• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2001년도 추계학술대회(제116회) 및 13회 Workshop 제3회 한ㆍ일 치과보존학회 공동학술대회 초록집
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• pp.560.1-560
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• 2001

To evaluate the micro-shear bond strength of current adhesive systems to cervical and mid-coronal enamel. Materials and Two commercially available resin adhesives were investigated; a self-etching primer system(Clearfil SE Bond, Kyraray) and a one-bottle adhesive system(Single Bond, 3M) intended for use with the total-etch wet-bonding technique were employed. Two regions of enamel, cervical and mid-coronal regions, were chosen from the buccal surface of extracted molars and were then bonded with each adhesive system and submitted to the micro-shear bond test.(중략)

• 한국전기전자재료학회논문지
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• 제18권11호
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• pp.1014-1018
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• 2005

The purpose of this study is to obtain strong bond strength at the interface between piezoelectric substrates and semiconductor thin films to be applied for the manufacture of high-performance acoustic wave semiconductor coupled device. For this purpose, we have compared and examined the effects of different surface treatment methods on hydrophile properties at the surface of the piezoelectric substrates. Moreover, we have observed the effect of microwave and laser on the elimination of water molecules at the interface. As for the piezoelectric substrates, dry method for surface treatment was found to be superior in the control of hydrophilicity of the surface compared to wet method. On the other hand, both microwave and laser were found to be effective in the elimination of water molecules in the interface.

• 한국산림과학회지
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• 제57권1호
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• pp.32-38
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• 1982

본연구(本硏究)는 합판제조시(合板製造時) 증량제(增量劑)로 이용(利用)되고 있는 소맥분(小麥粉)을 토란(土卵)으로 대체(代替)하기 위한 가능성(可能性)을 규명(糾明)하기 위해 실시(實施)되었다. 토란(土卵)과 소맥분(小麥粉)은 건조기내(乾燥器內)에서 전건상태(全乾狀態)로 건조(乾燥)시킨 후(後) 실험용(實驗用) 분쇄기(粉碎機)로 80~100 mesh로 분말화(粉末化)하여 증량제(增量劑)로 사용(使用)하였다. 합판제조(合板製造)에는 요소(尿素) 및 석탄산수지(石炭酸樹脂)를 사용(使用)하였으며 각수지(各樹脂)에 증량재료(增量材料)를 10, 20, 30, 50%의 비율(比率)로 혼합(混合)하여 시험(試驗)을 실시(實施)하였다. 본연구(本硏究)에서 얻어진 결론(結論)은 다음과 같이 요약(要約)할 수 있다. 1) 요소수지(尿素樹脂)의 상태(常態) 및 내수접착력(耐水接着力)은 모든 증량비율(增量比率)에서 토란(土卵)이 소맥분(小麥粉)을 훨씬 능가(能加)하고 있었다. 따라서 토란(土卵)은 소맥분(小麥粉)을 대체(代替)할 수 있는 가능성(可能性)을 보였다. 2) 석탄산수지(石炭酸樹脂)의 상태(常態) 및 내수접착력(耐水接着力)은 일반적(一般的)으로 소맥분(小麥粉)이 토란(土卵)보다 높은 접착력(接着力)을 나타내었다. 그러나 상태접착력(常態接着力)의 경우 30%와 50%의 증량(增量)에서는 토란(土卵)이 소맥분(小麥粉)보다 좋은 접착력(接着力)을 보였다.

• 한국펄프종이공학회:학술대회논문집
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• 한국펄프종이공학회 1999년도 Pre-symposium of the 10th ISWPC Recent Advances in Paper Science and Technology
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• pp.276-281
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• 1999

The surfaces of sheets added with N-chloro-polyacrylamide (N-Cl-PAM) are analyzed using X-ray photoelectron spectroscopy (XPS) to clarify the chemical bonding involved in the paper strength development induced by N-Cl-PAM. The comparison of the observed N1s chemical shift of the sheet with those of the paper strength additives and the model compound, 1-butyryl-3-propyl urea, illustrated the presence of covalent bonds of alkyl acyl urea and urethane on the fiber surfaces. Thus the formation of the covalent bonds by N-Cl-PAM themselves and by N-Cl-PAM with cellulose and hemicellulose may be an explanation for much higher effectiveness of N-Cl-PAM on the improvement of wet strength of paper than A-PAM.

• 한국표면공학회지
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• 제33권2호
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• pp.101-106
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• 2000

SOI (Silicon-On-Insulator) substrates were fabricated with varying annealing temperature of $25-660^{\circ}C$ by a linear annealing method, which was modified RTA process using a linear shape heat source. The annealing method was applied to Si ∥ $SiO_2$/Si pair pre-contacted at room temperature after wet cleaning process. The bonding strength of SOI substrates was measured by two methods of Razor-blade crack opening and direct tensile test. The fractured surfaces after direct tensile test were also investigated by the optical microscope as well as $\alpha$-STEP gauge. The interface bonding energy was 1140mJ/m$^2$ at the annealing temperature of $430^{\circ}C$. The fracture strength was about 21MPa at the temperature of $430^{\circ}C$. These mechanical properties were not reported with the conventional furnace annealing or rapid thermal annealing method at the temperature below $500^{\circ}C$. Our results imply that the bonded wafer pair could endure CMP (Chemo-Mechanical Polishing) or Lapping process without debonding, fracture or dopant redistribution.

