• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.1 s.34
• /
• pp.47-52
• /
• 2005

Worldwide movement for prohibition of Pb usage drives imminent implementation of Pb-free solders in microelectronic packaging industry. Reliability information of Pb-free solders has not been completely constructed yet. One of the potential reliability concerns of Pb-free solders is allotropic transformation of Sn known as tin pest. Volume increase during the formation of tin pest could deteriorate the reliability of solder joints. It was also reported that the addition of soluble elements (i.e. Pb, Bi, and Sb) into Sn can effectively suppress the tin pest. However, the mechanical properties of the tin pest resistant alloys have not been studied in detail. In this study, lap shear creep test was conducted with Sn and Sn-0.7Cu based solder alloys doped with minor amount of Bi or Sb. Shear strain rates of the alloy were generally higher than those of Sn-3.5Ag based alloys. Rupture strains and corresponding Monkman- Grant products were largest for Sn-0.5Bi alloy and smallest for Sn-0.7Cu-0.5Sb alloy. Rupture surface Sn-0.5Bi alloy showed highly elongated $\beta$-Sn globules necked to rupture by shear stresses, while elongation of $\beta$-Sn globules of Sn-0.7Cu-0.5Sb alloy was relatively smaller.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.3
• /
• pp.55-61
• /
• 2000

Sn-37Pb and Sn-3.5Ag-0.7Cu solder balls of 0.3 mm diameter were reflow soldered with the variation of soldering peak temperature and conveyer speed of reflow machine. The peak temperatures far soldering were changed in the range of 220~$240^{\circ}C$ for Sn-37Pb and 230~$260^{\circ}C$ for Sn-3.5Ag-0.7Cu. As the results of experiments, optimum soldering condition for Sn-37Pb was $230^{\circ}C$ of soldering temp., 0.7~0.8 m/min of conveyer speed. The optimum condition for the Sn-3.5Ag-0.7Cu was $250^{\circ}C$ and 0.6 m/min. The maximum shear strength for the soldered joints of Sn-37Pb was 555 gf and of Sn-3.5Ag-0.7Cu was 617 gf. Thickness of the intermetallic compound Cu6Sn5 on the soldered interface was 1.13~1.45 $\mu\textrm{m}$ for Sn-37Pb and 2.5~4.3 $\mu\textrm{m}$ for Sn-3.5Ag-0.7Cu.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.2
• /
• pp.71-79
• /
• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• Journal of the Korean Ceramic Society
• /
• v.38 no.3
• /
• pp.287-292
• /
• 2001

본 실험은 목적은 CRT(Cathode Ray Tube)용 청색 형광체인 ZnS:Ag 분말 표면에 액상법으로 SnO$_2$를 균일하게 코팅하는 공정조건을 연구하는 것이다. 용매로서 물을 사용하고, Sn의 공급물질로서 SnCl$_4$.4$H_2O$, 침전 촉매로서 CO(NH$_2$)$_2$를 각각 사용하여, 균일 침전 방법으로 ZnS:Ag 분말표면에 SnO$_2$를 코팅할 수 있었다. 초기에 첨가되는 SnCl$_4$.4$H_2O$의 량이 Sn/Zn의 몰비기준으로 0.017인 경우에 ZnS:Ag 분말표면에 Sn(OH)$_4$가 균일하게 코팅되지만, 그 이상 첨가되면 과량의 Sn(OH)$_4$가 입자들 사이에 응집되었다. 코팅된 Sn(OH)$_4$는 비정질 구조로 규명되었으며, 이를 SnO$_2$결정상으로 전이시키기 위하여 300~$700^{\circ}C$ 범위 내에서 열처리를 행하였다. 비정질 Sn(OH)$_4$는 20$0^{\circ}C$이하에서 탈수되었고 45$0^{\circ}C$부터 SnO$_2$로 결정화되기 시작하였다. 순수한 ZnS의 경우, 50$0^{\circ}C$이하에서는 상변화가 없으나, $600^{\circ}C$에서 일부 산화되었으며 $700^{\circ}C$에서는 완전히 ZnO로 산화되므로, ZnS의 산화방지 및 SnO$_2$의 결정화를 동시에 만족하는 최고 열처리온도는 50$0^{\circ}C$로 규명되었다. 그러나 ZnS에 SnO$_2$가 코팅된 시편의 경우에는 $600^{\circ}C$가 되어도 ZnS 상이 거의 산화되지 않았고, $700^{\circ}C$에서도 ZnS와 ZnO 상이 공존한 것으로 보아 SnO$_2$코팅이 ZnS의 산화를 억제하는 것으로 나타났다.

