• 대한전자공학회논문지
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• 제13권1호
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• pp.11-15
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• 1976

게이트 전류가 흐르지 않는 MOSFET를 사용한 단안정 멀티바치브레이터는 도전시에도 게이트 전압이 일정하게 유지되지 않기 때문에 이 전압을 기준으로 한 회로해석이나 설계는 매우 어려워서, 비교적 간단히 해결할 수있는 도식방법을 소개하였다. 즉 각FET의 전압이득곡선을 구하고 이 유선의 기본적인 성질과 국로 설계에 이용하는 방법들에 대해서 논하였다. In a MOSFET multivibrator, the gate do not hold into a constant clamp voltage during a conduction period. The analysis of the operation and the 43sign of a MOSFET multivibrator circuit are much more discult than that using a bipolar transistor and a electron tube because of above reason. And therefore, in the designing procedures of the MOSFET monostable multivibrator of this paper, a graphical method is adopted in order to analyze and design easily. The voltage gain curves of the both FETs are drawn using a parameter the voltage Vc across the coupling condenser, and the curves are utilized to investigate the voltages of the drains and the gates and determine the gate bias voltage. The diagram gives also important informations for the design of the multivibrator.

• 대한전자공학회논문지TC
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• 제41권8호
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• pp.79-85
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• 2004

본 논문에서는 고속 데이터 무선인식에 적용 될 2.45㎓ 수동형 RF-ID 시스템을 개발하였다. RF-ID 시스템은 수동형 태그 와 리더로 구성되어 있다. RF-ID 수동형 태그는 제로 바이어스 쇼트키 다이오드를 사용한 정류기, ID 칩, ASK 변조회로 그리고 backscatter 슬롯 안테나로 구성되어있다. 또한, ASK 변조를 위한 스위칭 소자로서 바이폴라 트랜지스터를 이용하여 저전력 소모 변조회로를 구성하였으며 태그의 슬롯 안테나는 일반 패치 안테나보다 광대역 특성을 갖는다. RF-ID 리더는 circulator를 사용하여 단일 마이크로스트립 패치 어레이 안테나를 사용하였으며 종래의 방식에서 채택하는 double-balanced mixer구조를 사용하지 않고 single-balanced mixer구조를 채택함으로서 회로의 복잡성을 개선하고 전체적인 단말기 크기를 소형화 가능하도록 설계하였다. 측정결과 동작주파수는 2.4 GHz이고 출력은 27 dBm (500 mW)에서 감지거리 1 m로 나타났다. 리더에서 측정된 변조신호는 -46.76 dBm이며 주파수는 57.2 kHz이다.

• Journal of Electrical Engineering and Technology
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• 제12권5호
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• pp.1805-1811
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• 2017

Recently, DC systems are considered as efficient electric power systems for renewable energy based clean power generators. This discloses several critical issues that are required to be considered before the installation of the DC systems. First of all, voltage/current switching stress, which is aggravated by large fault current, might damage DC circuit breakers. This problem can be simply solved by applying a superconducting fault current limiter (SFCL) as proposed in this study. It allows a simple use of insulated-gate bipolar transistors (IGBTs) as a DC circuit breaker. To evaluate the proposed resistive type SFCL application to the DC circuit breaker, a DC distribution system is composed of the practical line impedances from the real distribution system in Do-gok area, Korea. Also, to reflect the distributed generation (DG) effects, several DC-to-DC converters are applied. The locations and sizes of the DGs are optimally selected according to the results of previous studies on DG optimization. The performance of the resistive type SFCL applied DC circuit breaker is verified by a time-domain simulation based case study using the power systems computer aided design/electromagnetic transients including DC (PSCAD/ EMTDC(R)).

• 한국시뮬레이션학회논문지
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• 제4권2호
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• pp.41-60
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• 1995

The IGBT(Insulated Gate Bipolar Transistor) is a power semiconductor device that has gained acceptance among circuit design engineers for motor drive and power converter applications. IGBT devices(International Rectifier, Proposed proposed model etc) have the best features of both power MOSFETs and power bipolar transistors, i.e., efficient voltage gate drive requirememts and high current density capability. When designing circuit and systems that utilize IGBTs or other power semiconductor devices, circuit simulations are needed to examine how the devices affect the behavior of the circuit. The interaction of the IGBT with the load circuit can be described using the device model and the state equation of the load circuit. The voltage rise rate at turn-off for inductive loads varies significantly for IGBTs with different base life times, and this rate of rise is important in determing the voltage overshoot for a given series resistor-inductor load circuit. Excessive voltage overshoot is potentially destructive, so a snubber protection circuit may be required. The protection circuit requirements are unique for the IGBT and can be examined using the model. The IGBT model in this paper is verified by comparing the results of the model with experimented results for various circuit operating conditions. The model performs well and describes experimented results accurately for the range of static and dynamic condition in which the device is intended to be operated.

• 한국전기전자재료학회논문지
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• 제29권7호
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• pp.400-403
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• 2016

The resistive memory switching characteristics of resistive random access memory (ReRAM) using the amorphous GeSe thin film have been demonstrated at Al/Ti/GeSe/$n^+$ poly Si structure. This ReRAM indicated bipolar resistive memory switching characteristics. The generation and the recombination of chalcogen cations and anions were suitable to explain the bipolar switching operation. Space charge limited current (SCLC) model and Poole-Frenkel emission is applied to explain the formation of conductive filament in the amorphous GeSe thin film. The results showed characteristics of stable switching and excellent reliability. Through the annealing condition of $400^{\circ}C$, the possibility of low temperature process was established. Very low operation current level (set current: ~ ${\mu}A$, reset current: ~ nA) was showed the possibility of low power consumption. Particularly, $n^+$ poly Si based GeSe ReRAM could be applied directly to thin film transistor (TFT).

