• 한국재료학회지
• /
• 제12권2호
• /
• pp.117-120
• /
• 2002

We investigated the possibility of direct bonding of the Si ∥SiO$_2$/Si$_3$N$_4$∥Si wafers for Oxide-Nitride-Oxide(ONO) gate oxide applications. 10cm-diameter 2000$\AA$-thick thermal oxide/Si(100) and 500$\AA$-Si$_3$N$_4$LPCVD/Si (100) wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were premated wish facing the mirror planes by a specially designed aligner in class-100 clean room immediately. Premated wafer pairs were annealed by an electric furnace at the temperatures of 400, 600, 800, 1000, and 120$0^{\circ}C$ for 2hours, respectively. Direct bonded wafer pairs were characterized the bond area with a infrared(IR) analyzer, and measured the bonding interface energy by a razor blade crack opening method. We confirmed that the bond interface energy became 2,344mJ/$\m^2$ when annealing temperature reached 100$0^{\circ}C$, which were comparable with the interface energy of homeogenous wafer pairs of Si/Si.

• 한국재료학회지
• /
• 제3권5호
• /
• pp.459-465
• /
• 1993

SOG박막 밑에 층간 절연박으로 사용하는 PECVD산화막을 Si rich산화막으로 만들어 줌으로써 실리콘 dangling bond가 수소원자나 수분과 결합하여 SOG박막으로 부터 침투되는 수소원자나 수분의 확산을 억제하므로서 소작 열화되는 것을 방지한다. 이러한 Si rich산화막의 기본 특성을 알아보기 위하여 LF/HF power비와 $SiH_4/N_2O$ gas유량비를 변화시켜서 박막 특성을 조사하였다. 저주파 power만 변화시킨 경우, 증착속도가 감소하고 굴절율과 압축응력에 증가하며 FTIR에서 3300$\textrm{cm}^{-1}$~3800$\textrm{cm}^{-1}$영역의 수분에 의한 peak이 감소하는 것으로 보아 박막이 치밀해짐을 알 수 있고, $SiH_{4}$기체유량을 증가시킨 경우엔 증착속도, 굴절율, 식각속도는 증가하나 압축응력은 감소한다. FTIR에서 Si-O-Si peak의 세기가 감소하고 낮은 파수영역으로 이동하며, AES분석 결과에서 일반적인 oxide(Si:0=1:1.98)에서 보다 Si:O비가 1:1.23으로 낮아 PECVD산화 막내의 Si danling bond가 증가했음을 알 수 있었다.

• 전기의세계
• /
• 제22권2호
• /
• pp.11-18
• /
• 1973

This paper reports some results of Si and SiO$_{2}$ films obtained from the expitaxial growth by hydrogen reduction of SiCI$_{4}$ with a hydrogen and carbon dioxide mixture in an epitaxial-deposition chamber. The deposited Si and SiO$_{2}$ are studied by observing the process parameters affecting the rate of deposition, and the quantitative properties at the interface of Si and SiO$_{2}$ are also considered briefly according to the results of the optical absorption and the voltage-current characteristic of MOS etc. using step etching procedure for oxide films.

• 대한전자공학회논문지
• /
• 제27권5호
• /
• pp.729-736
• /
• 1990

Oxide (RTO), nitrided-oxide(NO), and reoxidized-nitrided-oxide(ONO) films were formed by sequential rapid thermal processing. The film composition was investigated by Auger electron spectroscopy(AES). The Si/SiO2 interface and SiO2 surface are nitrided more preferentially than SiO2 bulk. When the NO is reoxidized, [N](atomic concentration of N) in the NO film decreased` especially, the decrease of [N] at the surface is considerable. The weaker the nitridation condition is, the larger the increase of thickness is as the reoxidation proceeds. The elelctrical characteristics of RTO, NO, and ONO films were evaluated by 1-V, high frequency (1 MHz) C-V, and high frequency C-V after constant current stress. The ONO film-which has 8 nm thick initial oxide, nitrided in NH3 at 950\ulcorner for 60 s, reoxidized in O2 at 1100\ulcorner for 60 s-shows good electrical characteristics such as higher electrical breakdown voltage and less variation of flat band voltage under high electric field than RTO, and NO films.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
• /
• pp.496-498
• /
• 2005

We reported that high dielectric hafnium oxide nano-film deposited by thermal atomic layer deposition on the poly-silicon film (poly-Si). The poly -Si film was produced by plasma enhanced chemical vapor deposition and excimer laser annealing. We used the hafniu m chloride ($HfCl_4$) and water as the precursors and analyzed the hafnium oxide film by transmission electron microscope and secondary ion mass spectrometer. Hafnium oxide produced by the ALD method showed very good coverage on the rough surface of poly-Si film. While deposited with 200 cycles, these hafnium oxide films revealed a relatively smooth surface and good uniformity, but the cumulative roughness produced by the incomplete reaction was apparent when the amount of deposition cycle increased to 600 cycles.

