• The Transactions of the Korean Institute of Electrical Engineers D
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• v.53 no.11
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• pp.768-775
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• 2004

The SSA technique in the digital circuit test is required to be repeated the input pattern stream to n bits output nodes n times in case of using a multiplexor. Because the method adopting a parallel/serial bit convertor to remove this inefficiency has disadvantage of requiring the test time n times for a pattern, the test strategy is required, which can enhance the test productivity by reducing the test time based on simplified fault detection mechanism. Accordingly, this paper proposes a test strategy which enhances the test productivity and efficiency by appling PAS (Parallel Signature Analysis) technique to those after analyzing the structure and characteristics of the digital devices including TTL and CMOS family ICs as well as ROM and RAM. The PSA technique identifies the faults by comparing the reminder from good device with reminder from the tested device. At this time, the reminder is obtained by enforcing the data stream obtained from output pins of the tested device on the LFSR(Linear Feedback Shift Resister) representing the characteristic equation. Also, the method to obtain the optimal signature analyzer is explained by furnishing the short bit input streams to the long bit input streams to the LFSR having 8, 12, 16, 20bit input/output pins and by analyzing the occurring probability of error which is impossible to detect. Finally, the effectiveness of the proposed test strategy is verified by simulating the stuck at 1 errors or stuck at 0 errors for several devices on typical 8051 digital board.

• The Journal of Asian Finance, Economics and Business
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• v.7 no.12
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• pp.11-19
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• 2020

This study examines the factors that affect firm's liquidity in manufacturing companies listed in Vietnam. Factors studied include the board size, the board independence, the firm size, the firm age, and its return. We use different metrics to measure firm's solvency status, including the cash ratio, the quick ratio, and the cash conversion cycle. Accordingly, three econometric models are built to test hypotheses proposed by researchers in order to explain the relationship between the five factors above and liquidity's measures. The study used the data set of manufacturing companies listed on the Ho Chi Minh City Stock Exchange in the period from 2015 to 2019. The final sample group comprises 139 firms with 633 observations. The results show that in manufacturing firms, while the cash ratio and the quick ratio are positively associated to the board size, the board independence, and the firm's profitability, the net operating cycle is negatively correlated to the board size, the firm size, the board independence, and the profitability. Therefore, larger firms with larger board size and more independent members can help to improve capital management efficiency.There is no evidence for the relationship between the firm age and solvency measurements, between cash conversion cycle and firm's profitability.

• Journal of the Korean Geosynthetics Society
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• v.9 no.3
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• pp.67-75
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• 2010

The tensile strength, permeability and discharge capacity of biodegradable plastic drain boards made with poly lactic acid (PLA) have been tested and verified prior to their usage at field. Based on test results, the tensile strength of biodegradable plastic drain board made with PLA has relatively lower tensile strain and tensile strength than those of plastic drain board. Performance of PLA filter having good permeability and low opening size is proper for the filter of vertical drain board. In case of improving stiffness of PLA filter, biodegradable plastic drain board also satisfies required discharge capacity as use of vertical drain board too.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.5
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• pp.383-390
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• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.

• Journal of Satellite, Information and Communications
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• v.12 no.3
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• pp.103-107
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• 2017

The Satellite OBC(On Board Computer) manages critical functionality such as satellite attitude control, fault management, payload management, command/telemetry processing etc. The OBC consist of various modules. Each module perform mission critical operation. So all modules designed as hot or cold redundancy architecture. The redundancy design gives a guarantee high reliability and it allows normal operation of satellite using reconfiguration capability. In this paper, introduces reconfiguration unit operation and describe the results of testing in the ETB.

• Journal of computational fluids engineering
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• v.17 no.3
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• pp.45-52
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• 2012

This paper is a study on the design of the solar lamp bank which is a very important part of the solar simulator with the commercial metal halide lamps and infrared lamps. Lamp Bank is designed by the lamp bank design program based on point light source theory. The reliability of the program for lamp bank design is verified through irradiance variation experiments of a kind of lamp according to horizontal distance. Solar lamp bank facilitates heat distribution and satisfies the irradiance in the three wave length which test guidelines require. The shape of the ceiling board next to the lamp bank to promote the lamp cooling efficiency and to reduce temperature deviation and air velocity deviation in the chamber is so creative. The ceiling board of partial closed type is the best among several types.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1961-1962
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• 2008

Hybrid Peer-to-Peer structure is sharing resource in each peer, but various resource that is with go peer indexing and segment that search from attained in server who function is solidified that is not attained in peer itself be. Basis algorithm was based on Ethernet protocol and administration of each peer enabled in center server and peer does as can confirm breakdown existence and nonexistence through communication with center server and the internet through this directly expensive test expense and a lot of test times of existing test method of access method necessary problem effectively improve.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.193-201
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• 2011

Recently, mechanical reliabilities including a drop test have been a hot issue. In this paper, solder balls with new components which are Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu-0.05N are introduced, and board level drop test for them are conducted under JEDEC standard in which the board with 15 flip chips is dropped as 1,500g acceleration during 0.5ms. The drop simulations are studied by using a implicit method in the ANSYS LS-DYNA, and modal analysis is made. Through both analyses, the solder balls with new components are evaluated under the drop. It is found that the maximum stress of each chip is occurred between the solder ball and the PCB, and the highest value among the maximum stresses in the chips is occurred on the chip nearest to fixed holes on the board in the drop tests and simulations.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2010.05b
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• pp.43-47
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• 2010

The use of high-strength concrete has increased for its excellent structural stability as buildings become higher and bigger than ever before in Korea and overseas recently. The functional requirement of building materials has also been bolstered so for the high -performance, high-quality construction materials to be used more extensively. However, the internal structure of the high-strength concrete is very dense so spalling can be caused during fire. The spalling in turn can cause critical structural damages followed by the fatal consequences, demolition of the building. Therefore, ensuring fire safety for high-rise buildings is assumed to be urgent. Alumino-silicate fire resistant board producing technology has been developed in situations that new materials with excellent fire resistance and easy installation has been sought. The alumino-silicate fire resistant board turned out to exhibit not only fire resistance and excellent physical and dynamical characteristics but also excellent onsite applicability and easy process and transportation after completing Mock-up test. Its excellence as a high-performance building materials was proven.