• 제목/요약/키워드: barrier height

검색결과 413건 처리시간 0.026초

차세대 비휘발성 메모리에 사용되는 High-k 절연막의 터널링 특성 (Tunneling Properties in High-k Insulators with Engineered Tunnel Barrier for Nonvolatile Memory)

  • 오세만;정명호;박군호;김관수;정홍배;이영희;조원주
    • 한국전기전자재료학회논문지
    • /
    • 제22권6호
    • /
    • pp.466-468
    • /
    • 2009
  • The metal-insulator-silicon (MIS) capacitors with $SiO_2$ and high-k dielectrics ($HfO_2$, $Al_2O_3$) were fabricated, and the current-voltage characteristics were investigated. Especially, an effective barrier height between metal gate and dielectric was extracted by using Fowler-Nordheim (FN) plot and Direct Tunneling (DT) plot of quantum mechanical(QM) modeling. The calculated barrier heights of thermal $SiO_2$, ALD $SiO_2$, $HfO_2$ and $Al_2O_3$ are 3.35 eV, 0.6 eV, 1.75 eV, and 2.65 eV, respectively. Therefore, the performance of non-volatile memory devices can be improved by using engineered tunnel barrier which is considered effective barrier height of high-k materials.

4H-SiC JBS Diode의 전기적 특성 분석 (Electrical Characteristics of 4H-SiC Junction Barrier Schottky Diode)

  • 이영재;조슬기;서지호;민성지;안재인;오종민;구상모;이대석
    • 한국전기전자재료학회논문지
    • /
    • 제31권6호
    • /
    • pp.367-371
    • /
    • 2018
  • 1,200 V class junction barrier schottky (JBS) diodes and schottky barrier diodes (SBD) were simultaneously fabricated on the same 4H-SiC wafer. The resulting diodes were characterized at temperatures from room temperature to 473 K and subsequently compared in terms of their respective I-V characteristics. The parameters deduced from the observed I-V measurements, including ideality factor and series resistance, indicate that, as the temperature increases, the threshold voltage decreases whereas the ideality factor and barrier height increase. As JBS diodes have both Schottky and PN junction structures, the proper depletion layer thickness, $R_{on}$, and electron mobility values must be determined in order to produce diodes with an effective barrier height. The comparison results showed that the JBS diodes exhibit a larger effective barrier height compared to the SBDs.

Aerodynamic parameters selection and windbreak mechanism of wind barrier for high-speed railway bridge

  • Yujing Wang;Weiwei Guo;He Xia;Qinghai Guan;Shaoqin Wang
    • Wind and Structures
    • /
    • 제38권6호
    • /
    • pp.411-425
    • /
    • 2024
  • To investigate the optimal aerodynamic parameters of wind barriers for the T-beam of high-speed railway (HSR) bridge and the wind field of the wind barrier-train-bridge system, the three-component forces of the system and the wind pressure on the vehicle surface were tested and analyzed through the sectional model wind test. The effects of wind velocity, with/without wind barrier, the height of wind barrier, and the air permeability of the wind barrier on the aerodynamic characteristics of the train-bridge system are discussed. Additionally, a CFD numerical model is constructed to evaluate the wind environment of the bridge surface with/without the wind barrier, and the impact of wind barrier on the running safety of vehicles are analyzed. Comprehensively considering the running safety of the train and the wind-resistant stability of the bridge, it is more appropriate to set the wind barrier height H as 3.5 m and the porosity 𝛽 as 30% respectively.

Electron Tunneling and Electrochemical Currents through Interfacial Water Inside an STM Junction

  • Song, Moon-Bong;Jang, Jai-Man;Lee, Chi-Woo
    • Bulletin of the Korean Chemical Society
    • /
    • 제23권1호
    • /
    • pp.71-74
    • /
    • 2002
  • The apparent barrier height for charge transfer through an interfacial water layer between a Pt/Ir tip and a gold surface has been measured using STM technique. The average thickness of the interfacial water layer inside an STM junction was controlled by the amount of moisture. A thin water layer on the surface was formed when relative humidity was in the range of 10 to 80%. In such a case, electron tunneling through the thin water layer became the majority of charge transfers. The value of the barrier height for the electron tunneling was determined to be 0.95 eV from the current vs. distance curve, which was independent of the tip-sample distance. On the other hand, the apparent barrier height for charge transfer showed a dependence on tip-sample distance in the bias range of 0.1-0.5 V at a relative humidity of approximately 96%. The non-exponentiality for current decay under these conditions has been explained in terms of electron tunneling and electrochemical processes. In addition, the plateau current was observed at a large tip-sample distance, which was caused by electrochemical processes and was dependent on the applied voltage.