• 대한금속재료학회지
• /
• 제50권4호
• /
• pp.300-309
• /
• 2012

Low-carbon steels and a stainless steel were oxidized isothermally and cyclically between $1050^{\circ}C$ and $1200^{\circ}C$ for up to 100 min in air to find the effect of alloying elements of Si, Mn, Ni, and Cr on their oxidation. The most active alloying element of Si was scattered inside the oxide scale, at the scale-alloy interface and as internal oxide precipitates beneath the oxide scale. Manganese, which could not effectively improve the oxidation resistance, was rather uniformly distributed in the oxide scale. Nickel and chromium tended to present at the lower part of the oxide scale. Excessively thick porous scales formed on the low-carbon steels, whereas thin but non-adherent scales containing $Cr_2O_3$ formed on the stainless steel.

• 한국재료학회지
• /
• 제19권9호
• /
• pp.462-467
• /
• 2009

The Charge Trap Flash (CTF) memory device is a replacement candidate for the NAND Flash device. In this study, Pt/$Al_2O_3/La_2O_3/SiO_2$/Si multilayer structures with lanthanum oxide charge trap layers were fabricated for nonvolatile memory device applications. Aluminum oxide films were used as blocking oxides for low power consumption in program/erase operations and reduced charge transports through blocking oxide layers. The thicknesses of $SiO_2$ were from 30 $\AA$ to 50 $\AA$. From the C-V measurement, the largest memory window of 1.3V was obtained in the 40 $\AA$ tunnel oxide specimen, and the 50 $\AA$ tunnel oxide specimen showed the smallest memory window. In the cycling test for reliability, the 30 $\AA$ tunnel oxide sample showed an abrupt memory window reduction due to a high electric field of 9$\sim$10MV/cm through the tunnel oxide while the other samples showed less than a 10% loss of memory window for $10^4$ cycles of program/erase operation. The I-V measurement data of the capacitor structures indicated leakage current values in the order of $10^{-4}A/cm^2$ at 1V. These values are small enough to be used in nonvolatile memory devices, and the sample with tunnel oxide formed at $850^{\circ}C$ showed superior memory characteristics compared to the sample with $750^{\circ}C$ tunnel oxide due to higher concentration of trap sites at the interface region originating from the rough interface.

• The Korean Journal of Ceramics
• /
• 제2권3호
• /
• pp.125-130
• /
• 1996

Hematite iron ore and waste iron oxide sludge containing about 3-5 wt% $SiO_2$ were purified by three types of method developed on the basis of the Bayer process which is known as the purification process of bauxite ore. The basic principle of the developed methods lies in the fact that the impurities contained in the iron oxides, such as $SiO_2$ and $Al_2O_3$ are soluble in the alkaline reagents. Reaction of the raw materials with KOH was done in pressure vessel, at atmospheric pressure, and by both of these two. By the pressure vessel method $SiO_2$ content was reduced to below 0.5 wt% in the waste iron oxide sludge, while, in iron ore, $SiO_2$ remained at 2-3 wt%. The atmospheric pressure reaction rendered the waste iron oxide sludge $SiO_2$ content below 0.5wt% when the reaction temperature increased to above 90$0^{\circ}C$. The combined method of two previous methods was the most effective process and rendered the refined iron oxide about 300-400ppm of $SiO_2$. Using some refined iron oxides, Ba-ferrite was produced and magnetic properties were measured. The highest quality of magnetic properties obtained in this study were Br=2.09 G, bHc=1.99 KOe, iHc=4.54 KOe, $(BH)_{max}$=1.06 MGOe. Effect of sintering condition and chemical composition will be discussed.

• Journal of Welding and Joining
• /
• 제19권3호
• /
• pp.305-310
• /
• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제49권1호
• /
• pp.1-7
• /
• 2000

The SNOSFET memory devices with ultrathin ONO(tunnel oxide-nitride-blocking oxide) gate dielectric were fabricated using n-well CMOS process and investigated its characteristics. The thicknesses of tunnel oxide, nitride and blocking oxide were $23{\AA},\; 53{\AA}\; and\; 33{\AA}$, respectively. Auger analysis shows that the ONO layer is made up of $SiO_2(upper layer of blocking oxide)/O-rich\; SiO_x\N\_y$. It clearly shows that the converting layer with $SiO_x\N\_y(lower layer of blocking oxide)/N-rich SiO_x\N\_y(nitride)/O-rich SiO_x\N\_y(tunnel oxide)$. It clearly shows that the converting layer with $SiO_x\N\_y$ phase exists near the interface between the blocking oxide and nitride. The programming condition of +8 V, 20 ms, -8 V, 50 ms is determined and data retention over 10 years is obtained. Under the condition of 8 V programming, it was confirmed that the modified Fowler-Nordheim tunneling id dominant charge transport mechanism. The programmed threshold voltage is distributed less than 0.1 V so that the reading error of memory stated can be minimized. An $8\times8$ NAND type flash EEPROM with SONOSFET memory cell was designed and simulated with the extracted SPICE parameters. The sufficient read cell current was obtained and the upper limit of $V_{TH}$ for write state was over 2V.