• 한국재료학회지
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• 제7권1호
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• pp.27-32
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• 1997

본 연구에서는 고밀도 플라즈마를 형성하는 planar magnetron RF 플라즈마 CVD를 이용하여 DLC(diamond-like carbon) 박막을 합성하였다. 이 방법을 이용하여 DLC 박막을 합성한다면 고밀도 플라즈마 때문에 종래의 플라즈마 CVD(RF-PECVD)법보다 증착속도가 더욱더 향상될 것이라는 것에 착안하였다. 이를 위해 magnetron에 의한 고밀도 플라즈마가 존재할 때도 역시 DLC박막형성에 미치는 RF 전력과 반응가스 압력이 중요한 반응변수인가에 대해 조사하였고, 일정한 자기장의 세기에서 RF전력과 DC self-bias 전압과의 관계를 조사하였다. 또한 RF전력변화에 따른 박막의 증착속도와 밀도를 측정하였다. 본 연구에 의해 얻어진 박막의 증착속도는 magnetron에 의한 이온화율이 매우 높아 기존의 RF-PECVD 법보다 매우 빠르며, DLC박막의 구조와 물질특성을 알아보기 위해 FTIR(fourier transform infrared)및 Raman 분광분석을 행한 결과 전형적인 양질의 고경질 다이아몬드상 탄소박막임을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.161-162
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• 2006

Scaling rules for TFT application devices have led to the necessity of ultra thin dielectric films and high-k dielectric layers. In this paper, The advantages of high concentration of nitrogen in silicon oxide layer deposited by using $N_2O$ in Inductively Coupled Plasma Chemical Vapor Deposition (ICP-CVD) reported about Ellipsometric measurement, Capacitance-Voltage characterization and processing conditions.

• 한국표면공학회지
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• 제32권3호
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• pp.303-306
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• 1999

On the effect of substrate bias at first stage of diamond synthesis at lower substrate temperature(approximately 673K) using microwave plasma CVD and effect of reaction gas system for the bias enhanced nucleation were studied. The reaction gas was mixture of methane and hydrogen or carbon monoxide and hydrogen. The nucleation density of applied bias -150V using $CH_4-H_2$ reaction gas system, significantly higher than that of $C-H_2$ reaction gas system. When the $CH_4-H_2$ reaction was used, nucleation density was increased because of existence of SiC as a interface for diamond nucleation. By use of this negative bias effect for fabrication of CVD diamond film using two-step diamond growth without pre-treatment, fabrication of the diamond film consist of diamond grains $0.2\mu\textrm{m}$ in diameter was demonstrated

• 대한치과교정학회지
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• 제36권6호
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• pp.451-464
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• 2006

본 연구는 항 교정장치의 개발에 도움이 되고자 이산화티탄 광촉매의 코팅 시 안정적이고 효과적인 방법을 찾기 위하여 시행되었다. 시판되고 있는 교정용 와이어와 브라켓에 sol-gel법, CVD (Chemical Vapor Deposition)법 및 PE-CVD (Plasma Enhanced-CVD)법으로 이산화티탄을 각각 코팅한 다음 각 방법으로 코팅된 이산화티탄 박막의 특성을 알아보고자 주사전자현미경을 이용하여 각 시편의 코팅박막 표면의 거칠기를 관찰하였고 adhesive tape pull test를 이용하여 코팅박막의 접착강도를 측정하였다. 메틸렌블루용액에 각 시편을 침지시킨 후 시간경과에 따른 메틸렌블루용액의 농도변화 측정을 통해 코팅박막의 분해능을 평가하였으며 불화나트륨 용액에 각 시편을 침지시킨 후 주사전자현미경을 이용하여 표면부식 정도를 관찰함으로써 불소화합물에 대한 내부식성을 평가하여 다음과 같은 결과를 얻었다. 코팅박막의 표면은 CVD법 및 PE-CVD법이 sol-gel법이나 코팅되지 않은 시편에 비해 더 매끄러웠다. 코팅박막의 접착강도는 PE-CVD법이 가장 높았고, CVD법, sol-gel법의 순으로 낮게 나타났다. 코팅박막의 메틸렌블루 분해능은 PE-CVD법이 가장 높았고, CVD법, sol-gel법의 순으로 낮게 나타났다. 코팅박막의 불소화합물에 대한 내부식성은 CVD법 및 PE-CVD법이 sol-gel법에 비해 높게 나타났다. 이상의 결과는 교정용 와이어 및 브라켓의 이산화티탄 광촉매 코팅 시 CVD법 및 PE-CVD법이 sol-gel법보다 적절한 방법임을 시사하였다.

