• Title/Summary/Keyword: RF Components

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DC and RF Characteristics of 100-nm mHEMT Devices Fabricated with a Two-Step Gate Recess (2단계 게이트 리세스 방법으로 제작한 100 nm mHEMT 소자의 DC 및 RF 특성)

  • Yoon, Hyung Sup;Min, Byoung-Gue;Chang, Sung-Jae;Jung, Hyun-Wook;Lee, Jong Min;Kim, Seong-Il;Chang, Woo-Jin;Kang, Dong Min;Lim, Jong Won;Kim, Wansik;Jung, Jooyong;Kim, Jongpil;Seo, Mihui;Kim, Sosu
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.30 no.4
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    • pp.282-285
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    • 2019
  • A 100-nm gate-length metamorphic high electron mobility transistor(mHEMT) with a T-shaped gate was fabricated using a two-step gate recess and characterized for DC and microwave performance. The mHEMT device exhibited DC output characteristics having drain current($I_{dss}$), an extrinsic transconductance($g_m$) of 1,090 mS/mm and a threshold voltage($V_{th}$) of -0.65 V. The $f_T$ and $f_{max}$ obtained for the 100-nm mHEMT device were 190 and 260 GHz, respectively. The developed mHEMT will be applied in fabricating W-band monolithic microwave integrated circuits(MMICs).

A Subthreshold CMOS RF Front-End Design for Low-Power Band-III T-DMB/DAB Receivers

  • Kim, Seong-Do;Choi, Jang-Hong;Lee, Joo-Hyun;Koo, Bon-Tae;Kim, Cheon-Soo;Eum, Nak-Woong;Yu, Hyun-Kyu;Jung, Hee-Bum
    • ETRI Journal
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    • v.33 no.6
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    • pp.969-972
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    • 2011
  • This letter presents a CMOS RF front-end operating in a subthreshold region for low-power Band-III mobile TV applications. The performance and feasibility of the RF front-end are verified by integrating with a low-IF RF tuner fabricated in a 0.13-${\mu}m$ CMOS technology. The RF front-end achieves the measured noise figure of 4.4 dB and a wide gain control range of 68.7 dB with a maximum gain of 54.7 dB. The power consumption of the RF front-end is 13.8 mW from a 1.2 V supply.

ETRI 0.25μm GaN MMIC Process and X-Band Power Amplifier MMIC (ETRI 0.25μm GaN MMIC 공정 및 X-대역 전력증폭기 MMIC)

  • Lee, Sang-Heung;Kim, Seong-Il;Ahn, Ho-Kyun;Lee, Jong-Min;Kang, Dong-Min;Kim, Dong Yung;Kim, Haecheon;Min, Byoung-Gue;Yoon, Hyung Sup;Cho, Kyu Jun;Jang, Yoo Jin;Lee, Ki Jun;Lim, Jong-Won
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.1
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    • pp.1-9
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    • 2017
  • In this paper, ETRI's $0.25{\mu}m$ GaN MMIC process is introduced and the fabricated results of X-Band 3 W power amplifier MMIC are discussed. The one-stage X-Band 3 W power amplifier MMIC using the $0.25{\mu}m$ GaN MMIC devices has been designed and fabricated. From the fabricated GaN MMIC, the characteristics of the $0.25{\mu}m$ GaN MMIC process and devices are evaluated and analyzed. The X-band power amplifier MMIC shows output power of 3.5 W, gain of 10 dB, and power-added efficiency of 35 %.

0.25 μm AlGaN/GaN HEMT Devices and 9 GHz Power Amplifier (0.25 μm AlGaN/GaN HEMT 소자 및 9 GHz 대역 전력증폭기)

  • Kang, Dong-Min;Min, Byoung-Gue;Lee, Jong-Min;Yoon, Hyung-Sup;Kim, Sung-Il;Ahn, Ho-Kyun;Kim, Dong-Young;Kim, Hae-Cheon;Lim, Jong-Won;Nam, Eun-Soo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.1
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    • pp.76-79
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    • 2016
  • This paper describes the successful development and the performance of X-band 50 W pulsed power amplifier using a 50 W GaN-on-SiC high electron mobility transistor. The GaN HEMT with a gate length of $0.25{\mu}m$ and a total gate width of 12 mm were fabricated. The X-band pulsed power amplifier exhibited an output power of 50 W with a power gain of 6 dB in a frequency range of 9.2~9.5 GHz. It also shows a maximum output power density of 4.16 W/mm. This 50 W GaN HEMT and X-band 50 W pulsed power amplifier are suitable for the radar systems and related applications in X-band.

RF MEMS Devices for Wireless Applications

  • Park, Jae Y.;Jong U. Bu;Lee, Joong W.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.1 no.1
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    • pp.70-83
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    • 2001
  • In this paper, the recent progress of RF MEMS research for wireless/mobile communications is reviewed. The RF MEMS components reviewed in this paper include RF MEMS switches, tunable capacitors, high Q inductors, and thin film bulk acoustic resonators (TFBARs) to become core components for constructing miniaturized on chip RF transceiver with multi-band and multi-mode operation. Specific applications are also discussed for each of these components with emphasis on for miniaturization, integration, and performance enhancement of existing and future wireless transceiver developments.

