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Bending Strain Dependence of the Transport Property in Jointed BSCCO Tapes

  • Dedicatoria, Marlon J. (Department of Mechanical Design Engineering, Andong National University) ;
  • Shin, Hyung-Seop (Department of Mechanical Design Engineering, Andong National University)
  • Received : 2010.04.05
  • Accepted : 2010.05.10
  • Published : 2010.05.31

Abstract

In this study, the effect of bending strain on the transport property and critical current of lap and butt-jointed (non-laminated) BSCCO tapes has been investigated. The samples were joined using a mechanically controlled jointing procedure. To achieve a uniform thickness at the joint a single point loading contact has been devised. GFRP mandrels with different bending radii which support the sample during bending have been used. $I_c$ have been measured at 77 K and self field. In the case of easy bending test for jointed BSCCO tapes, sudden degradation of $I_c$ is caused by the local strain concentration due to non uniform deformation at the edge parts of the joint. In the case of hard bending test of jointed BSCCO tapes transverse macroscopic crack at specific subsection caused a large $I_c$ degradation. The transport property of jointed BSCCO tapes in each bending mode was discussed with the damage morphology occurred.

Keywords

References

  1. S. Kobayashi, K. Yamazaki, T. Kato, K. Okura, E. Ueno, K. Fujino, J. Fujikami, N. Ayai, M. Kikuchi, K. Hayashi, K. Sato, R. Hata, "Controlled over-pressure sintering process of Bi2223 wires," Physica C, vol. 426-431, pp. 1132-1134, 2005.
  2. S. Kobayashi, T. Kato, K. Yamazaki, K. Ohkura, K. Fujino, J. Fujikami, E. Ueno, N. Ayai, M. Kikuchi, K. Hayashi, K. Sato, R. Hata, "Controlled overpressure processed Bi2223 wires for power applications," Advances in Cryogenic Engineering, vol. 52B, pp. 688-695, 2006.
  3. J. H. Kim, K. T. Kim, J. Joo, W. Nah, "A study on jointing method of Bi-Pb-Sr-Ca-Cu-O multi-filamentary tape," Physica C, vol. 372-376, pp. 909-912, 2002. https://doi.org/10.1016/S0921-4534(02)00931-0
  4. C. Gu, C. Zhuang, T. M. Qu, Z. Han, "Voltage-current property of two HTS tapes connected by Sn-Pb solder," Physica C, vol. 426-431, pp. 1385-1389, 2005. https://doi.org/10.1016/j.physc.2005.03.073
  5. J. M. Jeong, Y. S. Kim, S. M. Baek, S. Y. Chung, S. H. Kim, "Mechanical properties of jointed Bi-2223/Ag tapes," Physica C, vol. 372-376, pp. 953-955, 2002. https://doi.org/10.1016/S0921-4534(02)00942-5
  6. H. S. Shin, J. R. Dizon, S. S. Oh, R. F. Bonifacio, "Bending strain characteristics of the transport property in lap-jointed coated conductor tapes," IEEE Trans. Appl. Supercond., vol. 19, no. 3 , pp. 2991-2994, 2009. https://doi.org/10.1109/TASC.2009.2019580
  7. H. S. Shin, M. J. Dedicatoria, S. S. Oh, "Comparison of the bending strain effects on transport property in lap- and butt-jointed coated conductor tapes," IEEE Trans. Appl. Supercond., vol. 20, no. 3, 2010, to be published.
  8. J. R. Dizon, R. F. Bonifacio, S. T. Park, H. S. Shin, "Variation of the transport property in lap-jointed YBCO coated conductor tapes with tension and bending deformation," Journal of KIASC, vol. 9, no. 4, pp. 11-15, 2007.
  9. T. Kuroda, K. Katagiri, , H. S. Shin, K. Itoh, K. Kumakura, H. Wada, "Influence of test methods on critical current degradation of Bi-2223/Ag superconductor tapes by bending strain." Supercond. Sci. Tech., vol. 18, pp. S383-S389, 2005. https://doi.org/10.1088/0953-2048/18/12/027
  10. W. Goldacker, S. I. Schlachter, R. Nast, H. Reiner, S. Zimmer, H. Kiesel, A. Nyilas, " Bending strain investigations on BSCCO(2223) tapes at 77K applying a new bending technique," Adv. Cryo. Eng., vol. 614, pp. 469-476, 2002.
  11. H. S. Shin, J. R. Dizon, K. Katagiri, T. Kuroda, "Comparison of bending strain effect on the critical current degradation of Bi-2223 tapes through different measurement techniques," Physica C, vol. 445-448, pp. 741-745, 2006. https://doi.org/10.1016/j.physc.2006.06.037