Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.11a
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- Pages.89-98
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- 2001
A study on the implementation of wave soldering process and the solder joint reliability of it using Sn-Cu-Ni lead-free solder
Sn-Cu-Ni계를 이용한 Pb-free wave Soldering의 공정 적용 및 신뢰성에 관한 연구
Abstract
Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal.
Keywords
- Pb-Free;
- Sn-Cu-Ni;
- AC Adapter;
- Six Sigma;
- Solder Joint Reliability Wave;
- Microstructure;
- Intermetallic compound;
- Lift-off