• Journal of the Korean Society of Safety
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• v.30 no.1
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• pp.34-39
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• 2015

The feasibility of recycling wasted printed circuit board (PCB) is investigated by preparing PCB added flame retardant composites filled with either unsaturated polyester or polyurethane. In order to improve electroconductive properties, copper powder was added into the composites, which results also in improving their antistatic properties. The prepared composite samples showed a binding between the polymer fillers observed by a scanning microscope. The sample group using unsaturated polyester is elastomeric that led to appreciable elongation and elasticity. In case of polyurethane, the tensile strength increased proportionally as increase of the amount of PCB powder. The composite materials can be utilized as antistatic composite materials, since the surface resistivity result showed increase of the electroconductive properties by adding Cu. The flammability of the samples is not satisfactory according to UL-94 vertical test. However, the flame retardant properties were improved by adding PCB power. This study, therefore, showed that it is feasible to fabricate polymer composite materials and improve the material characteristics by adding PCB powder, which can replace existing additives used for the preparation of polymer composite materials and can reduce the environment contamination by recycling the wasted PCB.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.889-890
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• 2006

In recent years, PCB drills with smaller diameters less than 0.1 mm are used and thus there are growing needs for ultra-fine grained cemented carbides. However, ultra-fine WC powder usually causes extraordinary grain growth during sintering which weakens mechanical strength of ultra-fine grained cemented carbides. So we examined several kinds of WC powders to make new ultra-fine grained cemented carbides having superior performance. We found that direct carburized WC powder is very good as a WC raw material. The PCB drills made of the developed ultra-fine grained cemented carbides have higher hardness, toughness and stiffness than conventional ones.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.224-225
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• 2006

$BaTiO_3$ powder를 epoxy/solvent에 혼합한 슬러리와 solvent에 혼합한 슬러리의 분산 특성을 평가하기 위하여 분산제인 silane을 $BaTiO_3$ powder 표면에 코팅한 powder를 이용하여 분산실험을 진행하였다. Silane 표면 코팅 량에 따른 $BaTiO_3$ 슬러리와 $BaTiO_3$/epoxy 복합 슬러리의 분산 특성은 서로 다른 경향으로 나타남을 확인하였으며, silanae 최적 첨가량은 $BaTiO_3$/solvent 슬러리의 경우 0.3~0.5 wt%, $BaTiO_3$/epoxy/solvent 슬러리의 경우 1wt% 이상 첨가한 조건이었다. 또한 분산성 측정의 방법으로 점도 측정 방법과 함께 표면 거칠기 측정 방법의 가능성을 확인하였다.

• Resources Recycling
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• v.26 no.4
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• pp.95-100
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• 2017

In this study, $Fe_2O_3$ was added as a flux to decrease melting temperature and refine during melting of Cu powder from scraped surface of the waste PCB (printed circuit board). The effect of $Fe_2O_3$ ratio to Cu powder and temperature on the recovery of Cu and content of impurities were investigated. It was found that the recovery of Cu was increased with increasing addition ratio of $Fe_2O_3$ and reaction temperature. The contents of O, Si and Fe in Cu phase were also decreased with increasing addition ratio of $Fe_2O_3$ and temperature. The formation of fayalite ($2FeO{\cdot}SiO_2$) and iron oxides phases in the slag was confirmed by XRD analysis after reaction with $Fe_2O_3$. Therefore, it was considered that the decrease of melting temperature and viscosity of slag by formation of fayalite slag contributed remarkably to the Cu recovery.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.270-270
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• 2007

전자 산업의 발달로 인해 전자기기에 소형화, 경량화 및 다기능화가 요구되면서 민쇄회로기판(PCB)에도 고밀도화, 고집적회가 필요하게 되었다. 이에 따라 embedded passive 기술을 이용하여 기판 내부에 가능한 많은 수동소자들을 실장시키려는 노력이 진행되어지고 있다. 가장 수요가 많은 capacitor의 경우 부피와 전기적 특성 측면에서 내장 효과가 가장 큰 passive 소자에 해당한다. 본 연구에서는 내장형 capacitor의 유전재료로서 중요한 $BaTiO_3$ powder를 filler로 사용하여 epoxy/BT 복합체에서 filler의 분율에 따른 유전상수률 측정하고, filler의 열처리에 따른 유전상수의 변화를 관찰하였다. 그러고 이들 복합체의 mixing rule과 미세구조 관찰을 통하여 기판용 RCC 소재로서의 적용성을 평가하고자 하였다.

