Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 13 Issue 4
- /
- Pages.37-43
- /
- 2006
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
Surface Roughness of the Electroplated Sn with Variations of Electrodeposition Parameters and Contact Resistance of the Flip-chip-bonded Sn Bumps
Electrodeposition 변수에 따른 Sn 도금의 표면 거칠기와 플립칩 접속된 Sn 범프의 접속저항
- Jung, Boo-Yang (Department of Materials Science and Engineering, Hongik University) ;
- Park, Sun-Hee (Department of Materials Science and Engineering, Hongik University) ;
-
Kim, Young-Ho
(Division of Materials Science and Engineering, Hanyang University) ;
-
Oh, Tae-Sung
(Department of Materials Science and Engineering, Hongik University)
- Published : 2006.12.30
Abstract
Surface roughness and hardness of the electroplated Sn were characterized with variations of electroplating current density and current mode. The Sn electroplated at
플립칩 공정에 Sn 범프를 적용하기 위해 도금전류밀도와 전류모드에 따른 Sn 도금막의 표면 거칠기와 경도를 측정하였다. 전류밀도