• Journal of the Korean Society for Precision Engineering
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• v.18 no.9
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• pp.156-164
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• 2001

Two-dimensional solidification analysis during rheology forming process of semi-solid aluminum alloy has been studied. Two-phase fluid flow model to investigate the velocity field and temperature distribution is proposed. The proposed mathematical model is applied to the die shape of the two types. To calculate the velocity and temperature fields during rheology forming process, the earth governing equation correspondent to the liquid and solid region are adapted. Therefore, each numerical models considering the solid and liquid region existing within the semi-solid material have been developed to predict the deflect of rheology forming gnarls. The Arbitrary Boundary Maker And Cell (ABMAC) method is employed to solve the two-phase flow model of the Navier-Stokes equation. Theoretical model on the basis of the two-phase flow model is the mixture rule of solid and liquid phases. This approach is based on the liquid and solid viscosity. The liquid viscosity is pure liquid state value, however solid viscosity is considered as a function of the shear rate, solid fraction and power law curves.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.10
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• pp.1971-1981
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• 2002

Two-dimensional solidification analysis during rheology forming process of semi-solid aluminum alloy has been studied. Two-phase flow model to investigate the velocity field and temperature distribution is proposed. The proposed mathematical model is applied to the die shape of the two types. To calculate the velocities and temperature fields during rheology forming process, the each governing equations correspondent to the liquid and solid region are adapted. Therefore, each numerical model considering the solid and liquid coexisting region within the semi-solid material have been developed to predict the defects of rheology forming parts. The Arbitrary Boundary Maker And Cell(ABMAC) method is employed to solve the two-Phase flow model of the Navier-Stokes equation. Theoretical model basis of the two-phase flow model is the mixture rule of solid and liquid phases. This approach is based on using the liquid and solid viscosity. The Liquid viscosity is pure liquid state value, however solid viscosity is considered as a function of the shear rate, solid fraction and power law curves.

• Corrosion Science and Technology
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• v.23 no.2
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• pp.93-103
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• 2024

In the present work, a phase-field model for dendritic solidification is applied to hot-dip ZnAlMg coatings to elucidate the morphology of zinc dendrites and the solute segregation leading to the formation of eutectics. These aspects define the microstructure that conditions the corrosion resistance and the mechanical behaviour of the coating. Along with modelling phase transformation and solute diffusion, the implemented model is partially coupled with the tracking of crystal orientation in solid grains, thus allowing the effects of surface tension anisotropy to be considered in multi-dendrite simulations. For this purpose, the composition of a hot-dip ZnAlMg coating is assimilated to a dilute pseudo-binary system. 1D and 2D simulations of isothermal solidification are performed in a finite element solver by introducing nuclei as initial conditions. The results are qualitatively consistent with existing analytical solutions for growth velocity and concentration profiles, but the spatial domain of the simulations is limited by the required mesh refinement.

• Journal of the Korean institute of surface engineering
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• v.28 no.2
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.

• 열병합발전
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• s.30
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• pp.21-25
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• 2002

According to recent Korea Electric Power Company report, yearly distribution line brass cramp bolts failure summed up to 4,400 cases emerging as one of main local break-down causes. Naturally, the need for the investigation was proposed To determine the root cause of the cramp bolt failures, mechanical and metallurgical investigation were performed for 90 samples which collected from various sites. For the understanding of the geometric characteristics, stress distribution was evaluated by CAE program and proof load of each bolts was tested. The SEM&EDS was used for metallurgical investigation. Through the investigation, the root causes of failures were confirmed. All damaged bolts showed intergrannular fracture mode and the all fractured bolt showed ß phase morphology contrast to the a&ß mixture morphology of the non-damaged samples. Additionally, EDS analysis confirmed the existence of lead rich layer on grain boundaries.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.159-164
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• 1997

The optimal conditions were investigated in order to manufacture the light automotive body parts using the semi-solid forging process by the finite element nalysis. Considering about macro-segregation cause to difference of relative velocity between solid phase and liquid phase, solidificational phenomenon cause to heat transfer from die and export of the latent heat, so solid fraction updating algorithm can be proposed. The rigid thermo-viscoplastic finite element analysis was carried out according to die temperature with proposed algorithm, so availability of forming part were understood. The finite element program can be used to the analysis of semi solid forging process.

• ETRI Journal
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• v.13 no.4
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• pp.25-34
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• 1991

The stability and the electronic structure of $In_0.5$.$Ga_0.5$P-based superlattices are examined through self-consistent ab initio pseudopotential calculations. A chalcopyrite-like structure is found to be the lowest energy state over (001) and (111) monolayer superlattices (MLS). Our calculations indicate that all the ordered structures in bulk form are unstable against phase segregation into binary constituents at T = 0 while for epitaxial growth, the chalcopyrite phase is stabilized. The fundamental band gaps of the ordered structures are found to be direct and smaller than that of disordered alloys. The lowering of the band gap is explainable by band folding and pushing effects. We find the reduction of the band gap to be largest for the (111) MLS.

• Korean Journal of Materials Research
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• v.33 no.8
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• pp.344-351
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• 2023

Cesium lead iodide (CsPbI₃) with a bandgap of ~1.7 eV is an attractive material for use as a wide-gap perovskite in tandem perovskite solar cells due to its single halide component, which is capable of inhibiting halide segregation. However, phase transition into a photo inactive δ-CsPbI₃ at room temperature significantly hinders performance and stability. Thus, maintaining the photo-active phase is a key challenge because it determines the reliability of the tandem device. The dimethylammonium (DMA)-facilitated CsPbI₃, widely used to fabricate CsPbI₃, exhibits different phase transition behaviors than pure CsPbI₃. Here, we experimentally investigated the phase behavior of DMA-facilitated CsPbI₃ when exposed to external factors, such as heat and moisture. In DMA-facilitated CsPbI₃ films, the phase transition involving degradation was observed to begin at a temperature of 150 ℃ and a relative humidity of 65 %, which is presumed to be related to the sublimation of DMA. Forming a closed system to inhibit the sublimation of DMA significantly improved the phase transition under the same conditions. These results indicate that management of DMA is a crucial factor in maintaining the photo-active phase and implies that when employing DMA designs are necessary to ensure phase stability in DMA-facilitated CsPbI₃ devices.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.4
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• pp.549-559
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• 1999

An experimental study was peformed to measure the viscosity of microencapsulated PCM slurries as the functions of its concentration and temperature, and also influence to its fluid dynamics. For the viscosity measurement, a rotary type viscometer, which was equipped with temperature control system, was adopted. The slurry was mixed with water and Sodium Lauryl Sulphate as a surfactant by which its suspended particles were dispersed well without the segregation of particles during the experiment. The viscosity was increased as the concentration of MicroPCM particle added. The surfactant increased 5% of the viscosity over the working fluid without particles. Experiments were proceeded by changing parameters such as PCM particles'concentration as well as the temperature of working fluid. As a result, a model to the functions of temperature for the working fluid and its particle concentration is proposed. The proposed model, for which its standard deviation shows 0.8068, is agreed well with the reference's data. The pressure drop was measured by U-tube manometer, and then the friction factor was obtained. It was noted that the pressure drop was not influenced by the state of PCM phase, that is solid or liquid in its core materials at their same concentration. On the other hand, it was described that the pressure drop of the slurry was much increased over the working fluid without particles. A friction factor was placed on a straight line in all working fluids of the laminar flow regardless of existing particles as we expected.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.