• Polymer(Korea)
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• v.38 no.6
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• pp.809-814
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• 2014

An array structure of conducting polymer microtubule was fabricated for an amperometric biosensor. 3,4-Ethylenedioxythiophene (EDOT) was electropolymerized in the microporous template membrane with poly(3,4-ethylenedioxythiophene)/poly(4-styrenesulfonic acid) (PEDOT/PSS) composite as a binder. The array structure can provide enhanced current collecting capability due to large active surface area compared to the macroscopic area of the electrode itself. For a biosensor application, the array electrode was tested for $H_2O_2$ detection and showed very sluggish electrochemical response to $H_2O_2$. To enhance the detection efficiency to the oxidation of $H_2O_2$, gold was treated on the electrode by two different approaches: sputtering and electrochemical deposition. Gold treatment with either method greatly enhanced the sensitivity of the electrode to $H_2O_2$. So, conducting polymer microtubule array with gold treatment was expected to be a sensitive amperometric biosensor system based on the detection of $H_2O_2$.

• Journal of the Korean Magnetics Society
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• v.9 no.6
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• pp.312-320
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• 1999

Effect of deposition conditions on the magnetic properties of SmCo/Cr prepared by a RF magnetron sputtering method was studied. We obtained the maximum coercivity of 3.2 kOe in the sample of Cr(50 nm)/SmCo(40 nm, 50W, 20 mT)/Cr(150 nm, 100 W, 30 mT). The coercivity of the SmCo/Cr depends largely on the roughness of the Cr underlayer and the composition of SmCo. The roughness of the Cr underlayer increased with increasing the Ar pressure and thickness, and promoted the isolation of SmCo grains which resulted in an enhanced coercivity. The composition of the SmCo was changed with RF power and Ar pressure due to the mass difference between Sm and Co and the resputtering phenomena. The maximum coercivity was obtained in the composition of about 20 at.% Sm. The mechanism of magnetization reversal of the present SmCo films changed from domain wall motion to domain rotation as the RF power and the Ar pressure increase. This was though to be due to the defects, such as the roughness of Cr surface, porous column boundaries etc., which inhibit domain wall movement.

• Journal of Magnetics
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• v.7 no.2
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• pp.45-50
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• 2002

A magnetic field annealing is firstly used for nanostructured Sm-Co/Co films, prepared by magnetron sputtering method. The effects of magnetic field annealing on single-layered Sm-Co films are different from those on multi-layered Sm-Co/Co films. A detailed analysis of microstructures and magnetic properties is made by means of HRTEM, Auger electron spectroscopy, XRD and Physical Property Measurement System (PPMS). From magnetic properties and microstructure analysis, it was confirmed that these differences originate from the effects of magnetic field annealing on crystallization behavior of the films. The relationship between magnetic properties and microstructures explains a different demagnetization process of single-layered and multilayered films. For the single-layered Sm-Co films, magnetic-field-annealing makes the main phases change from $CaCu_5/ to Zn_2Th_{17}$ structure, resulting in a decrease of coercivity. The results show that the magnetic-field-annealing is useful to improve the properties of nanostructured Sm-Co(30 nm)/Co(10 nm) films, which ascribe to improving the pinning effectiveness in coercivity mechanism and decreasing the magnetostatic interaction of films. A very high coercivity about 0.7 T was obtained from nanoscaled multi-layered Sm-Co(30 nm)-/Co(10 nm) films.

• Journal of the Korean Ceramic Society
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• v.39 no.4
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• pp.377-385
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• 2002

The possibility of $ZrO_2$ thin film as insulator for Metal-Ferroelectric-Insulator-Semiconductor(MFIS) structure was investgated. $SrBi_2Ta_2O_9$ and $SrBi_2Ta_2O_9$(SBT) thin films were deposited on P-type Si(111) wafer by R. F. magnetron sputtering method. The electrical properties of MFIS gate were relatively improved by inserting the $ZrO_2$ buffer layer. The window memory increased from 0.5 to 2.2V in the applied gate voltage range of 3-9V when the thickness of SBT film increased from 160 to 220nm with 20nm thick $ZrO_2$. The maximum value of window memory is 2.2V in Pt/SBT(160nm)/$ZrO_2$(20nm)/Si structure with the optimum thickness of $ZrO_2$. These memory windows are sufficient for practical application of NDRO-FRAM operating at low voltage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.364-368
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• 1997

We have investigated Pt and RuO$_2$as a bottom electrode for a device application of PZT thin film. The bottom electrodes were prepared by using an RF magnetron sputtering method. We studied some of the property influencing factors such as substrate temperature, gas flow rate, and RF power. An oxygen partial pressure from 0 to 50% was investigated. The results show that only Ru metal was grown without supp1ying any O$_2$gas. Both Ru and RuO$_2$phases were formed for O$_2$partial pressure between 10∼40%. A Pure RuO$_2$ phase was obtained with O$_2$partial pressure of 50%. A substrate temperature from room temperature to 400$^{\circ}C$ was investigated with XRD for the film crystallinity examination. The substrate temperature influenced the surface morphology and the resistivity of Pt and RuO$_2$as well as the film crystal structure. From the various considerations, we recommend the substrate temperature of 300$^{\circ}C$ for the bottom electrode growth. Because PZT film growth on top of bottom electrode requires a temperature process higher than 500$^{\circ}C$, bottom electrode properties were investigated as a function of post anneal temperature. As post anneal temperature was increased, the resistivity of Pt and RuO$_2$was decreased. However, almost no change was observed in resistivity for an anneal temperature higher than 700$^{\circ}C$. From the studies on resistivity and surface morphology, we recommend a post anneal temperature less than 600$^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.50 no.6
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• pp.473-479
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• 2017

