• Transactions on Electrical and Electronic Materials
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• 제11권4호
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• pp.174-177
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• 2010

We have developed an environment-friendly etching process, an alternative to the dichromic acid etching process, as a pretreatment of acrylonitrile-butadiene-styrene (ABS) plastic for electroless plating. In order to plate ABS plastic in an electroless way, there should be fine holes on the surface of the ABS plastic to enhance mechanically the adhesion strength between the plastic surface and the plate. To make these holes, the surface was coated uniformly with dispersed chemical foaming agents in a mixture of environmentally friendly dispersant and solvent by the methods of dipping or direct application. The solvent seeps into just below the surface and distributes the chemical foaming agents uniformly beneath the surface. After drying off the surface, the surface was heated at a temperature well below the glass transition temperature of ABS plastic. By pyrolysis, the chemical foaming agents made fine holes on the surface. In order to discover optimum conditions for the formation of fine holes, the mixing ratio of the solvent, the dispersant and the chemical foaming agent were controlled. After the etching process, the surface was plated with nickel. We tested the adhesion strength between the ABS plastic and nickel plate by the cross-cutting method. The surface morphologies of the ABS plastic before and after the etching process were observed by means of a scanning electron microscope.

• 한국표면공학회지
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• 제57권1호
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• pp.14-21
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• 2024

For this study, CrAlN multilayer coatings were deposited on SKD61 substrates using a multi-arc ion plating technique. The structural characteristics of the CrAlN multilayer coatings were evaluated using X-ray diffraction (XRD) and Scanning Electron Microscopy (SEM). Additionally, the adhesion of the coatings was assessed through scratch testing, and the mechanical strength was evaluated using nanoindentation and tribometric tests for frictional properties. The results show that the CrAlN multilayer coatings possess a uniform and dense structure with excellent mechanical strength. Hardness measurements indicated that the CrAlN coatings have high hardness values, and both the coating adhesion and wear resistance were found to be improved compared to CrN. The addition of aluminum is anticipated to contribute to enhanced durability and wear resistance.

• 한국세라믹학회지
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• 제31권7호
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• pp.731-738
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• 1994

TiN films were deposited on high speed steels by plasma assisted chemical vapor deposition (PACVD), cathode arc ion plating (CAIP) and reactive magnetron sputtering (RMS). The properties of the films deposited by the three different methods were compared. The preferred oriented plane of PACVD-TiN is (200) and those of CAIP-TiN and RMS-TiN are (111). PACVD-TiN shows a dome surface and a microstructure having small grains. CAIP-TiN shows the highest microhardness and the best adhesion strength of the three because it has a dense microstructure and an ill-defined interface. But is shows the greatest surface roughness due to the Ti droplet created by the arc. RMS-TiN shows a microstructure having large voids so that its properties in microhardness and adhesion are the worst of the three.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.49-53
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• 2002

The Sn-Cu eutectic solder bump formation ($140{\mu}{\textrm}{m}$ diameter, $250{\mu}{\textrm}{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Cu deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased with increasing time. The plating rate increased generally according to current density. After the characteristics of Sn-Cu plating were investigated, Sn-Cu solder bumps were fabricated on optimal condition of 5A/dm$^2$, 2hrs. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallization). The shear strength of Sn-Cu bump after reflow was higher than that of before reflow.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1996년도 재료학회 추계학술발표회
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• pp.75-75
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• 1996

• 한국재료학회:학술대회논문집
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• 한국재료학회 2000년도 추계학술발표강연 및 논문개요집
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• pp.54-54
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• 2000

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 춘계학술발표회 초록집
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• pp.45-47
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• 2003

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.110-114
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• 2011

Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

• Journal of Electrochemical Science and Technology
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• 제8권3호
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• pp.215-221
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• 2017

The electroless plating process largely consists of substrate cleaning, seed formation (activator formation), and electroless plating. The most widely used activator in the seed formation step is Pd, and Sn ions are used to facilitate the formation of this Pd seed layer. This is problematic because the Sn ions interfere with the reduction of Cu ions during electroless plating; thus, the Sn ions must be removed by a hydrochloric acid cleaning process. This method is also expensive due to the use of Pd. In this study, Cu electroless plating was performed by forming a seed layer using a silver nanosol instead of Pd and Sn. The effects of the Ag nanosol concentration in the pretreatment solution and the pretreatment time on the thickness and surface morphology of the Cu layer were investigated. The degrees of adhesion to the substrate were similar for the electroless-plated Cu layers formed by conventional Pd activation and those formed by the Ag nanosol.

• 한국표면공학회지
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• 제29권2호
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.