• 한국재료학회지
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• 제15권4호
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• pp.246-251
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• 2005

Plasma enhanced chemical vapor deposition(PE-CVD) method has an advantage in synthesizing carbon nanotubes(CNTs) at lower temperature compared with thermal enhanced chemical vapor deposition(TE-CVD) method. In this study, CNTs was prepared by using PE-CVD method. The growth rate of CNT was faster more than 100 times on using Invar alloy than iron as catalyst. It was found that chrome silicide was formed at the interface between chrome layer and silicon substrate which should be considered in designing process. Nanoparticles of Invar catalyst were found oxidized on their surfaces with a depth of 10 m. Microstructure was analyzed by scanning electron microscopy, transmission electron microscopy, scanning transmission electron microscopy, and energy dispersive x-ray spectrometry. Based on the result of analysis, growth mechanism at an initial stage was suggested.

• 한국표면공학회지
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• 제29권5호
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• pp.540-544
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• 1996

To apply the CVD diamond film to coated tools, it is necessary to make adhesion strength between diamond film and substrate stronger. So adhesion strength of diamond coated WC-Co tools using Microwave Plasma CVD and cutting test of Al-18mass%Si alloy using diamond cutting tools were studied. Diamond coating was carried out using Microwave Plasma CVD apparatus. Reaction gas was used mixture of methane and hydrogen. Substrate temperature were varied from 673K to 1173K by control of microwave output power and reaction pressure. By observation of SEM, grain size became larger and larger as substrate temperature became higher and higher. Also all deposits were covered with clear diamond crystals. XRD results, the deposits were identified to cubic diamond. An analysis using Raman spectroscopy, the deposit synthesized at lower substrate temperature (673K) showed higher quality than deposit synthesized at higher substrate temperature (1173K). As a result of scratch adhesion strength test, from 873K to 1173K adhesion strength decreased by rising of substrate temperature. The deposit synthesized at 873K showed best adhesion strength. In the cutting test of Al-18mass%Si alloy using diamond coated tools and the surface machinability of Al-Si works turned with diamond coating tools which synthesized at 873K presented uniform roughness. Cutting performance of Al-18mass%Si alloys using diamond coated WC-Co tools related to the adhesion strength.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 춘계학술발표회 초록집
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• pp.144-145
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• 1999

• 한국재료학회:학술대회논문집
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• 한국재료학회 1993년도 춘계학술발표회
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• pp.83-84
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• 1993

• Journal of Electrical Engineering and Technology
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• 제2권4호
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• pp.532-536
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• 2007

Carbon nanotube (CNT) properties, produced using a magnetic null discharge (MND) plasma production technology, were investigated. We firstly deposited the Fe layer 200 nm in thickness on Si substrate by the magnetic null discharge sputter method at the substrate temperature of $300도C$, and then prepared CNTs on the catalyst layer by using the magnetic null discharge (MND) based CVD method. CNTs were deposited in a gas mixture of CH4 and N2 at a total pressure of 1 Torr by the MND-CVD method. The substrate temperature and the RF power were $650^{\circ}C$ and 600W, respectively. The characterization data indicated that the proposed source could synthesize CNTs even under relatively severe conditions for the magnetic null discharge formation.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1175-1180
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• 2003

Transformer Coupled Plasma Chemical Vapor Deposited (TCP-CVD) silicon nitride (SiNx) is widely used as a gate dielectric material for thin film transistors (TFT). This paper reports the SiNx films, grown by TCP-CVD at the low temperature (30$0^{\circ}C$). Experimental investigations were carried out for the optimization o(SiNx film as a function of $N_2$/SiH$_4$ flow ratio varying ,3 to 50 keeping rf power of 200 W, This paper presents the dielectric studies of SiNx gate in terms of deposition rate, hydrogen content, etch rate and leakage current density characteristics lot the thin film transistor applications. And also, this work investigated means to decrease the leakage current of SiNx film by employing $N_2$ plasma treatment. The insulator layers were prepared by two step process; the $N_2$ plasma treatment and then PECVD SiNx deposition with SiH$_4$, $N_2$gases.