CrN coatings have been used as protective coatings for cutting tools, forming tools, and various tribological machining applications because these coatings have high hardness. Cr-Al-N coatings have been investigated to improve the properties of CrN coatings. Cr-Al-N coatings were fabricated by a hybrid physical vapor deposition method consisting of unbalanced magnetron sputtering and arc ion plating with different working pressure and substrate bias voltage. The phase analysis of the composition was performed using XRD (x-ray diffraction). Cr-Al-N coatings were grown with textured CrN phase and (111), (200), and (220) planes. The adhesion strength of the coatings tested by scratch test increased. The friction coefficient and removal rate of the coatings were measured by a ball-on-disk test. The friction coefficient and removal rate of the coatings decreased from 0.46. to 0.22, and from $2.00{\times}10^{-12}m^2/N$ to $1.31{\times}10^{-13}m^2/N$, respectively, with increasing bias voltage. The tribological properties of the coatings increased with increasing substrate bias voltage.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1657-1658
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• 2006

An external electrode fluorescent lamps (EEFLs) have the advantage of a long lifetime in the early stages of the study on plasma discharge, interest in the lamp continues. Studies on the operation of external electrode fluorescent lamps have focused mainly on its use of a type of high frequency (MHz). By performing high brightness using a square wave operation method with the low frequency below 100kHz, which is applied to a narrowed tube type lamp that has several mm of lamp diameter. To solve these problems of CCFL, EEFL (External Electrode Fluorescent Lamp) is introduced. Because electrode of EEFL is on the outer surface of discharge tube, the electrode is perfectly prevented from the sputtering by accelerated ions. And it is possible to drive the many CCFLs at the same time, because EEFL shows the positively resistant characteristic. But EEFL has the large non-radiative power loss in sheath. In this study the novel electrode structure was introduced in order to reduce non-radiative power loss in sheath of EEFL. The novel electrode structure comes from the idea to combine conceptually capacitive discharge with inductive discharge. Thus, this study verifies the change in the optical characteristics according to the change in electrode structure through a Maxwell's electromagnetic field simulation and examines the relationship between the change in the EEFL electrode structure and brightness by measuring the optical characteristics.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1841-1843
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• 2005

냉간 압연과 열처리 공정을 통해 2축 배향성을 가지는 금속 기판 위에 산화물 박막을 중착 시켜 같은 정도의 2축 배향성을 갖도록 제조된 RABiTS template 위에 YBCO 초전도체를 PLD 방법으로 증착하여 YBCO coated conductor 선재를 제조하였다. RABiTS template은 $NiW/Y_2O_3/YSZ/CeO_2$ 구조로 DC reactive sputtering와 PLD 방법에 의해 증착되었다. 모든 공정은 reel-to-reel 방식의 연속 공정으로 이루어졌다. 1m와 10m급의 장선 고온초전도선재를 제조하고, 이에 대한 전기적 특성과 초전도 및 다층 산화물 완충층에 대한 결정성, 표면 특성에 대한 분석을 수행하였다. 그 결과 1m 길이에서 end-to-end 107A와 10.6m 길이에서 end-to-end 51A의 임계 전류를 획득하였다. 제조된 박막형 선재의 초전도 층과 다층의 산화물 완충층 모두 금속 기판의 결정성을 그대로 유지하면서, epitaxial하게 성장하였으며, 최종 YBCO의 in-plane FWHM 값은 > $9^{\circ}$를 유지하였다.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1574-1576
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• 2003

Carbon nanotubes (CNTs) were grown on the TiN-coated silicon substrate with different thickness of Ni and Co catalysts layer at $600^{\circ}C$ using inductively coupled plasma-chemical vapor deposition (ICP-CVD). The Ni and Co catalysts were formed using the RF magnetron sputtering system with various deposition times. It was found that the growth of CNTs was strongly influenced by the surface morphology of Ni and Co catalysts. With increasing deposition time, the thickness of catalysts increased and the grain boundary size of catalysts increased. The surface morphology of catalysts and CNTs were elucidated by SEM. The Raman spectrum further confirmed the graphitic structure of the CNTs. The turn-on field of CNTs grown on Ni and Co catalysts was about 2.7V/pm and 1.9V/pm respectively. Field emission current density of CNTs grown on Ni and Co catalysts was measured as $11.67mA/cm^2$ at $5.5V/{\mu}m$ and $1.5mA/cm^2$ at $5.5V/{\mu}m$ respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.6
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• pp.377-385
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• 2018

For the investigation of dopant profiles in implanted $Si_{1-x}Ge_x$, the implanted B and As profiles are measured using SIMS (secondary ion mass spectrometry). The fundamental ion-solid interactions of implantation in $Si_{1-x}Ge_x$ are discussed and explained using SRIM, UT-marlowe, and T-dyn programs. The annealed simulation profiles are also analyzed and compared with experimental data. In comparison with the SIMS data, the boron simulation results show 8% deviations of $R_p$ and 1.8% deviations of ${\Delta}R_p$ owing to relatively small lattice strain and relaxation on the sample surface. In comparison with the SIMS data, the simulation results show 4.7% deviations of $R_p$ and 8.1% deviations of ${\Delta}R_p$ in the arsenic implanted $Si_{0.2}Ge_{0.8}$ layer and 8.5% deviations of $R_p$ and 38% deviations of ${\Delta}R_p$ in the $Si_{0.5}Ge_{0.5}$ layer. An analytical method for obtaining the dopant profile is proposed and also compared with experimental and simulation data herein. For the high-speed CMOSFET (complementary metal oxide semiconductor field effect transistor) and HBT (heterojunction bipolar transistor), the study of dopant profiles in the $Si_{1-x}Ge_x$ layer becomes more important for accurate device scaling and fabrication technologies.