열처리조건이 두 NASICON 조성의 소결 및 전기적특성에 미치는 영향 (Effects of Heat-treatment Condition on the Characteristics of Sintering and Electrical Behaviors of Two NASICON Compounds)

  • 강희복;조남희;김윤호
    • 한국세라믹학회지
    • /
    • 제34권7호
    • /
    • pp.685-692
    • /
    • 1997
  • Effects of sintering temperature and time on the phase formation, the characteristics of sintering and electrical behaviors of NASICON compounds with Na3Zr2Si2PO12 and Na3.2Zr1.3Si2.2P0.8O10.5 compositions synthesized by solid state reaction were investigated. Maximum relative densities of 96% and 91% were obtained for Na3Zr2Si2PO12 and Na3.2Zr1.3Si2.2P0.8O10.5 compounds, respectively. Complex impedance analysis in a frequency range below 4 MHz was performed to measure the ionic conductivity and migration barrier height of the compounds at RT-30$0^{\circ}C$. The maximum ionic conductivity and the minimum migration barrier height were 0.45 ohm-1cm-1 and 0.07 eV, respectively. The migration barrier height of the high temperature form (space group : R3c) is about 30-40% of that of the low temperature form (space group : C2/c) in two NASICON compounds. Ionic conductivity increases with increasing sinterability, and the presence of glass phase in Na3.2Zr1.3Si2.2P0.8O10.5 compounds lowers significantly ionic conductivity at temperatures above 14$0^{\circ}C$.

  • PDF

중국 사막지역의 방풍책 높이와 공극률에 따른 방풍효과 및 설치비용 비교분석 (Comparative Analysis of Windbreak Effect and Installation Cost of Sand Barrier with Different Height and Porosity on Sand Land in China)

  • 박기형;정국동;방엄령;김찬범;오빈;포암봉;고엄뢰;정성철;문강민
    • 한국환경복원기술학회지
    • /
    • 제15권6호
    • /
    • pp.29-41
    • /
    • 2012
  • This study was conducted in Ningxia Hui autonomous region, located at southern part of Mu Us sand land in China. To investigate relationships between windbreak effect and installation cost of sand barriers, plastic net is utilized by using four kind of heights (0.2, 0.3, 0.4 and 0.5m) and four kind of porosities (20, 30, 50 and 70%). These heights and porosities are measured for estimating distances for effective windbreak. It is shown that porosity and the distance have a positive relationship at same heights and porosity on ground indicates a constant figure when height reaches a certain level, regardless of the porosity. This implies that there is a difference of level of windbreak with different porosities; however, distance of windbreak effect is same at the same height of sand barrier. As a result of comparison between porosity of sand barrier on the ground and installation cost in each sand barrier with various heights and porosities (16 combinations), 0.4m and 0.5m height sand barriers describe highest economical efficiency. Within two variables, we concluded that height has a higher impact on windbreak effect than porosity.

수용성 UV경화성 수지를 이용한 고품질 PDP용 격벽제작 기술 개발 (Development of High-definition PDP(Plasma Display Panel) Barrier Ribs Using Watersoluble UV-curing Resin)

  • 남수용;우진호;이미영;이갑희;김광영
    • 한국인쇄학회지
    • /
    • 제21권2호
    • /
    • pp.67-74
    • /
    • 2003
  • Barrier ribs for PDP(plasma display panel) are commonly utilized to have uniform height and width and to prevent opical crosstalk between adjacent cells. The requirements for such barrier ribs are uniform height and shape, low outgassing rate and low porosity, high aspect ratio, and fine resolution. In this study, we are studied about that to make efficiency of material and high quality barrier ribs for PDP. As a result, could got high barrier ribs of $140{\mu}m$ evenly in 1th phenomenon using watersoluble UV curing resin and know that flatness of upper part is also very good.

