Leaching of Copper from Waste Printed Circuit Boards Using Electro-generated Chlorine in Hydrochloric Acid

전해생성(電解生成)된 염소(鹽素)에 의한 폐인쇄회로기판(廢印刷會路基板)으로부터 동(銅)의 침출(浸出)

  • Kim, Min-Seuk (Korea Institute of Geoscience and Mineral Resources, Minerals & Materials Processing Division) ;
  • Lee, Jae-Chun (Korea Institute of Geoscience and Mineral Resources, Minerals & Materials Processing Division) ;
  • Jeong, Jin-Ki (Korea Institute of Geoscience and Mineral Resources, Minerals & Materials Processing Division) ;
  • Kim, Byung-Su (Korea Institute of Geoscience and Mineral Resources, Minerals & Materials Processing Division) ;
  • Kim, Eun-Young (University of Science & Technology)
  • 김민석 (한국지질자원연구원, 자원활용소재연구부) ;
  • 이재천 (한국지질자원연구원, 자원활용소재연구부) ;
  • 정진기 (한국지질자원연구원, 자원활용소재연구부) ;
  • 김병수 (한국지질자원연구원, 자원활용소재연구부) ;
  • 김은영 (과학기술연합대학원대학교)
  • Published : 2005.10.30

Abstract

Electro-generated chlorine leaching of waste printed circuit boards was investigated in hydrochloric acid solutions. Non-magnetic component of $0.6{\sim}1.2mm$ was prepared by grinding, magnetic separation, and sieving. The non-magnetic component of pulverized printed circuit board contained about 45% of metal component, in which copper was about 83.6%. The leaching rate of copper was greatly affected by current density and agitation speed. The leaching of copper up to 98% was achieved at $20mA/cm^2$, $50^{\circ}C$, 180 minutes, and 600 rpm in 1M HCl solutions. Increasing agitation and lowering current density enhanced utilization efficiency of electro-generated chlorine. Leaching of copper was suppressed at the initial stage, while the minor metal elements, such as aluminum, lead, and tin, were dominantly leached out.

염산용액에서 전해생성 된 염소를 이용하여 폐프린터의 인쇄회로기판으로부터 동을 침출하는 연구를 수행하였다. 폐인쇄회로기판을 분쇄한 다음 입자크기가 $0.6{\sim}1.2mm$인 비자성 성분을 선별하여 침출실험을 행하였다. 비자성 분쇄물 중 금속성분의 평균함량은 45wt%이었으며, 동이 금속성분의 83.6wt% 이었다. 1 M 염산용액에서 전해생성된 염소에 의한 동의 침출반응은 전류밀도와 교반속도에 크게 영향을 받았다. 염산농도: 1 M, 전류밀도: $20mA/cm^2$, 침출온도: $50^{\circ}C$, 침출시간: 180분, 교반속도: 600rpm의 침출조건에서 동의 침출율은 98%로서 침출액에서 농도는 3.69g/l 해당하였다. 동의 침출반응에 대한 전해생성 된 염소의 이용율은 교반속도가 높고 인가전류밀도가 낮을 수록 높았다. 또한 침출반응 초기에는 알루미늄, 납, 주석 등의 기타금속 성분의 침출이 활발하고 동의 침출반응은 억제되었다.

Keywords

References

  1. Brodersen, K., et al., 1992: 'Scrap of Electronics; Hazardous Waste or Raw Material Resources', Proc. of Intern. Conf. on the Recycling of Metals, MIS of ASM, pp. 45-51, The European Council of ASM Intern. and its Technical Committee, Dusseldorf/aeuss-Germany, 13-15 May 1992, Printed in Belgium
  2. 이재천, 2004: '전자제품 재활용', 리싸이클링백서, 산업 폐기물재활용기술개발산업단, 한국자원리싸이클링학회, pp. 546-578, 청문각, 서울, 한국
  3. 강홍윤, 2004: '국내의 자원순환시스템 현황 및 개선방안', KNCPC 2004 RE-4 연구보고서, 국가청정생산지원센터 편, pp. 82-105, 서울, 한국
  4. Sun, Elaine Y.L., 1991: 'The Recovery of Metals from Electronic Scrap', JOM, 43(4), pp. 53-61 https://doi.org/10.1007/BF03220549
  5. Setchfield, J.H., 1987: 'Electronic Scrap Treatment at Engelhard', Precious Metals 1987, ed. Vermeylen, G and Verbeeck, R., IPMI, pp. 147-164, Allentown, PA, USA
  6. Hedlund, L. and Johansson, L., 1985: 'Recent Developments in the Boliden Lead Kaldo Plant', Recycle and Secondary Recovery of Metals, Taylor, P.R., Sohn, H., and Jarrett, N., TMS, pp. 787-796, Warrendale, PA, USA
  7. Kaltenboeck, J., et al., 1985: Metal(Berlin), 39(11), pp. 1047-1048
  8. Edson, G., 1981: 'Recovery of Precious Metals from Electronic Scrap', Recovering and Refining of Precious Metals, IPMI, Paper 10, Skytop, PA, USA
  9. Dunning, Jr., B.W., 1986: 'Precious Metals Recovery from Electronic Scrap and Solder used in Electronics Manufacture', Precious Metals Recovery Low Grade Resources, IC 9059, U.S. Bureau of Mines, pp. 44-56, Washington, D.C., USA
  10. Day, J.G., 1984: U.S. patent 4,427,442
  11. Koyama, K., Tanalca, M., and Lee, J-C., 2003: 'Copper Recovery from Waste Printed Circuit Board', Hydrometallurgy 2003 - Proceedings of the Fifth International Symposium Honoring of Professor Ian M. Ritchie, Vol. 2: Electrometallurgy and Environmental Hydrornetallun Young, CA, et al., pp. 1555-1563, TMS/SME/CIM, August 24-27, 2003, Vancouver BC, Canada
  12. Kobayashi, M., 2000: 'Current Research Projects for the Development of Hydrometallurgical Process to Refine Chalcopyrite', Shigen-to-Sozai, 116, pp. 1-6 https://doi.org/10.2473/shigentosozai.116.1
  13. Hamalainen, M., Hyvarinen, O., and Jyrala, M., 2003: 'SOLUTION PURIFICATION IN THE OUTOKUMPU HYDROCOPPER$^{TM}$ PROCESS', Hydrometallurgy 2003- Proceedings of the Fifth International Symposium Honoring of Professor Ian M. Ritchie, Vol. 1, Young, C.A., et al., pp.545-553, TMS/SME/CIM, August 24-27, 2003, Vancover BC, Canada
  14. Bard, A.J., Parsons, P., and Jordan, J., 1985: 'Standa Potentials in Aqueous Solution', Marcel Dekker, INC., New York, USA, pp. 287-294
  15. Alex, P., Mukherjee, T.K., and Sundaresan, M., 1993: 'Leaching behavior of nickel in aqueous chlorine solutions and its application in the recovery of nickel from a spent catalyst', Hydrometallurgy, Vol. 34, pp. 239-253 https://doi.org/10.1016/0304-386X(93)90038-F
  16. Derek Pletcher, 1982: 'The Chlor-alkali Industry, Industrial Electrochemistry', Chapman and Hall, London, UK, pp. 88-113