Progress in Superconductivity and Cryogenics (한국초전도ㆍ저온공학회논문지)

The Korean Society of Superconductivity and Cryogenics (한국초전도저온학회)
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Application of reflow soldering method for laminated high temperature superconductor tapes

  • Lee, Nam-Jin (Department of Physics, Korea Advanced Institute of Science and Technology) ;
  • Oh, Sang-Soo (Korea Electrotechnology Research Institute) ;
  • Kim, Ho-Sup (Korea Electrotechnology Research Institute) ;
  • Ha, Dong-Woo (Korea Electrotechnology Research Institute) ;
  • Ha, Hong-Soo (Korea Electrotechnology Research Institute) ;
  • Ko, Rock-Kil (Korea Electrotechnology Research Institute) ;
  • Shin, Hyung-Seop (School of Mechanical Engineering, Andong National University) ;
  • Youm, Do-Jun (Department of Physics, Korea Advanced Institute of Science and Technology)
  • Received : 2010.04.12
  • Accepted : 2010.04.23
  • Published : 2010.05.31
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Abstract

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

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References

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