Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 1999.06a
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- Pages.199-202
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- 1999
Silicon Micromachined RF Components: Review
Abstract
In this paper, a possibility of building various types of RF passive components using the silicon micromachining technique has been examined with special emphasis on the wireless and mobile communication applications. Silicon micromachining technique is compatible with conventional silicon IC process and could provide a possibility of integrating base-band signal processing units and RF passive and active circuit components all in one silicon wafer rendering implementation of system-on-chip paradigm for future mobile and wireless communication systems.
Keywords