• Title/Summary/Keyword: Transient device

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Application to the Electro-Optical Conversion Device of OLEDs (도프형 유기 EL 소자의 전기-광 변환소자 응용)

  • Kim, Ju-Seung;Min, Yong-Gi;Gu, Hal-Bon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.12a
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    • pp.114-118
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    • 2006
  • We investigated the transient electroluminescence (EL) and modulation characteristics of red organic light-emitting diodes (OLEDs), which consist with 4-(dicyanomethylene)-2-i -propyl-6-(1,1,7,7-tetramethyljulolidyl-9-cnyl)-4H-pyran (DCJTI) and rubrene doped into tris(8-hydroxyquinoline)aluminum ($Alq_3$). The transient EL waveforms showed two components, the overshooting peak and constant component, indicating that the excess amount of accumulated charges simultaneously recombine at the onset moment. This overshooting effect reduced the rise time of transient EL and enhanced the optical output of OLEDs when the pulse voltage applied to the device. We demonstrated that the red OLEDs could be use for the high-speed switching application by driving at more than 100 MHz and transmitting the video signals utilized as the electro-optical conversion device

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Transient Simulation of CMOS Breakdown characteristics based on Hydro Dynamic Model (Hydro Dynamic Model을 이용한 CMOS의 파괴특성의 Transient Simulation해석)

  • Choi, Won-Cheol
    • Journal of the Korean Society of Industry Convergence
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    • v.5 no.1
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    • pp.39-43
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    • 2002
  • In present much CMOS devices used in VLSI circuit and Logic circuit. With increasing a number of device in VLSI, the confidence becomes more serious. This paper describe the mechanism of breakdown on CMOS, especially n-MOS, based on Hydro Dynamic model with device self-heating. Additionally, illustrate the CMOS latch-up characteristics on simplified device structure on this paper.

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A Study on the Development of a Transient Voltage Blocking Device for Info-communication Facilities (정보통신기기용 과도전압 차단장치의 개발에 관한 연구)

  • 한주순
    • Journal of Advanced Marine Engineering and Technology
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    • v.23 no.2
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    • pp.159-167
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    • 1999
  • This paper presents a new transient voltage blocking device(TOBD)which low power and high frequency bandwidth to protect info-communication facilities from transient voltages. Conventional protection devices have some problems such as low frequency bandwidth low ener-gy capacity and high remnant voltage. in order to improve these limitations a hybrid type TOBD which consists of a gas tube avalanche diodes and junction type field effect transistor (JFETs) is developed. The TOBD differs from the conventional protection devices in configuration and JFETs are used as an active non-linear element and a high speed switching diode with low capacitance limited high current. Therefore the avalanche diode with low energy capacity are protected from the high current and the TOBD has a very small input capacitance. From the performance test using combination surge generator which can produce $1.2/50{\mu}m$ 4.2 kV/max, $8/20{\mu}m$ 2.1 kAmax it is confirmed that the proposed TOBD has an excellent protection per-formance in tight clamping voltage and limiting current characteristics.

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Modeling and Simulation for Transient Pulse Gamma-ray Effects on Semiconductor Devices (반도체 소자의 과도펄스감마선 영향 모델링 및 시뮬레이션)

  • Lee, Nam-Ho;Lee, Seung-Min
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.9
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    • pp.1611-1614
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    • 2010
  • The explosion of a nuclear weapon radiates a gamma-ray in the form of a transient pulse. If the gamma-ray introduces to semiconductor devices, much Electron-Hole Pairs(EHPs) are generated in depletion region of the devices[7]. as a consequence of that, high photocurrent is created and causes upset, latchup and burnout of semiconductor devices[8]. This phenomenon is known for Transient Radiation Effects on Electronics(TREE), also called dose-rate effects. In this paper 3D structure of inverter and NAND gate device was designed and transient pulse gamma-ray was modeled. So simulation for transient radiation effect on inverter and NAND gate was accomplished and mechanism for upset and latchup was analyzed.

Simulation of Miniaturized n-MOSFET based Non-Isothermal Non-Equilibrium Transport Model (디바이스 시뮬레이션 기술을 이용한 미세 n-MOSFET의 비등온 비형형장에 있어서의 특성해석)

  • Choi, Won-Cheol
    • Journal of the Korean Society of Industry Convergence
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    • v.4 no.3
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    • pp.329-337
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    • 2001
  • This simulator is developed for the analysis of a MOSFET based on Thermally Coupled Energy Transport Model(TCETM). The simulator has the ability to calculate not only stationary characteristics but also non - stationary characteristics of a MOSFET. It solves basic semiconductor devices equations including Possion equation, current continuity equations for electrons and holes, energy balance equation for electrons and heat flow equation, using finite difference method. The conventional semiconductor device simulation technique, based on the Drift-Diffusion Model (DDM), neglects the thermal and other energy-related properties of a miniaturized device. I, therefore, developed a simulator based on the Thermally Coupled Energy Transport Model (TCETM) which treats not only steady-state but also transient phenomena of such a small-size MOSFET. In particular, the present paper investigates the breakdown characteristics in transient conditions. As a result, we found that the breakdown voltage has been largely underestimated by the DDM in transient conditions.

