• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.3
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• pp.151-162
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• 2017

The purpose of this study was to investigate the quality change of fresh-cut tumeric (Curcuma Longa Linne) according to packaging method during storage time. The fresh-cut tumeric were packaged in three different methods : degassing valve packaging (DVP), $CO_2$ gas absorber packaging (CAP) and micro-perforated packaging (MPP). After the samples were packaged, they were stored for 15 days at 4 and $23^{\circ}C$ respectively. The following parameters were observed to indicate the quality changes of the samples: weight loss, CIE $L^*a^*b^*$ colour difference, variation of gas composition inside the package, curcumin contents and changes in hardness of fresh-cut tumeric. DVP did not effectively release $CO_2$ gas to the outside. MPP was suitable to release $CO_2$ gas. However, MPP showed very fast browning and erosion, because a large amount of oxygen was introduced through the perforated hole on the film. CAP was most effective packaging method to inhibit browning, to prevent expansion of the packaging by $CO_2$ gas and to minimize weight loss of fresh-cut tumeric.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.71-72
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• 2012

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.145-149
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.73-73
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.80-80
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• 2000

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.749-750
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• 2011

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.33-36
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• 1999

In this paper, we proposed a simultaneous switching noise(SSN) reduction technique in muti-layer beards(MLB) for high-speed digital applications and analyzed them using the Finite Difference Time Domain(FDTD) method. The new method by conductive dielectric substrates reduces SSN couplings and resonances, significantly, which cause series malfunctions in the modem high-speed digital applications.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.153-157
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• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.31-36
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• 1999

An efficient method for thermal modeling of QFP is Proposed. Thermal measurement data are given to verify the method. In parallel with the experiment, an exact full 3-D model calculation is also provided. One fonds that there is an excellent agreement between validation data and the efficient model data.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.35-41
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• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.