• 한국전기전자재료학회논문지
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• 제29권5호
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• pp.263-267
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• 2016

In this paper, we analyzed the electrical characteristics of NPT planar and trench gate IGBT after designing these devices according to design and process parameter. To begin with, we have designed NPT planar gate IGBT and carried out simulation with T-CAD. Therefore, we extracted design and process parameter and obtained optimal electrical characteristics. The breakdown voltage was 724 V and The on state voltage drop was 1.746 V. The next was carried out optimal design of trench gate power IGBT. We did this research by same drift thickness and resistivity of planar gate power IGBT. As a result of experiment, we obtain 720 V breakdown voltage, 1.32 V on state voltage drop and 4.077 V threshold voltage. These results were improved performance and fabrication of trench gate power IGBT and planar gate Power IGBT.

• 한국전기전자재료학회논문지
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• 제29권11호
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• pp.681-684
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• 2016

This research was carried out experiments of variety IGBTs for industrial inverter and electric vehicle. The devices for this paper were planar gate IGBT, trench gate IGBT and dual gate IGBT and we designed using same design and process parameters. As a result of experiments, the electrical characteristics of planar gate IGBT were 1,459 V of breakdown voltage, 4.04 V of threshold voltage and 4.7 V of on-state voltage drop. And the electrical characteristics of trench gate IGBT were 1,473 V of breakdown voltage, 4.11 V of threshold voltage and 3.17 V of on-state voltage drop. Lastly, the electrical characteristics of dual gate IGBT were 1,467 V of breakdown voltage, 4.14 V of threshold voltage and 3.08V of on-state voltage drop. We almost knew that the trench gate IGBT was superior to dual gate IGBT in terms of breakdown voltage. On the other hand, the dual gate IGBT was better than the trench gate IGBT in terms of on state voltage drop.

• 한국전기전자재료학회논문지
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• 제25권4호
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• pp.253-260
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• 2012

IGBT (insulated gate bipolar transistor) have received wide attention because of their high current conduction and good switching characteristics. To reduce the power loss of IGBT, the on state voltage drop should be lowered and the switching time should be shorted. However, there is Trade-off between the breakdown voltage and the on state voltage drop. To achieving good electrical characteristics, field stop IGBT (FS IGBT) is proposed. In this paper, 1,200 V planar gate non punch-through IGBT (planar gate NPT IGBT), planar gate FS IGBT and trench gate FS IGBT is designed and optimized. The simulation results are compared with each three structures. In results, we optain optimal design parameters and confirm excellence of trench gate FS IGBT. Experimental result by using medici, shows 40% improvement of on state voltage drop.

• Transactions on Electrical and Electronic Materials
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• 제17권1호
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• pp.50-55
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• 2016

In this paper, we have analyzed the electrical characteristics of 1200V trench gate field stop IGBT and have compared to NPT planar type IGBT and NPT planar field stop IGBT. As a result of analyzing, we obtained superior electrical characteristics of trench gate field stop IGBT than conventional IGBT. To begin with, the breakdown voltage characteristic was showed 1,460 V and on state voltage drop was showed 0.7 V. We obtained 3.5 V threshold voltage, too. To use these results, we have extracted optimal design and process parameter and designed trench gate field stop IGBT. The designed trench gate IGBT will use to inverter of renewable energy and automotive industry.

• 한국전기전자재료학회논문지
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• 제26권10호
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• pp.720-725
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• 2013

Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have analyzed trench process, field limit ring process for fabrication of unified trench gate power MOSFET. And we have analyzed electrical characteristics of fabricated unified trench gate power MOSFET. The optimal trench process was based on SF6. After we carried out SEM measurement, we obtained superior trench gate and field limit ring process. And we compared electrical characteristics of planar and trench gate unified power MOSFET after completing device fabrication. As a result, the both of them was obtained 500 V breakdown voltage. However trench gate unified power MOSFET was shown improved Vth and on state voltage drop characteristics than planar gate unified power MOSFET.

• 한국전기전자재료학회논문지
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• 제26권10호
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• pp.713-719
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• 2013

Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have optimal designed planar and trench gate power MOSFET for high breakdown voltage and low on resistance. When we have designed $6,580{\mu}m{\times}5,680{\mu}m$ of chip size and 20 A current, on resistance of trench gate power MOSFET was low than planar gate power MOSFET. The on state voltage of trench gate power MOSFET was improved from 4.35 V to 3.7 V. At the same time, we have designed unified field limit ring for trench gate power MOFET. It is Junction Termination Edge type. As a result, we have obtained chip shrink effect and low on resistance because conventional field limit ring was convert to unify.

• 전기전자학회논문지
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• 제21권1호
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• pp.1-6
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• 2017

본 논문에서는 플래너 게이트 및 트렌치 게이트의 구조를 동시에 가지고 있는 1200V급 이중 게이트 IGBT 소자를 제안함과 동시에 전기적인 특성을 분석하였으며, 분석된 결과를 가지고 플래너 게이트 및 트렌치 게이트 IGBT 소자의 전기적인 특성과 비교 분석하였다. 이중 게이트 IGBT 소자를 설계하는데 있어 문턱전압 및 온 상태 전압 강하에 영향을 주는 P-베이스 영역에 있어 P-베이스에 깊이는 트렌치 게이트 소자 영역에 영향을 주며, P-베이스에 너비는 플래너 게이트 소자 영역에 영향을 주는 것을 확인할 수 있었다. 본 연구에서 제시한 이중 게이트 IGBT 소자의 전기적인 특성인 항복전압은 1467.04V, 온 전압 강하는 3.08V, 문턱전압은 4.14V의 특성을 나타내고 있다.

• E2M - 전기 전자와 첨단 소재
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• 제4권2호
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• pp.159-174
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• 1991

이중주입효과에 의한 고내압 반도체 스위칭소자의 설계 제작에 촛점을 맞추어 Injection Gate구조와 MOS Gate 구조로 시료소자를 제작해 그 특성을 검토하고 Electrical Switching 및 Oxide막에서의 Breakdown현상에 의한 문제점을 해결해 보고자 Optical Gate구조를 제안하여 이 optically Gated Semiconductor Switching 소자의 동작특성을 연구하고 Injection Gate 구조를 제안하여 이 optically Gated Semiconductor Switching 소자의 동작특성을 연구하고 Injection Gate 및 MOS Gate 구조(Planar type, V-Groove type, Injection Gate mode, Optical Gate mode)로 설계제작된 소자와 특성을 비교 분석하였다.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2008년도 춘계학술대회 논문집
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• pp.148-150
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• 2008

In this paper, we report the improved driving methode using planar-gate for field emission light source. Due to the cold cathode in field emission device, it has advantage for driving system in terms of high speed pulse driving with narrow duty ratio. This paper shows that our driving method offers the stable and reliable driving system without rapid electric field variation for field emission light source.

• 한국전기전자재료학회논문지
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• 제26권4호
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• pp.257-263
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• 2013

In this paper, Solar, Wind, fuel cell used in a Power conversion devices and industrial inverter motor to increase the efficiency of energy consumption, which is a core part of high-efficiency, high-voltage Trench Gate Field Stop IGBT was studied. For this purpose Planar type NPT IGBT and Planar type Field Stop IGBT have designed a basic structure designed to Trench Gate Field Stop IGBT based on the completed structure by analyzing the energy consumption of electrical characteristics, efficiency is a key part, high-efficiency and high-voltage inverter for industry regarding the optimization design for Trench Gate Field Stop IGBT.