of additional processes.

• Journal of the Korean Wood Science and Technology
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• v.34 no.3
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• pp.22-29
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• 2006

The overlaid panels are important materials in interior and construction with added surface layers (PVC films, decorative paper, decorative veneer). Generally, the adhesive for decorative veneer to wood-based panel is urea-formaldehyde (UF) adhesive which cause the emission of formaldehyde during not only the manufacturing process, but also service life. In this study, environment-friendly SIS-based hotmelt pressure-sensitive adhesive (PSA) was evaluated as a adhesive for bonding a decorative veneer. The various SIS-based hotmelt PSA was blended as a function of diblock content, softening point of tackifier, tackifier content, and applied to bonding the decorative veneer.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Korean Journal of Materials Research
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• v.26 no.7
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• pp.388-392
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• 2016

A cold roll-bonding process was applied to fabricate an AA1050/AA6061/AA1050 laminate complex sheet. Two AA1050 and one AA6061 sheets of 2 mm thickness, 40 mm width and 300 mm length were stacked up after surface treatment that included degreasing and wire brushing; material was then reduced to a thickness of 3 mm by one-pass cold rolling. The laminate sheet bonded by the rolling was further reduced to 1.2 mm in thickness by conventional rolling. The rolling was performed at ambient temperature without lubricant using a 2-high mill with a roll diameter of 210 mm. The rolling speed was 5.0 m/sec. The AA1050/AA6061/AA1050 laminate complex sheet fabricated by roll bonding was then hardened by natural aging T4) and artificial aging (T6) treatments. The microstructures of the as-roll bonded and the age hardened Al complex sheets were revealed by optical microscope observation; the mechanical properties were investigated by tensile testing and hardness testing. The strength of the as-roll bonded complex sheet was found to increase by 2.9 times compared to that value of the starting material. In addition, the hardness of the complex sheets increased with cold rolling for AA1050 and age-hardening treatment for AA6061, respectively. After heat treatment, both AA1050 and AA6061 showed typical recrystallization structures in which the grains were equiaxed; however, the grain size was smaller in AA6061 than in AA1050.