• 제목/요약/키워드: aluminum, copper

검색결과 389건 처리시간 0.028초

Electroluminescent Properties of Organic Light-emitting Diodes with Hole-injection Layer of CuPc

  • Lee, Jung-Bok;Lee, Won-Jae;Kim, Tae-Wan
    • Transactions on Electrical and Electronic Materials
    • /
    • 제15권1호
    • /
    • pp.41-44
    • /
    • 2014
  • Emission properties of the organic light-emitting diodes were investigated with the use of a hole-injection layer of copper(II)-phthalocyanine (CuPc). The manufactured device structure is indium-tin-oxide (ITO) (180 nm)/CuPc (0~50 nm)/N,N'-Bis(3-methylphenyl)-N,N'-diphenylbenzidine (TPD) (40 nm)/tris-(8-hydroxyquinoline) aluminum (III) ($Alq_3$) (60 nm)/Al(100 nm). We investigated the luminescence properties of $Alq_3$ which is affected by the CuPc hole-injection layer. Also, we studied the influence of light-emission properties in the structure of an ITO/CuPc/TPD/$Alq_3$/Al device depending on the several thicknesses of CuPc (0~50 nm) layer. As a result, it was found that the hole injection occurs smoothly in the device with 20 nm thick CuPc layer, and the properties become significantly worse in the device with a CuPc layer thickness higher than 40 nm. We studied the topography and external quantum efficiency depending on the layer thickness of CuPc. Also, we analyzed the electroluminescent characteristics in the low and high-voltage range.

Contact resistance characteristics of 2G HTS coils with metal insulation

  • Sohn, M.H.;Ha, H.;Kim, S.K.
    • 한국초전도ㆍ저온공학회논문지
    • /
    • 제20권4호
    • /
    • pp.26-30
    • /
    • 2018
  • The turn-to-turn contact resistance of 2G high temperature superconducting (HTS) coils with metal insulation (MI) is closely related to the stability of the coils, current charging rate and delay time [1]. MI coils were fabricated using five kinds of metal tapes such as aluminum (Al) tape, brass tape, stainless steel (SS) tape, copper (Cu)-plated tape and one-sided Cu-plated SS tape. The turn-to-turn contact surface resistances of co-winding model coils using Al tape, brass tape, and SS tape were 342.6, 343.6 and $724.8{\mu}{\Omega}{\cdot}cm^2$, respectively. The turn-to-turn contact resistance of the model coil using the one-sided Cu-plated SS tape was $ 248.8{\mu}{\Omega}{\cdot}cm^2$, which was lower than that of Al and brass tape. Al or brass tape can be used to reduce contact resistance and improve the stability of the coil. Considering strength, SS tape is recommended. For strength and low contact resistance, SS tape with copper plating on one side can be used.

Study on Reusable Electrodes for Personal Electrocardiography

  • Kim, Jonghoon;Yoon, Gilwon
    • 센서학회지
    • /
    • 제27권5호
    • /
    • pp.340-344
    • /
    • 2018
  • Electrodes are an important part of electrocardiography (ECG); disposable electrodes have been extensively used. However, personal ECG monitoring devices for Internet of Things applications require reusable electrodes. As there have been no systematic studies on the characteristics of reusable electrodes to date, we conducted this study to assess the performance and feasibility of electrodes with different materials. We built reusable electrodes using twelve different metallic materials, including commonly used copper, silver, zinc, plating materials, chemically inert titanium, stainless steel, and aluminum. Each electrode was fabricated to a size of $5{\times}10mm$. Their characteristics such as offset, baseline drift, stabilization time, and chemical inertness were compared. A personal ECG monitoring system was used to test the manufactured electrodes. The performances of the Ag, Cu, and Zn electrodes were better than the performances of other electrodes. However, these materials may not be used owing to the chemical changes that occur when the electrodes are in contact with the skin, such as discoloration and corrosion, which deteriorate their electrical characteristics. Titanium, stainless steel, and aluminum are chemically stable. The titanium electrode showed the best performance among the three, and it is our recommendation as a material for manufacturing reusable electrodes.

