Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1995.11a
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- Pages.338-341
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- 1995
A Study on the Surface Properties of Al Alloys after Reactive Ion Etching
Al 합금의 반응성 이온 식각후 표면 특성 연구
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Kim, Chang-Il
(Dept. of Electrical Eng., Anyang Univ.)
;
- Kwon, Kwang-Ho (Dept. of Electronics Eng., Hanseo Univ.) ;
- Park, Hyung-Ho (Dept. of Ceramic Eng., Yonsei Univ.)
- Published : 1995.11.18
Abstract
The surface properties after plasma etching of Al(Si, Cu) solutions using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched Al(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxized (partially chlorinated) states, copper shows Cu metallic states and Cu-Clx(x
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