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Conductive adhesive with transient liquid-phase sintering technology for high-power device applications

  • Eom, Yong-Sung;Jang, Keon-Soo;Son, Ji-Hye;Bae, Hyun-Cheol;Choi, Kwang-Seong
    • ETRI Journal
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    • v.41 no.6
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    • pp.820-828
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    • 2019
  • A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag3Sn + Cu6Sn5 → liquid + Cu3Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

Design and Behavior of Validating Surge Protective Devices in Extra-low Voltage DC Power Lines (특별저전압 직류 전원회로에 유용한 서지방호장치의 설계와 특성)

  • Shim, Seo-Hyun;Lee, Bok-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.29 no.3
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    • pp.81-87
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    • 2015
  • In order to effectively protect electrical and electronic circuits which are extremely susceptible to lightning surges, multi-stage surge protection circuits are required. This paper presents the operational characteristics of the two-stage hybrid surge protection circuit in extra-low voltage DC power lines. The hybrid surge protective device consists of the gas discharge tube, transient voltage suppressor, and series inductor. The response characteristics of the proposed hybrid surge protective device to combination waves were investigated. As a result, the proposed two-stage surge protective device to combination wave provides the tight clamping level of less than 50V. The firing of the gas discharge tube to lightning surges depends on the de-coupling inductance and the rate-of-change of the current flowing through the transient voltage suppressor. The coordination between the upstream and downstream components of the hybrid surge protective device was satisfactorily achieved. The inductance of a de-coupler in surge protective circuits for low-voltage DC power lines, relative to a resistance, is sufficiently effective. The voltage drop and power loss due to the proposed surge protective device are ignored during normal operation of the systems.

Mixed-mode simulation of transient characteristics of 4H-SiC DMOSFETs (Mixed-mode simulation을 이용한 4H-SiC DMOSFETs의 채널 길이에 따른 transient 특성 분석)

  • Kang, Min-Seok;Choi, Chang-Yong;Bang, Wook;Kim, Sang-Chul;Kim, Nam-Kyun;Koo, Sang-Mo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.131-131
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    • 2009
  • Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility ($\sim900cm^2/Vs$). These electronic properties allow high breakdown voltage, high-speed switching capability, and high temperature operation compared to Si devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances, the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. This paper studies different channel dimensons ($L_{CH}$ : $0.5{\mu}m$, $1\;{\mu}m$, $1.5\;{\mu}m$) and their effect on the the device transient characteristics. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship. with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. We observe an increase in the turn-on and turn-off time with increasing the channel length. The switching time in 4H-SiC DMOSFETs have been found to be seriously affected by the various intrinsic parasitic components, such as gate-source capacitance and channel resistance. The intrinsic parasitic components relate to the delay time required for the carrier transit from source to drain. Therefore, improvement of switching speed in 4H-SiC DMOSFETs is essential to reduce the gate-source capacitance and channel resistance.

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Effect of Interface Charges on the Transient Characteristics of 4H-SiC DMOSFETs (4H-SiC DMOSFETs의 계면 전하 밀도에 따른 스위칭 특성 분석)

  • Kang, Min-Seok;Moon, Kyoung-Sook;Koo, Sang-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.6
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    • pp.436-439
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    • 2010
  • SiC power device possesses attractive features, such as high breakdown voltage, high-speed switching capability, and high temperature operation. In general, device design has a significant effect on the switching characteristics. In this work, we report the effect of the interface states ($Q_f$) on the transient characteristics of SiC DMOSFETs. The key design parameters for SiC DMOSFETs have been optimized by using a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. When the $SiO_2$/SiC interface charge decreases, power losses and switching time also decrease, primarily due to the lowered channel mobilities. High density interface states can result in increased carrier trapping, or more recombination centers or scattering sites. Therefore, the quality of $SiO_2$/SiC interfaces has a important effect on both the static and transient properties of SiC MOSFET devices.

A Study on the Protection Methods of Sheath Circulating Current Reduction Device in Transient State (과도상태에서의 시스순환전류 저감장치 보호방안에 관한 연구)

  • Kang, Ji-Won;Jung, Chae-Kyun;Lee, Jong-Beom;Lee, Dong-Il;Jung, Gil-Jo
    • Proceedings of the KIEE Conference
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    • 2002.11b
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    • pp.53-58
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    • 2002
  • Sheath circulating current is increased as the change of sheath mutual impedance which is caused by imbalance of cable system, and different section length between joint box. If excessive current flows in sheath. sheath loss will be increased and then transmission capacity of underground transmission system is reduced. Accordingly, This paper proposed sheath current reduction device using resistor and reactor and proved the reduction effect of that device using EMTP/ATP. And also in this paper, when transients are occurred at the underground system with reduction device by ground fault and lightning surge. we analyzes transient effect of system variously. From this result. authors establish the protection methods of sheath circulating current reduction device.

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