• KEPCO Journal on Electric Power and Energy
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• v.2 no.2
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• pp.223-225
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• 2016

The newly proposed analysis method using a direct-current current-voltage (DCIV) simulation is introduced for investigating leakage current composing MOS transistor. From comparing the density and location of traps using DCIV method and investigating the leakage current of gate channel transistor, we proposed the graphical analysis method to correlate the DCIV current and leakage mechanism by the traps. And, our graphical method intuitively explains that leakage current in MOS transistor is well correlated with the DCIV current of the MOS transistor arrays due to two kinds of traps created by Fowler-Nordheim (F-N) stress and Hot carrier stress, respectively.

• The Transactions of the Korean Institute of Power Electronics
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• v.6 no.5
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• pp.453-459
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• 2001

In this paper, the loss analyses of two soft switching techniques for two-transistor forward converter are performed. The sums of snubber conduction and capacitive turn-on losses for two transistors are calculated to compare the losses of the two techniques. While the conventional soft switching technique shows the loss difference between two transistors, the proposed soft switching technique shows equal as well as lower losses In two transistors. Thus, it can be said that even thermal distribution and higher reliability can be obtained by the proposed soft switching technique.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.4
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• pp.653-659
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• 2008

This paper describes the design of high power transistor packages using high power chip transistor dies, chip capacitors and a new wire bonding technique. Input impedance variation and output power performances according to wire inductance and resistance for internal matching are also discussed. A multi crossing type(MCT) wire bonding technique is proposed to replace the conventional stepping stone type(SST) wire bonding technique, and eventually to improve the output power performances of high power transistor packages. Using the proposed MCT wire bonding technique, it is possible to design high power transistor packages with highly improved output power compared to SST even the package size is kept to be the same.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.59-62
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• 2000

A VLSI implementation of a self-learning neural network integrated circuits using a linearity synapse transistor is investigated. The thickness dependence of oxide current density, stress current, transient current and channel current has been measured in oxides with thicknesses between 41 and 112 $\AA$, which have the channel width$\times$length 10$\times$1${\mu}{\textrm}{m}$ respectively. The transient current will affect data retention in synapse transistors and the stress current is used to estimate to fundamental limitations on oxide thicknesses. The synapse transistor has represented the neural states and the manipulation which gave unipolar weights. The weight value of synapse transistor was caused by the bias conditions. Excitatory state and inhitory state according to weighted values affected the drain source current.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.302-317
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• 2017

This paper proposes a new full adder design based on pass-transistor logic that offers ultra-low power dissipation and superior variability together with low transistor count. The pass-transistor logic allows device count reduction through direct logic realization, and thus leads to reduction in the node capacitances as well as short-circuit currents due to the absence of supply rails. Optimum transistor sizing alleviates the adverse effects of process variations on performance metrics. The design is subjected to a comparative analysis against existing designs based on Monte Carlo simulations in a SPICE environment, using the 22-nm CMOS Predictive Technology Model (PTM). The proposed ULP adder offers 38% improvement in power in comparison to the best performing conventional designs. The trade-off in delay to achieve this power saving is estimated through the power-delay product (PDP), which is found to be competitive to conventional values. It also offers upto 79% improvement in variability in comparison to conventional designs, and provides suitable scalability in supply voltage to meet future demands of energy-efficiency in portable applications.

• Journal of Sensor Science and Technology
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• v.21 no.6
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• pp.413-419
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• 2012

A dynamic range extension technique is proposed based on a 3-transistor active pixel sensor (APS) with gate/body-tied p-channel metal oxide semiconductor field effect transistor (PMOSFET)-type photodetector using a feedback structure. The new APS consists of a pseudo 3-transistor APS and an additional gate/body-tied PMOSFET-type photodetector, and to extend the dynamic range, an NMOSFET switch is proposed. An additional detector and an NMOSFET switch are integrated into the APS to provide negative feedback. The proposed APS and pseudo 3-transistor APS were designed and fabricated using a $0.35-{\mu}m$ 2-poly 4-metal standard complementary metal oxide semiconductor (CMOS) process. Afterwards, their optical responses were measured and characterized. Although the proposed pixel size increased in comparison with the pseudo 3-transistor APS, the proposed pixel had a significantly extended dynamic range of 98 dB compared to a pseudo 3-transistor APS, which had a dynamic range of 28 dB. We present a proposed pixel that can be switched between two operating modes depending on the transfer gate voltage. The proposed pixel can be switched between two operating modes depending on the transfer gate voltage: normal mode and WDR mode. We also present an imaging system using the proposed APS.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.2
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• pp.69-75
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• 2003

Cell transistor and data retention time characteristics were studied in 90 nm design rule 512M-bit DRAM, for the first time. And, the characteristics of cell transistor are investigated for different STI gap-fill materials. HDP oxide with high compressive stress increases the threshold voltage of cell transistor, whereas the P-SOG oxide with small stress decreases the threshold voltage of cell transistor. Stress between silicon and gap-fill oxide material is found to be the major cause of the shift of the cell transistor threshold voltage. If high stress material is used for STI gap fill, channel-doping concentration can be reduced, so that cell junction leakage current is decreased and data retention time is increased.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.3
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• pp.59-66
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• 2015

In this paper, we propose a method of improving the light-load efficiency of DC-DC buck converter using 4bit SAR-ADC (Successive Approximation ADC) for a LDO or a power transistor size selection technique. The proposed circuit selects power transistor sizes depending on load current so that improves the light-load efficiency of the DC-DC buck converter. For this, we select the power transistor size with a cross point of the switching loss and the conduction loss. Also, when the IC operates in standby mode or sleep mode, a LDO mode is selected for improving the efficiency. The proposed circuit selects power transistor sizes(X1, X2, X4, X8) with 4 bits and its efficiency is higher about the maximum of 25% at the light-load than that of a single transistor size. Input voltage and output voltage are 5V and 3.3V for maximum load currents of 500mA.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.159-159
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• 1997

• Journal of IKEEE
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• v.12 no.4
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• pp.211-216
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• 2008

This paper proposes an 8${\times}$8 bit parallel multiplier using MOS current-mode logic (MCML) circuit for low power consumption. The proposed circuit has a structure of low-power MOS current-mode logic circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to PMOS transistor to minimize the leakage current. Comparing with the conventional MOS current-model logic circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/50. The designed multiplier is achieved to reduce the power consumption by 10.5% and the power-delay-product by 11.6% compared with the conventional MOS current-model logic circuit. This circuit is designed with Samsung 0.35 ${\mu}m$ standard CMOS process. The validity and effectiveness are verified through the HSPICE simulation.