• The Journal of Korean Academy of Prosthodontics
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• v.31 no.2
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• pp.191-205
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• 1993

In order to compare the strength of soldered joints relative to the various sol dering method, soldering processes were performed using Palladium based ceramo-metal alloy(Bond-on 4)and Nickel-cromium alloy(Vera Bond). The obtained data include difference in strength between presoldering and postsoldering The data also contain difference among postsoldered groups for 3 difference soldering methods(torch, infrared. Oven) The following results were obtained : 1. For postsoldering with Pd alloy, the oven-using group showed the highest strength while the difference in strength between the torch-using group and the infrared machine group was negligible. 2. For Pd alloy with the torch method, postsoldering resulted in the higher strength than presoldering. 3. There was a negligible difference in strength between presoldering and postsoldering when Ni-Cr alloy with torch method is used. 4. Through microscopic study of the fractured surfaces, the torch-using group showed more porosity than both the oven-using and the infrared machine groups. 5. In terms of fracturing patterns, the oven-using group showed adhesive failure while both the torch and the infrared machine groups showed cohesive failure and cohesive-adhesive failure.

• Progress in Superconductivity and Cryogenics
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• v.12 no.2
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.47-52
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test. $(Cu,Ni)_6/Sn_5$-type intermetallic compound of which thickness is about 5 $\mu\textrm{m}$ was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was fecund at the solder joint. The newly developed product was superior to conventional one in terms of productivity and reliability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.236-237
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• 2007

Lamination of coated conductor is important to commercialize for electrical stabilizer and mechanical support. It should be known the properties of soldering interface and the variation of superconductivity on coated conductor with various kinds of solders. $SmBa_2Cu_O_x$ thin films were deposited by co-evaporation method (EDDC, Evaporation using Drum in Dual Chambers). 4 kinds of solders were used to investigate interface properties of SmBCO conductors. In-Bi solder could maintain good connection.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.89-98
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.63-69
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• 2012

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

• Proceedings of the KIPE Conference
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• 1998.10a
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• pp.97-100
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• 1998

In this paper, micro step driving method is used for the high performance motion control and low vibration and low noise in an X-Y axis soldering machine for factory automation. The improvement of the electrical and mechanical driving characteristic of a stepping motor is achieved by applying microstep driver.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1304-1305
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• 2011

In this study, tabbing cell samples in the soft touch method are compared samples according to soldering voltage conditions. Series resistance and power loss is measured by two measurement method. As a result, probe measurement method was found optimized soldering voltage optimized according to voltage condition and clamp measurement method was not difference. The purpose of this paper is to analysis the principle of measurement method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.371-371
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• 2009

For the application of superconducting wires to fault current limiting devices, it is required that they have a high rated voltage when a fault occurs. Stabilizer-free coated conductors, particularly, shows a good performance for the high rated voltage, which is beyond 0.6 V/cm. In this study, using the stabilizer-free coated conductors, we made fault current limiting devices and examined their characteristics. Fault current limiting devices were fabricated with a shape of the cylinder of a mono-filar coil winding. Stabilizer-free coated conductors were wound along the mono-filar coil line and the terminal parts between the wire and metal were soldered using In solder. Two kinds of devices were fabricated by a different method in the terminal joint, one was made by a soldering and the other was made by a soldering-free joint. Critical currents and resistance at the joint parts were measured. In addition, long-time current flowing tests were also carried out for the characterization of the fault current limiting devices.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.