• Journal of Korea Foundry Society
• /
• v.31 no.6
• /
• pp.362-365
• /
• 2011

In the present work, the corrosion properties of Mg-xSn (x = 1, 3, 5, 7 and 9 wt.%) alloys have been investigated. Potentiodynamic polarization and immersion tests were carried out in 3.5% NaCl solution of pH 7.2 at room temperature to measure the corrosion properties of Mg-xSn (x = 1, 3, 5, 7 and 9 wt.%) alloys. With increase of the Sn contents, the volume fraction of the $Mg_2Sn$ phase was increased. The corrosion rate of Mg-xSn alloys was increased up to 7 wt.%Sn and decreased above 9 wt.%Sn. Initiation of galvanic site during immersion mainly occurred at Mg/$Mg_2Sn$ interface and propagation went into ${\alpha}$-Mg. For this reason, corrosion properties of Mg-xSn (added from 1 wt.%Sn to 7 wt.%Sn alloys) alloys are decreased because the galvanic site was increased with increasing Sn addition. In Mg-9wt.%Sn alloy, however, the corrosion site were changed from Mg/$Mg_2Sn$ interface to ${\alpha}$-Mg/$M_2Sng$ interface in lamellar structure. Preferentially corrosion of ${\alpha}$-Mg/$M_2Sn$ interface in lamellar structure impeded corrosion propagation went into ${\alpha}$-Mg.

• Journal of Welding and Joining
• /
• v.23 no.3
• /
• pp.61-67
• /
• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.4
• /
• pp.37-43
• /
• 2006

Surface roughness and hardness of the electroplated Sn were characterized with variations of electroplating current density and current mode. The Sn electroplated at $5{\sim}50mA/cm^{2}$ exhibited the surface roughness of $2.0{\sim}2.4{\mu}m$. The Sn electroplated with pulse current mode exhibited low surface roughness compared one processed with direct current mode. With surface annealing at $300^{\circ}C$ for 3 sec using halogen lamp, surface roughness of the Sn bump was substantially reduced to $1{\mu}m$. The Sn electroplated at $5{\sim}50mA/cm^{2}$ exhibited the hardness of 10 Hv. Low contact resistances of $33{\sim}17m{\Omega}$ were obtained for specimens flip-chip bonded with Sn bumps.

• The korean journal of orthodontics
• /
• v.12 no.1
• /
• pp.21-26
• /
• 1982

This study was undertaken to document relations between facial skeletal pattern and dental occlusion. The data in .this study were collected from pretreatment cephalometric radiographs and study models of patients' records present in the files of Orthodontic Department, Seoul National University Hospital. Patients were selected on the basis of a mandibular plane-sella nasion angle equal to or greater than $38^{\circ}$ (high SN-MP angle) or equal to or less than $26^{\circ}$ (low SN-MP angle). Patients in the mixed dentition and with missing permanent teeth were excluded for ease of assessing tooth size / arch circumference relationships and then 30 high SN-MP and 11 low SN-MP patients were selected among them. The mean age of these two groups of patients was high SN-MP, $12.8{\pm}1.23$ years and low SN-MP, $13.0{\pm}1.48$ years. The following conclusions were obtained. 1. In the maxilla and mandible the mean tooth size of high SN-MP patients was nearlly identical to the low SN-MP patients. 2. The mean maxillary arch circumference was increased in low SN-MP group compared with high SN-MP group and a smilar, but smaller, mean increase was present in mandible. 3. The difference between the mean maxillary circumference required and the mean maillary circumference present ranged from -4.8mm in the high SN-MP group to -1.3mm in the low SN-MP group. A small range of means occurred in the mandible (high SN-MP: -4.0mm to low SN-MP: -1.8mm). 4. In the maxilla and mandible the mean arch length was nearly identical in the high and low SN-MP groups. 5. The mean incisor inclination was increased as the SN-MP angle decreased in the maxilla and mandible. 6. The men distance of the maxillary first molar from anterior border of the pterygomaxillary fissure was nearly similar between high and low groups. 7. The mean mandibular intermolar width was increased from high SN-MP to low SN-MP patients.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.8 no.3
• /
• pp.487-492
• /
• 1998

Ultrafine particles of $SnO_2$ or $(Sn,Ti)O_2$ and thin films of $SnO_2$ were synthesized by introducing aqueous tin chloride solution into a high temperature argon inductively coupled plasma (ICP) generated under ambient pressure (the spray-ICP technique). As-deposited $SnO_2$ particles from each concentration of solution were all tetragonal $SnO_2$ crystallline phase and their mean size decreased in proportion to the increase of solution concentration. The mean size of $SnO_2$ particles was in the 10~40 nm range.

• Journal of Korea Foundry Society
• /
• v.21 no.2
• /
• pp.135-140
• /
• 2001

Microstructure of the bell made with Cu-Sn alloys was examined by optical and scanning electron microscope and that analyzed quantitatively with image analyzer. Also acoustic characteristics of the bells were measured in detail by using FFT type power spectrum analyzer. ${\alpha}-single$ phases of large grains only were observed in Cu-5%Sn alloy. However mixed structure of primary ${\alpha}-phase$ and eutectoid of ${\alpha}+{\delta}%_o$ was existed in the Cu-Sn alloys with more than 9%Sn. Also the area fraction of eutectoid phases gradually increased with an increased Sn content. From the result of acoustic test, it was found that frequency and tonal intensity decreased with the increased Sn content from 5%Sn to 11%Sn, and those were rather increased with further increase of that. The lowest frequency and tonal intensity were showed in Cu-11%Sn, and porosity decreased considerably frequency and tonal intensity of the bells.