• 제목/요약/키워드: band-to-band tunneling (BTBT)

검색결과 8건 처리시간 0.026초

Role of Quantum Confinement Effect on Tunneling Operation of LTFET Devices

  • Najam, Faraz;Yu, Yun Seop
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2017년도 추계학술대회
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    • pp.241-242
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    • 2017
  • Part of the channel in L-shaped tunnel field-effect transistor (LTFET) is very thin and suffers from quantum confinement effect. Role of quantum confinement effect on band-to-band-tunneling (BTBT) of LTFET was investigated using numerical simulation and band diagram analysis. It was found that quantum confinement effect significantly affects the BTBT mechanism of LTFET devices.

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The Optimal Design of Junctionless Transistors with Double-Gate Structure for reducing the Effect of Band-to-Band Tunneling

  • Wu, Meile;Jin, Xiaoshi;Kwon, Hyuck-In;Chuai, Rongyan;Liu, Xi;Lee, Jong-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권3호
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    • pp.245-251
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    • 2013
  • The effect of band-to-band tunneling (BTBT) leads to an obvious increase of the leakage current of junctionless (JL) transistors in the OFF state. In this paper, we propose an effective method to decline the influence of BTBT with the example of n-type double gate (DG) JL metal-oxide-semiconductor field-effect transistors (MOSFETs). The leakage current is restrained by changing the geometrical shape and the physical dimension of the gate of the device. The optimal design of the JL MOSFET is indicated for reducing the effect of BTBT through simulation and analysis.

Gate-Induced-Drain-Leakage (GIDL) Current of MOSFETs with Channel Doping and Width Dependence

  • Choi, Byoung-Seon;Choi, Pyung-Ho;Choi, Byoung-Deog
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.344-345
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    • 2012
  • The Gate-Induced-Drain-Leakage (GIDL) current with channel doping and width dependence are characterized. The GIDL currents are found to increase in MOSFETs with higher channel doping levels and the observed GIDL current is generated by the band-to-band-tunneling (BTBT) of electron through the reverse-biased channel-to-drain p-n junction. A BTBT model is used to fit the measured GIDL currents under different channel-doping levels. Good agreement is obtained between the modeled results and experimental data. The increase of the GIDL current at narrower widths in mainly caused by the stronger gate field at the edge of the shallow trench isolation (STI). As channel width decreases, a larger portion of the GIDL current is generated at the channel-isolation edge. Therefore, the stronger gate field at the channel-isolation edge causes the total unit-width GIDL current to increases for narrow-width devices.

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Compact Current Model of Single-Gate/Double-Gate Tunneling Field-Effect Transistors

  • Yu, Yun Seop;Najam, Faraz
    • Journal of Electrical Engineering and Technology
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    • 제12권5호
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    • pp.2014-2020
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    • 2017
  • A compact current model applicable to both single-gate (SG) and double-gate (DG) tunneling field-effect transistors (TFETs) is presented. The model is based on Kane's band-to-band tunneling (BTBT) model. In this model, the well-known and previously-reported quasi-2-D solution of Poisson's equation is used for the surface potential and length of the tunneling path in the tunneling region. An analytical tunneling current expression is derived from expressions of derivatives of local electric field and surface potential with respect to tunneling direction. The previously reported correction factor with three fitting parameters, compensating for superlinear onset and saturation current with drain voltage, is used. Simulation results of the proposed TFET model are compared with those from a technology computer-aided-design (TCAD) simulator, and good agreement in all operational bias is demonstrated. The proposed SG/DG-TFET model is developed with Verilog-A for circuit simulation. A TFET inverter is simulated with the Verilog-A SG/DG-TFET model in the circuit simulator; the model exhibits typical inverter characteristics, thereby confirming its effectiveness.

Triple-gate Tunnel FETs Encapsulated with an Epitaxial Layer for High Current Drivability

  • Lee, Jang Woo;Choi, Woo Young
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권2호
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    • pp.271-276
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    • 2017
  • The triple-gate tunnel FETs encapsulated with an epitaxial layer (EL TFETs) is proposed to lower the subthreshold swing of the TFETs. Furthermore, the band-to-band tunneling based on the maximum electric-field can occur thanks to the epitaxial layer wrapping the Si fin. The performance and mechanism of the EL TFETs are compared with the previously proposed TFET based on simulation.

Negative Differential Resistance Devices with Ultra-High Peak-to-Valley Current Ratio and Its Multiple Switching Characteristics

  • Shin, Sunhae;Kang, In Man;Kim, Kyung Rok
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권6호
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    • pp.546-550
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    • 2013
  • We propose a novel negative differential resistance (NDR) device with ultra-high peak-to-valley current ratio (PVCR) by combining pn junction diode with depletion mode nanowire (NW) transistor, which suppress the valley current with transistor off-leakage level. Band-to-band tunneling (BTBT) Esaki diode with degenerately doped pn junction can provide multiple switching behavior having multi-peak and valley currents. These multiple NDR characteristics can be controlled by doping concentration of tunnel diode and threshold voltage of NW transistor. By designing our NDR device, PVCR can be over $10^4$ at low operation voltage of 0.5 V in a single peak and valley current.

Rigorous Design of 22-nm Node 4-Terminal SOI FinFETs for Reliable Low Standby Power Operation with Semi-empirical Parameters

  • Cho, Seong-Jae;O'uchi, Shinichi;Endo, Kazuhiko;Kim, Sang-Wan;Son, Young-Hwan;Kang, In-Man;Masahara, Meishoku;Harris, James S.Jr;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제10권4호
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    • pp.265-275
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    • 2010
  • In this work, reliable methodology for device design is presented. Based on this method, the underlap length has been optimized for minimizing the gateinduced drain leakage (GIDL) in a 22-nm node 4-terminal (4-T) silicon-on-insulator (SOI) fin-shaped field effect transistor (FinFET) by TCAD simulation. In order to examine the effects of underlap length on GIDL more realistically, doping profile of the source and drain (S/D) junctions, carrier lifetimes, and the parameters for a band-to-band tunneling (BTBT) model have been experimentally extracted from the devices of 90-nm channel length as well as pnjunction test element groups (TEGs). It was confirmed that the underlap length should be near 15 nm to suppress GIDL effectively for reliable low standby power (LSTP) operation.

InGaAs-based Tunneling Field-effect Transistor with Stacked Dual-metal Gate with PNPN Structure for High Performance

  • Kwon, Ra Hee;Lee, Sang Hyuk;Yoon, Young Jun;Seo, Jae Hwa;Jang, Young In;Cho, Min Su;Kim, Bo Gyeong;Lee, Jung-Hee;Kang, In Man
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권2호
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    • pp.230-238
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    • 2017
  • We have proposed an InGaAs-based gate-all-around (GAA) tunneling field-effect transistor (TFET) with a stacked dual-metal gate (DMG). The electrical performances of the proposed TFET are evaluated through technology computer-aided design (TCAD) simulations. The simulation results show that the proposed TFET demonstrates improved DC performances including high on-state current ($I_{on}$) and steep subthreshold swing (S), in comparison with a single-metal gate (SMG) TFET with higher gate metal workfunction, as it has a thinner source-channel tunneling barrier width by low workfunction of source-side channel gate. The effects of the gate workfunction on $I_{on}$, the off-state current ($I_{off}$), and S in the DMG-TFETs are examined. The DMG-TFETs with PNPN structure demonstrate outstanding DC performances and RF characteristics with a higher n-type doping concentration in the $In_{0.8}Ga_{0.2}As$ source-side channel region.