Al 합금의 반응성 이온 식각후 표면 특성 연구 (A Study on the Surface Properties of Al Alloys after Reactive Ion Etching)

  • 김창일;권광호
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 1995년도 추계학술대회 논문집 학회본부
    • /
    • pp.338-341
    • /
    • 1995
  • The surface properties after plasma etching of Al(Si, Cu) solutions using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched Al(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxized (partially chlorinated) states, copper shows Cu metallic states and Cu-Clx(x$CuCl_x$ (x$CuCl_x$ (1

  • PDF

유기 발광 소자에서 정공 주입 버퍼층의 효과 (Effects of Hole-Injection Buffer Layer in Organic Light-Emitting Diodes)

  • 정동희;김상걸;오현석;홍진웅;이준웅;김영식;김태완
    • 한국전기전자재료학회논문지
    • /
    • 제16권9호
    • /
    • pp.816-825
    • /
    • 2003
  • Current-voltage-luminance characteristics of organic light-emitting diodes (OLEDs) were measured in the temperature range of 10 K~300 K. Indium-tin-oxide (ITO) was used as an anode and aluminum as a cathode in the device. Organic of N,N'-diphenyl-N,N'-di(m-tolyl)-benzidine (TPD) was used for a hole transporting material, and tris (8-hydroxyquinolinato) aluminum (Alq$_3$) for an electron transporting material and emissive material. And copper phthalocyanine (CuPc), poly(3,4-ethylenedi oxythiophene);poly(styrenesulfonate) (PEDOT:PSS), and poly(N-vinylcarbazole) (PVK) were used for hole-injection buffer layers. From tile analysis of electroluminescence (EL) and photoluminesccnce (PL) spectra of the Alq$_3$, the EL spectrum is more greenish then that of PL. And the temperature-dependent current-voltage characteristics were analyzed in the double and multilayer structure of OLEDS. Electrical conduction mechanism was explained in the region of high-electric and low-electric field. Temperature-dependent luminous efficiency and operating voltage were analyzed from the current-voltage- luminance characteristics of the OLEDS.

Characterization of Anodized Al 1050 with Electrochemically Deposited Cu, Ni and Cu/Ni and Their Behavior in a Model Corrosive Medium

  • Girginov, Christian;Kozhukharov, Stephan;Tsanev, Alexander;Dishliev, Angel
    • Journal of Electrochemical Science and Technology
    • /
    • 제12권2호
    • /
    • pp.188-203
    • /
    • 2021
  • The specific benefits of the modified films formed on preliminary anodized aluminum, including the versatility of their potential applications impose the need for evaluation of the exploitation reliability of these films. In this aspect, the durability of Cu and Ni modified anodized aluminum oxide (AAO) films on the low-doped AA1050 alloy was assessed through extended exposure to a 3.5% NaCl model corrosive medium. The electrochemical measurements by means of electrochemical impedance spectroscopy (EIS) and potentiodynamic scanning (PDS) after 24 and 720 hours of exposure have revealed that the obtained films do not change their obvious barrier properties. In addition, supplemental analyses of the coatings were performed, in order to elucidate the impact of the AC-deposition of Cu and Ni inside the pores. The scanning electron microscopy (SEM) images have shown that the surface topology is not affected and resembles the typical surface of an etched metal. The subsequent energy dispersive X-ray spectroscopy (EDX) tests have revealed a predominance of Cu in the combined AAO-Cu/Ni layers, whereas additional X-ray photoelectron (XPS) analyses showed that both metals form oxides with different oxidation states due to alterations in the deposition conditions, promoted by the application of AC-polarization of the samples.