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Silicon Micromachined RF Components: Review

  • Yook, Jong-Gwan
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.199-202
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    • 1999
  • In this paper, a possibility of building various types of RF passive components using the silicon micromachining technique has been examined with special emphasis on the wireless and mobile communication applications. Silicon micromachining technique is compatible with conventional silicon IC process and could provide a possibility of integrating base-band signal processing units and RF passive and active circuit components all in one silicon wafer rendering implementation of system-on-chip paradigm for future mobile and wireless communication systems.

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High Voltage β-Ga2O3 Power Metal-Oxide-Semiconductor Field-Effect Transistors (고전압 β-산화갈륨(β-Ga2O3) 전력 MOSFETs)

  • Mun, Jae-Kyoung;Cho, Kyujun;Chang, Woojin;Lee, Hyungseok;Bae, Sungbum;Kim, Jeongjin;Sung, Hokun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.3
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    • pp.201-206
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    • 2019
  • This report constitutes the first demonstration in Korea of single-crystal lateral gallium oxide ($Ga_2O_3$) as a metal-oxide-semiconductor field-effect-transistor (MOSFET), with a breakdown voltage in excess of 480 V. A Si-doped channel layer was grown on a Fe-doped semi-insulating ${\beta}-Ga_2O_3$ (010) substrate by molecular beam epitaxy. The single-crystal substrate was grown by the edge-defined film-fed growth method and wafered to a size of $10{\times}15mm^2$. Although we fabricated several types of power devices using the same process, we only report the characterization of a finger-type MOSFET with a gate length ($L_g$) of $2{\mu}m$ and a gate-drain spacing ($L_{gd}$) of $5{\mu}m$. The MOSFET showed a favorable drain current modulation according to the gate voltage swing. A complete drain current pinch-off feature was also obtained for $V_{gs}<-6V$, and the three-terminal off-state breakdown voltage was over 482 V in a $L_{gd}=5{\mu}m$ device measured in Fluorinert ambient at $V_{gs}=-10V$. A low drain leakage current of 4.7 nA at the off-state led to a high on/off drain current ratio of approximately $5.3{\times}10^5$. These device characteristics indicate the promising potential of $Ga_2O_3$-based electrical devices for next-generation high-power device applications, such as electrical autonomous vehicles, railroads, photovoltaics, renewable energy, and industry.

Characteristics of MHEMT Devices Having T-Shaped Gate Structure for W-Band MMIC (W-Band MMIC를 위한 T-형태 게이트 구조를 갖는 MHMET 소자 특성)

  • Lee, Jong-Min;Min, Byoung-Gue;Chang, Sung-Jae;Chang, Woo-Jin;Yoon, Hyung Sup;Jung, Hyun-Wook;Kim, Seong-Il;Kang, Dong Min;Kim, Wansik;Jung, Jooyong;Kim, Jongpil;Seo, Mihui;Kim, Sosu
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.2
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    • pp.99-104
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    • 2020
  • In this study, we fabricated a metamorphic high-electron-mobility transistor (mHEMT) device with a T-type gate structure for the implementation of W-band monolithic microwave integrated circuits (MMICs) and investigated its characteristics. To fabricate the mHEMT device, a recess process for etching of its Schottky layer was applied before gate metal deposition, and an e-beam lithography using a triple photoresist film for the T-gate structure was employed. We measured DC and RF characteristics of the fabricated device to verify the characteristics that can be used in W-band MMIC design. The mHEMT device exhibited DC characteristics such as a drain current density of 747 mA/mm, maximum transconductance of 1.354 S/mm, and pinch-off voltage of -0.42 V. Concerning the frequency characteristics, the device showed a cutoff frequency of 215 GHz and maximum oscillation frequency of 260 GHz, which provide sufficient performance for W-band MMIC design and fabrication. In addition, active and passive modeling was performed and its accuracy was evaluated by comparing the measured results. The developed mHEMT and device models could be used for the fabrication of W-band MMICs.

High Integration Packaging Technology for RF Application

  • Lee, Young-Min
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 1999.12a
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    • pp.127-154
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    • 1999
  • Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

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$S^{35}$(1,2-dichloro vinyl) L-Cysteine의 소에 의(依)한 대사물(代謝物)의 분리(分離)

  • Kim, Jae-Uk
    • Applied Biological Chemistry
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    • v.2
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    • pp.36-39
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    • 1961
  • It has been ascertained that S-(1, 2-dichlorovinyl) L-cysteine (DCVC) is probably the toxic component in the trichloro-ethylene extracted soybean oil meal on the bovine. For the study of the metabolites of DCVC, the components with radioactive $S^{35}$-in the urine of the calf, to which $S^{35}$-DCVC was administrated, were separated using of cellulose powder with propanol-water (70:30 V/V) which is easily removable by evaporation. As the results followings were obtained: Peak 1, which shows fractions containing single $S^{35}$-radioactive components, whose Rf is 0.815 Peak 2, which shows fractions containing jingle $S^{35}$-radioactive component, whose Rf is 0.447 Peak 3, which shows fractions containing both $S^{35}$-radioactive components whose Rfs are 0.090 and 0.171 Peak 4, which shows fractions containing single $S^{35}$-radioactive component, whose Rf is 0.142. Peak 5, which shows fractions containing single $S^{35}$-radioactive component, whose Rf is 0.084. Besides these, two of small peak were obtained. Although, the resolving power of the cellulose powder column is not sufficient, it is applicable for the study of the components of metabolytes of DCVC conveniently with the rest of removable solvent easily. Also the components with radioactive $S^{35}$ in the feces of the calf were separated using citrate buffer gradient system of Moore and stein. As the results; three $S^{35}$-radioactive components were separated.

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