Korean Chemical Engineering Research

The Korean Institute of Chemical Engineers (한국화학공학회)
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Evaluation of Cleanliness and Jet Forces by Spray-Type Cleaning Agent for Electronic and Semiconductor Equipment

전자·반도체용 스프레이 세정제에 대한 분사력 및 세정성 평가

  • Heo, Hyo Jung (Department of Chemical Engineering, Inha University) ;
  • Jung, Young An (Department of Chemical Engineering, Inha University) ;
  • Row, Kyung Ho (Department of Chemical Engineering, Inha University)
  • 허효정 (인하대학교 화학공학과) ;
  • 정용안 (인하대학교 화학공학과) ;
  • 노경호 (인하대학교 화학공학과)
  • Received : 2009.12.22
  • Accepted : 2010.02.23
  • Published : 2010.06.30
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Abstract

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

본 연구에서는 PCB의 먼지 제거용 세정제로 사용되는 스프레이형 세정제를 선정하였다. 전자 반도체 부품의 세정에서 분무 세정의 원리를 적용시킨 제품의 분사력을 평가하기 위해 기판(IPC-A-36)을 사용하여 세정제를 분사하여 분사시간에 따라 그 이동거리를 비교하였다. 철가루와 먼지를 오염물, 기판(IPC-A-36)을 시편으로 하여 일반시험 평가법의 방법 중 가장 보편적으로 쓰이는 중량법으로 오염물에 따른 세정성능을 측정하여 비교하였다. 기판의 이동거리는 분사 시간이 늘어남에 따라 증가하였다. 1회 세정 시(3초간 분사) 먼지와 철가루는 오염물의 양이 증가함에 따라 세정효율이 감소하였고 특히 먼지 오염물은 매우 급격한 세정효율의 감소를 보였다.

Keywords

References

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