전자파차폐 및 방열 기능을 가지는 하이브리드시트 성능측정 (Performance Measurement of The Hybrid Sheet with Dual Function of Electromagnetic-Shielding and Heat-Dissipating)

  • 안성수
    • 한국산학기술학회논문지
    • /
    • 제22권5호
    • /
    • pp.530-536
    • /
    • 2021
  • 본 논문에서는 전자기기 등에서 전자파 차폐 및 방열소재로 많이 채택되는 동 메쉬 시트와 천연그라파이트 시트를 감압 접착제없이 합지시켜 개발된 차폐 및 방열의 기능을 동시에 가지는 하이브리드시트의 성능 측정결과를 제시하였다. 객관적인 방열 성능을 확인하기 위해 2개의 다른 제품들과 수직 및 수평 열전도도를 각각 측정하여 결과를 비교하였으며, 전자파 차폐 성능은 CISPR 11규격에 따른 복사방출시험을 3m 전자파 무향실에서 진행하여 확인하였다. 수직 열전도도의 경우 제안된 하이브리드 시트가 방열코팅이 된 알루미늄 시트 대비 약 8.63배, 감압 접착제로 인조 그라파이트를 합지시킨 구리 시트에 비해 18.7배 높은 수준이였으며, 수평 열전도도는 인조 그라파이트를 합지시킨 구리 시트에 비해 약 0.64배, 방열 코팅된 알루미늄 시트에 대해서는 약 1.76배로 나타났다. 동일한 열원에서 각 시트들을 적용 후 측정한 결과에서는 제안된 하이브리드 시트가 열방출 기능이 가장 우수하였고 복사방출시험에서는 방사노이즈들이 상당 부분 제거되는 결과를 얻었다.

Different Sources and Levels of Copper Supplementation on Performance and Nutrient Utilization of Castrated Black Bengal (Capra hircus) Kids Diet

  • Mondal, M.K.;Biswas, P.
    • Asian-Australasian Journal of Animal Sciences
    • /
    • 제20권7호
    • /
    • pp.1067-1075
    • /
    • 2007
  • Twenty eight 3-4 month old castrated Black Bengal kids (Capra hircus) were used to determine the effects of source and level of dietary copper (Cu) concentration on their performance and nutrient utilization. Cu was supplemented (0, 10, 20 and 30 mg/kg diet DM) as copper sulfate ($CuSO_4$, $5H_2O$) or copper proteinate (Cu-P). Kids were fed a basal diet containing maize (19.5%), soybean (17.0%), deoiled rice bran (56.5%), molasses (4.0%), di-calcium phosphate and salt (1.0% each) and mineral and vitamin mixture (0.5% each) supplements at 3.5% of body weight to meet NRC (1981) requirements for protein, energy, macro minerals and micro minerals, excluding Cu. The basal diet contained 5.7 mg Cu/kg, 122.5 mg Fe/kg, 110 mg Zn/kg, 0.26 mg Mo/kg and 0.32% S. $CuSO_4$ or Cu-P was added to the basal diet at the rate of 10, 20 and 30 mg/kg. Kids were housed in a well ventilated shed with facilities for individual feeding in aluminum plated metabolic cages. Blood samples were collected from the jugular vein on d 0, 30, 60 and 90 to determine hemoglobin (Hb), packed cell volume (PCV), total erythrocyte count (TEC), total leukocyte count (TLC) and serum enzymes (alkaline phosphatase, alanine transferase and aspertate transferase). A metabolism trial of 6 days duration was conducted after 90 days of experimental feeding. Statistical analysis revealed that source and level of Cu supplementation improved live weight gain (p<0.04) and average daily gain (p<0.01). No significant contribution of source and level of Cu to alter serum serum enzymes was evident. Goats fed Cu-P tended to have higher Hb, PCV and TEC than with $CuSO_4$ supplementation. Cu-P increased digestibility of ether extract (EE, p<0.02) and crude fiber (p<0.05) and showed an increasing trend (p<0.09) for digested crude protein (CP) and crude fiber (CF). Supplemental dose of Cu linearly improved (p<0.02) digestibilities of dry matter (DM), organic matter (OM), EE and nitrogen free extract (NFE). Though the absorption of nitrogen (N) was not affected (p>0.10) by both source and dose of Cu, N retention was affected (p<0.04) and there was a significant $Source{\times}Dose$ interaction (p<0.05). Final body weight (BW) was not influenced (p>0.10) by the source of Cu but increasing dose of Cu increased (p<0.04) the BW of kids. TDN intake (g/kg $W^{0.75}$) was higher (p<0.05) with the increased dose of Cu and there was a significant $Source{\times}Dose$ interaction. It was concluded that supplementation of Cu from different sources and varying dose level in a concentrate based diet may improve performance, nutrient utilization and plane of nutrition in castrated Black Bengal kids. The effects on performance and nutrient utilization are more pronounced with Cu-P than $CuSO_4$ supplementation. Higher dose of Cu showed better result than lower dose.