• 한국의류산업학회지
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• 제16권2호
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• pp.319-325
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• 2014

This article describes a method for producing chitosan non-woven fabrics by just hot pressing without the use of a binder. A study has been made of the wet spinning of chitosan fiber. The fibers were rinsed thoroughly in running water and chopped wet into staples of with a length of approximately 5-10 mm. The chopped chitosan staples were dispersed uniformly in water and fabricated using a non-woven making machine. This study examined the formation and the characteristics of chitosan non-woven fabrics manufactured by hot pressing without the use of a binder. The effects of the non-woven fabrication conditions on the thermal, morphological, structural, and physical properties of chitosan non-woven fabric with and without water as a plasticizer were studied. The temperature of the exothermic peak, decomposition of chitosan fibers increased with increasing heating rate. Water in the chitosan fiber effectively plasticized the chitosan fiber. The thermal bonded structure of the wet chitosan fiber with water as a plasticizer was clearly found in many parts of the non-woven fabric at a fabrication temperature of $200^{\circ}C$. The intensity and profile of the (100) plane($2{\theta}=10.2^{\circ}$) and (040) plane($2{\theta}=20.9^{\circ}$) in the chitosan non-woven fabric decreases and became smooth in the non-woven fabric formation by melting.

• Restorative Dentistry and Endodontics
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• 제28권3호
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• pp.203-208
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• 2003

The purpose of this study was to evaluate the effect of salivary contamination of teeth on bonding efficacy of self-priming and self-etching DBSs. The materials used were Single Bond(SB, self-priming system, 3M), Unifil Bond(UB, self-etching system, GC), and Scotchbond Multi-Purpose Plus(SM, 3M) as control. Forty five human molars randomly allocated to three groups as dentin bonding systems tested and embedded in epoxy resin. Then the specimens were wet-ground to expose flat buccal enamel surface or flat occlusal dentin surface and cut bucco-lingually to form two halves with slow speed diamond saw. One of them was used under non-contamination, other under contamination with saliva. The bonding procedure was according to the manufacturer's directions and resin composite(Z-100, 3M Dental Products, St. Paul, MN) was built-up on the bonded surface 5mm high. The specimens were ground carefully at the enamel-composite interface with fine finishing round diamond bur to create an hour-glass shape yielding bonded surface areas of $1.5{\pm}0.1\textrm{mm}^2$. The specimens were bonded to the modified microtensile testing apparatus with cyanoacrylate, attached to the universal testing machine and stressed in tension at a CHS of 1mm/min. The tensile force at failure was recorded and converted to a tensile stress(MPa). Mean values and standard deviations of the bond strength are listed in table. One-way ANOVA was used to determine significant difference at the 95% level. The bond strength of SBMP and SB were not affected by salivary contamination, but that of UB was significantly affected by salivary contamination. These results indicate that DBSs with total etch technique seems less likely affected by salivary contamination in bonding procedure.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2001년도 학술논문발표회
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• pp.22-27
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• 2001

The purpose of this study is development of dry floor tile method that practically used for improving wet method's defect, with resin mat design. PE resin used mat which satisfied with bonding test, waterproof test, resistance to chemical attack test, resistance to impact test and freezing and thawing test is confirmed the basic property.

• Restorative Dentistry and Endodontics
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• 제20권1호
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• pp.97-112
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• 1995

The purpose of this study was to evaluate the effect of wetting condition made by drying time on bonding of resin cement to dentin. Freshly extracted bovine teeth were grinded to expose flat dentin surfaces. After the exposed dentin surfaces were treated with pretreatment agents and water rinse, each wetting condition of dentin surfaces was made according to drying times and methods including slight blow bry for I-second by air syringe, blow dry for 20-second by air syringe, and 12-hour dry in desiccator respectively. and then, previously made composite resin specimens were bonded onto each conditioned dentin surface of the specimen using Panavia-21(Kuraray Co.), Bistite(Tokuso Co.), and Choice(use with All bond-2, Bisco Inc.) resin cement according as manufacturer's instruction. Bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, then the tensile bond strength was measured, cohesive failure rate was calculated, and fractured dentin surfaces and acrylic rod sides were examined under scanning electron microscope. The result were as follows ; In the group of bonding with Panavia-21 resin cement, higher tensile bond strength was seen in 12-hour dry group than in I-second and 20-second dry group(p<0.01). In the group of bonding with Bistite resin cement, higher tensile bond strength was seen in 1-second dry group than in 20-second and 12-hour dry group(p<0.01). In the group of bonding with Choice resin cement, no significant differences of bond strength under given drying time were seen. Cohesive failure rates derived from the groups of bonding with Panavia-21 and Choice resin cement were increased with the increase of tensile bond strength in each drying time. On SEM examination of fractured surface, adhesive failure mode with fractured resin tags was mostly seen in wet condition with I-second drying time in the group of bonding with Panavia-21 resin cement, mixed failure mode with shortened and fractured resin tag was seen in the group of bonding with Bistite resin cement, and regardless of drying time, and cohesive-adhesive mixed failure mode with fracture of 'Hollow' typed resin tags was mainly seen in the group of bonding with Choice resin cement.