• Resources Recycling
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• v.28 no.1
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• pp.62-72
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• 2019

Generally, $H_2SO_4$ and Cu metal are used as raw materials for producing copper sulfate. The study relates to a method for producing copper sulfate using electrowinning from a waste solution of copper chloride. Uses are used for copper plating for industry, plating, feed, agriculture, electronic grade PCB. Conventional methods for producing copper sulfate have a problem of a large amount of waste water and a high energy cost. A study on the production method of copper sulfate ($CuSO_4$), which is the most used among copper (Cu) compounds, has a low process operation ratio, a small amount of waste water, and a simple manufacturing process. It is easy to remove Na, Ca, Mg, and Al as impurities by using a cationic membrane. At the same time, high purity copper powder could be recovered by an electrowinninng method. Using the recovered copper powder, high purity copper sulfate could be produced.

• Korean Journal of Environmental Agriculture
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• v.1 no.2
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• pp.105-115
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• 1982

Environmental samples contaminated with elemental sulfur(waters 22, sediments 20, crucian carps 19) collected from Soho Lake during the period of Sep. 1981 to Apr. 1982 were analyzed for polychlorinated biphenyls(PCBs) and organochlorine insecticides by GLC-ECD. Elemental sulfur was found to interfere in the residue analysis of environmental samples and the sulfur was eliminated, prior to analysis, with copper powder. PCBs residues in Soho lake were temporarily characterized as Aroclor 1254 and were analyzed at minimum detectable quantity of 0.04 ng by derivatizing PCBs to decachlorobiphenyl(DCB). PCBs were positively detected in all samples and its residue levels in waters, sediments, and crucian carps were $0.015{\sim}0.15$ ppb, $0.038{\sim}0.088$ ppm and 0.091 ppm, respectively. The residue levels of PCBs in all samples but sediments at central and outlet site of the lake were higher than those of total p,p'-DDT. The residue levels of PCBs in waters varied with inlets, i.e. those at right inlet site were three times of those at left inlet site. The main source of PCBs residues in the environmental samples of Soho Lake was not evident by present work.

• Korean Chemical Engineering Research
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• v.48 no.3
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• pp.401-404
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• 2010

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.10
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• pp.958-963
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• 2013

Ceramic dielectric waveguide duplexer was developed. Duplexer was designed in order to minimize the muture interferences between transmission port and receive port of bandpass filter. The design method for antenna port was determined by the transmission loss and calibrated the length of resonator of recriving filter. We used the ceramic powder of dielectric constant 9.46 and installed SMD type on PCB board.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.165-170
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• 2001

The main purpose of this study is to generate a fine copper oxide powder of high purity, with a compact structure and a uniform particle size by a spray pyrolysis process. The raw material is a waste copper chloride solution formed in the manufacturing process of Print Circuit Board (PCB). This study also examines the influences of various factors on the properties of the generated powder. These factors include the reaction temperature, the inflow speed of the raw material solution, the inflow speed of the air, the size of the nozzle tip, and the concentration of the raw material solution. It is discovered that, as the reaction temperature increases from 80$0^{\circ}C$ to 100$0^{\circ}C$ , the particle size of the generated powder increases accordingly, and that the structure of the powder becomes much more compact. When the reaction temperature is 100$0^{\circ}C$, the particle size of the generated powder increases as the concentration of copper in the raw material solution increases to 40g/l, decreases as the concentration increases up to 120g/l, and increases again as the concentration reaches 200g/1. In the case of a lower concentration of the raw material solution, the generated powder appears largely in the form of CuO. As the concentration increases, however, the powder appears largely in the form of CuCl. When the concentration of copper in the raw material solution is 120g/1, the particle size of the generated powder increases as the inflow speed of the raw material solution increases. When the concentration of copper in the raw material solution is 120g/1, there is no evident change in the particle size of the generated powder as the size of the nozzle tip and the air pressure increases. When the concentration is 40g/1, however, the particle size keeps increasing until the air pressure increases to 0.5kg/$\textrm{cm}^2$, but decreases remarkably as the air pressure exceeds 0.5kg/$\textrm{cm}^2$.