  • PDF

Comparison of Electrical Properties between Sputter Deposited Au and Cu Schottky Contacts to n-type Ge

  • Kim, Hogyoung;Kim, Min Kyung;Kim, Yeon Jin
    • 한국재료학회지
    • /
    • 제26권10호
    • /
    • pp.556-560
    • /
    • 2016
  • Using current-voltage (I-V) and capacitance-voltage (C-V) measurements, the electrical properties of Au and Cu Schottky contacts to n-Ge were comparatively investigated. Lower values of barrier height, ideality factor and series resistance were obtained for the Au contact as compared to the Cu contact. The values of capacitance showed strong dependence on the bias voltage and the frequency. The presence of an inversion layer at the interface might reduce the intercept voltage at the voltage axis, lowering the barrier height for C-V measurements, especially at lower frequencies. In addition, a higher interface state density was observed for the Au contact. The generation of sputter deposition-induced defects might occur more severely for the Au contact; these defects affected both the I-V and C-V characteristics.

PtSi-nSi 쇼트키 다이오드에서 이온 주입이 장벽높이의 변화에 미치는 영향 (The Effect of Ion Implantation on the Barrier Height in PtSi-nSi Schottky Diode)

  • 이용재;이문기;김봉렬
    • 대한전자공학회논문지
    • /
    • 제23권5호
    • /
    • pp.712-718
    • /
    • 1986
  • A shallow n+ layer of implanted phosphorus was used to lower the barrier height of PtSinSi schottky diodes. The reduction of barrier height of the forward turn-on voltages from 400mV to 180mV of the forward was followed by implantation of phosphorus at 35KeV with an ion dose of 8.0x10**12 atoms/cm\ulcornerand was activated at 925\ulcorner for 30min in dry O2. The test result showed that, as the ion-implanted dose increased, the forward turn-on voltage and reverse breakdown voltage were linearly decreased, but the saturation current and ideality factor(n) were linearly increased.

  • PDF

Ti/Au, Ti/Pd/Au 쇼트키 접촉의 열처리에 따른 GaAs MESFET의 전기적 특성 (Electrical characteristics of GaAs MESFET according to the heat treatment of Ti/Au and Ti/Pd/Au schottky contacts)

  • 남춘우
    • E2M - 전기 전자와 첨단 소재
    • /
    • 제8권1호
    • /
    • pp.56-63
    • /
    • 1995
  • MESFETs of the Ti/Au and Ti/Pd/Au gate were fabricated on n-type GaAs. Interdiffusion at Schottky interfaces, Schottky contact properties, and MESFET characteristics with heat treatment were investigated. Ti of Ti/Au contact and Pd of Ti/Pd/Au contact acted as a barrier metal against interdiffusion of Au at >$220^{\circ}C$. Pd of Ti/Pd/Au contact acted as a barrier metal even at >$360^{\circ}C$, however, Ti of Ti/Au contact promoted interdiffusion of Au instead of role of barrier metal. As the heat treatment temperature increases, in the case of both contact, saturated drain current and pinch off voltage decreased, open channel resistance increased, and degree of parameter variation in Ti/Au gate was higher than in Ti/Pd/Au gate at >$360^{\circ}C$ Schottky barrier height of Ti/Au and Ti/Pd/Au contacts was 0.69eV and 0.68eV in the as-deposited state, respectively, and Fermi level was pinned in the vicinity of 1/2Eg. As the heat treatment temperature increases, barrier height of Ti/Pd/Au contact increased, however, decreased at >$360^{\circ}C$ in the case of Ti/Au contact. Ideality factor of Ti/Au contact was nearly constant regardless of heat treatment, however, increased at >$360^{\circ}C$ in the case of Ti/Au contact. From the results above, Ti/Pd/Au was stable gate metal than Ti/Au.

  • PDF