전해생성(電解生成)된 염소(鹽素)에 의한 폐인쇄회로기판(廢印刷會路基板)으로부터 동(銅)의 침출(浸出) (Leaching of Copper from Waste Printed Circuit Boards Using Electro-generated Chlorine in Hydrochloric Acid)

  • 김민석;이재천;정진기;김병수;김은영
    • 자원리싸이클링
    • /
    • 제14권5호
    • /
    • pp.45-53
    • /
    • 2005
  • 염산용액에서 전해생성 된 염소를 이용하여 폐프린터의 인쇄회로기판으로부터 동을 침출하는 연구를 수행하였다. 폐인쇄회로기판을 분쇄한 다음 입자크기가 $0.6{\sim}1.2mm$인 비자성 성분을 선별하여 침출실험을 행하였다. 비자성 분쇄물 중 금속성분의 평균함량은 45wt%이었으며, 동이 금속성분의 83.6wt% 이었다. 1 M 염산용액에서 전해생성된 염소에 의한 동의 침출반응은 전류밀도와 교반속도에 크게 영향을 받았다. 염산농도: 1 M, 전류밀도: $20mA/cm^2$, 침출온도: $50^{\circ}C$, 침출시간: 180분, 교반속도: 600rpm의 침출조건에서 동의 침출율은 98%로서 침출액에서 농도는 3.69g/l 해당하였다. 동의 침출반응에 대한 전해생성 된 염소의 이용율은 교반속도가 높고 인가전류밀도가 낮을 수록 높았다. 또한 침출반응 초기에는 알루미늄, 납, 주석 등의 기타금속 성분의 침출이 활발하고 동의 침출반응은 억제되었다.

Water Gas Shift 반응을 위한 Cu/ZnO/Al2O3 촉매에서 Al 전구체 투입시간에 따른 촉매 특성 연구 (Effect of Al Precursor Addition Time on Catalytic Characteristic of Cu/ZnO/Al2O3 Catalyst for Water Gas Shift Reaction)

  • 백정훈;정정민;박지혜;이광복;이영우
    • 한국수소및신에너지학회논문집
    • /
    • 제26권5호
    • /
    • pp.423-430
    • /
    • 2015
  • $Cu/ZnO/Al_2O_3$ catalysts for water gas shift (WGS) reaction were synthesized by co-precipitation method with the fixed molar ratio of Cu/Zn/Al precursors as 45/45/10. Copper and zinc precursor were added into sodium carbonate solution for precipitation and aged for 24h. During the aging period, aluminum precursor was added into the aging solution with different time gap from the precipitation starting point: 6h, 12h, and 18h. The resulting catalysts were characterized with SEM, XRD, BET surface measurement, $N_2O$ chemisorption, TPR, and $NH_3$-TPD analysis. The catalytic activity tests were carried out at a GHSV of $27,986h^{-1}$ and a temperature range of 200 to $400^{\circ}C$. The catalyst morphology and crystalline structures were not affected by aluminum precursor addition time. The Cu dispersion degree, surface area, and pore diameter depended on the aging time of Cu-Zn precipitate without the presence of $Al_2O_3$ precursor. Also, the interaction between the active substance and $Al_2O_3$ became more stronger as aging duration, with Al precursor presented in the solution, increased. Therefore, it was confirmed that aluminum precursor addition time affected the catalytic characteristics and their catalytic activities.