• 조명전기설비학회논문지
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• 제19권3호
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• pp.93-98
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• 2005

근거리에서의 무선설비제어, 구내음성통신과 같은 전파통신설비의 송수신 모듈에 실리콘 바이폴라 트랜지스터가 많이 사용되고 있다. 이러한 실리콘 바이폴라 트랜지스터의 내부 전류원에 대한 새로운 모델링 방법이 제시되었다. 제안된 방법은 Si-BJT의 새로운 열 저항 추출방법과 전류원 파라메터에 대한 새로운 해석적인 방정식에 기반을 두고 있다. 이 방법은 기존의 방법에서 채택된 반복적인 최적화 과정 없이 바로 파라메터를 구할 수 있다. 제안된 방법을 5개의 핑거를 가지는 $0.4\times20[{\mu}m^2]$ 의 Si-BJT에 이 방법을 적용시켰으며, 모델링된 데이터는 측정결과를 $3[\%]$ 이내의 오차로 잘 예측하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.385-385
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• 2012

A two terminal N+/P/N+ junction device to replace the conventional selective transistor was studied as a bilateral switching device for spin transfer torque (STT) MRAM based on 3D device simulation. An N+/P/N+ junction structure with $30{\times}30nm$ area requires bi-directional current flow enough to write a data by a drain induced barrier lowering (DIBL) under a reverse bias at N+/P (or P/N+ junction), and high current on/off ratio of 106. The SiGe materials are widely used in hetero-junction bipolar transistors, bipolar compensation metal-oxide semiconductors (BiCMOS) since the band gap of SiGe materials can be controlled by changing the fraction and the strain epilayers, and the drift mobility is increased with the increasing Ge content. In this work, N+/P/N+ SiGe material based junction provides that drive current is increased from 40 to $130{\mu}A$ by increased Ge content from 10~80%. When Ge content is about 20%, the drive current density of SiGe device substantially increased to 2~3 times better than Si-based junction device in case of 28 nm P length, which is sufficient current to operation of STT-MRAM.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권4호
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• pp.443-450
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• 2016

The linearization technique for low noise amplifier (LNA) has been implemented in standard $0.18-{\mu}m$ BiCMOS process. The MOS-BJT derivative superposition (MBDS) technique exploits a parallel LC tank in the emitter of bipolar transistor to reduce the second-order non-linear coefficient ($g_{m2}$) which limits the enhancement of linearity performance. Two feedback capacitances are used in parallel with the base-collector and gate-drain capacitances to adjust the phase of third-order non-linear coefficients of bipolar and MOS transistors to improve the linearity characteristics. The MBDS technique is also employed cascode configuration to further reduce the second-order nonlinear coefficient. The proposed LNA exhibits gain of 9.3 dB and noise figure (NF) of 2.3 dB at 2 GHz. The excellent IIP3 of 20 dBm and low-power power consumption of 5.14 mW at the power supply of 1 V are achieved. The input return loss ($S_{11}$) and output return loss ($S_{22}$) are kept below - 10 dB and -15 dB, respectively. The reverse isolation ($S_{12}$) is better than -50 dB.

• 한국통신학회논문지
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• 제14권3호
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• pp.189-196
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• 1989

본 논문에서는 BICMOS 게이트 어레이 시스템 구성시 내부의 논리회로 부분은 CMOS 소자로 입출력부는 바이폴라 소자를 이용할 수 있는 공정과 소자 개발을 하고자 하였다. BICMOS게이트 어레이 공정은 폴리게이트 p-well CMOS 공정을 기본으로 하였고, 소자설계의 기본개념은 공정흐름을 복잡하지 않게 하면서 바이폴라, CMOS 소자 각각의 특성을 좋게 하는데 두었다. 시험결과로서, npn1 트랜지스터의 hFE 특성은 120(Ic=1mA) 정도이고, CMOS 소자에서는 n-채널과 p-채널이 각각 1.25um, 1.35um 까지는 short channel effect 현상이 나타나지 않았고, 41stage ring oscillator의 게이트당 delay 시간은 0.8ns이었다.

• Transactions on Electrical and Electronic Materials
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• 제2권1호
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• pp.32-38
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• 2001

A new small sized Lateral Trench electrode Insulated Gate Bipolar Transistor(LTEIGBT) was proposed to improve the characteristics of conventional Lateral IGBT (LIGBT) and Lateral Trench gate IGBT (LTIGBT). The entire electrode of LTEIGBT was replace with trench-type electrode. The LTEIGBT was designed so that the width of device was no more than 19 ㎛. The Latch-up current densities of LIGBT, LTIGBT and the proposed LTEIGBT were 120A/㎠, 540A/㎠, and 1230A/㎠, respectively. The enhanced latch-up capability of the LTEIGBT was obtained through holes in the current directly reaching the cathode via the p+ cathode layer underneath n+ cathode layer. The forward blocking voltage of the LTEIGBT is 130V. Conventional LIGBT and LTIGBT of the same size were no more than 60V and 100V, respectively. Because the the proposed device was constructed of trench-type electrodes, the electric field moved toward trench-oxide layer, and punch through breakdown of LTEIGBT is occurred, lately.