• Journal of the Optical Society of Korea
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• 제16권1호
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• pp.1-5
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• 2012

This paper describes a 150-Mb/s monolithic optical receiver for plastic optical fiber link using a standard CMOS technology. The receiver integrates a photodiode using an N-well/P-substrate junction, a pre amplifier, a post amplifier, and an output driver. The size, PN-junction type, and the number of metal fingers of the photodiode are optimized to meet the link requirements. The N-well/P-substrate photodiode has a 200-${\mu}m$ by 200-${\mu}m$ optical window, 0.1-A/W responsivity, 7.6-pF junction capacitance and 113-MHz bandwidth. The monolithic receiver can successfully convert 150-Mb/s optical signal into digital data through up to 30-m plastic optical fiber link with -10.4 dBm of optical sensitivity. The receiver occupies 0.56-$mm^2$ area including electrostatic discharge protection diodes and bonding pads. To reduce unnecessary power consumption when the light is not over threshold or not modulating, a simple light detector and a signal detector are introduced. In active mode, the receiver core consumes 5.8-mA DC currents at 150-Mb/s data rate from a single 3.3 V supply, while consumes only $120{\mu}W$ in the sleep mode.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.557-558
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• 2008

This paper presents the effects of via losses to be connected with an embedded DPDT(Double Pole Double Thru) in a substrate. The substrate consists of two ABF(Ajinomoto Bonding Film) and a Epoxy core. In order to verify and test effects of via, via chains in a substrate using SoP-L process are proposed and measured. Via loss can be calculated as averaging the total via holes. The exact loss of a DPDT switch embedded in substrate are extracted by using the results of via chain and measured data from embedded DPDT. The calculated one via insertion loss is about 0.0005 dB on basis of measured via chains. This result confirms very low loss in via. So the inserti on loss of the embedded switch is confirmed only switch loss as loss is 0.4 dB.

• Bulletin of the Korean Chemical Society
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• 제32권7호
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• pp.2193-2198
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• 2011

We prepared polycatenar 1H-imidazole amphiphiles having a structure in which a 1H-imidazole head was connected through a benzene ring to a pheny group having two or three oligo(ethylene glycol) chains and studied their supramolecular assembly by fluorescence spectroscopy, transmission electron microscopy (TEM) and atomic force microscopy (AFM). When the aqueous solutions of the amphiphiles ($5{\times}10^{-5}M{\sim}10^{-3}M$) were deposited onto a carbon-coated copper grid and dried, twisted structures with diameters of ~200-300 nm were imaged by TEM and AFM. We presume that the structures comprised a chain of the amphiphile dimers formed via successive hydrogen bonding between the 1H of the imidazole group and 3N of the neighboring one. In a solution of pH 4, entangled fibers with diameters of several nanometers were observed by TEM. In a pH 10 solution, film-like aggregates formed exclusively. The 1H-imidazole amphiphiles hydrolyzed tetraethoxysilane to induce gelation to form fibrous and spherical silica structures at neutral pH in aqueous solutions. No silica was formed when imidazole was used instead of the amphiphiles, suggesting that the selfassembled aggregates of the amphiphiles were responsible for the gelation.

• Journal of the Korean Wood Science and Technology
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• 제26권1호
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• pp.29-37
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• 1998

Alkali-soluble extracts were prepared from medium-sized barks of Radiata pine(Pinus radiata). There are difficulties in the production of extracts with uniform quality and in the preparation of adhesives with suitable viscosity. Ultrafiltration using an Amicon cell was subjected to fractionate extracts according to molecular sizes in order to overcome the above problem. The filtration efficiency was studied by using thin channel filtration systems. Adhesive manufacturing was also examined. Removal of particles greater than 0.45m from the extracts increased both filtration speed (flux) and yields of solids in the filtrates. Ultrafiltration with PM 10 membrane was very effective to fractionate and concentrate the extracts. Stiasny precipitates from the filtrates obtained by PM 10 membrane were very lower than that(83%) of the retentates. This ultrafiltration method was efficient for obtaining high yield purified phenolic compounds(mainly polyflavanoids) and thus important for preparing wood adhesives from barks. The extracts were shown excessive high viscosities at the concentrations required for adhesive formulation, but this high viscosity and short gelation time was reduced by lowering pH of the extracts and addition of urea. The highest bonding strength of plywoods(340g/$m^2$ of adhesive spreads) was achieved with adhesive formulated by 100parts of mixed alkali extracts and urea(70/30,w/w), 10parts of p-formaldehyde and 3.5parts of wheat flour at pH 6, and by hot pressing at the conditions of 12kg/$cm^2$ at $120^{\circ}C$ for 10 minutes.

• 한국생산제조학회지
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• 제22권3_1spc호
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• pp.504-508
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• 2013

This paper describes in detail the life prediction models and simulations of thermal fatigue under different mold compounds and chip sizes for wafer-level embedded SiP. Three-dimensional finite element models are built to simulate the viscoplastic behaviors for various mold compounds and chip sizes. In particular, the bonding parts between a mold and silicon nitride (Si3N4) are carefully modeled, and the strain distributions are studied. Three different chip sizes are used, and the effects of the mold compounds are observed. Through the numerical studies, it is found that type-C, which has a relatively lower Young's modulus and higher CTE, has a better fatigue life than the other mold compounds. In addition, the $4{\times}4$ chip has a shorter life than the $6{\times}6$ and $8{\times}8$ chips.

• 한국정밀공학회지
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• 제25권5호
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• pp.140-147
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• 2008

In this study, a carbon nanotube probe (CNT probe) is proposed as a mechanical force transducer for the measurement of pico-Newton (pN) order force in biological applications. In order to measure nantube's displacement in the air or liquid environment, the fabrication of a CNT probe with tip-specific loading of fluorescent dyes is performed using tip- specific functionalization of the nanotube and chemical bonding between dyes and nanotube. Also, we experimentally investigated the mechanical properties of the CNT probe using electrostatic actuation and fluorescence microscope measurement. Using fluorescence measurement of the tip deflection according to the applied voltage, we optimized the bending stiffness of the CNT probe, therefore determined the spring constant of the CNT probe. The results show that the spring constant of CNT probes is as small as 1 pN/nm and CNT probes can be used to measure pN order force.

• Restorative Dentistry and Endodontics
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• 제44권3호
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• pp.23.1-23.9
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• 2019

Objectives: The aim of this study was to investigate the microshear bond strength (${\mu}SBS$) of different universal adhesive systems applied to hybrid computer-aided design/computer-aided manufacturing (CAD-CAM) restorative materials repaired with a composite resin. Materials and Methods: Four types of CAD-CAM hybrid block materials-Lava Ultimate (LA), Vita Enamic (VE), CeraSmart (CS), and Shofu Block HC (SH)-were used in this study, in combination with the following four adhesive protocols: 1) control: porcelain primer + total etch adhesive (CO), 2) Single Bond Universal (SB), 3) All Bond Universal (AB), and 4) Clearfil Universal Bond (CU). The ${\mu}SBS$ of the composite resin (Clearfil Majesty Esthetic) was measured and the data were analyzed using two-way analysis of variance and the Tukey test, with the level of significance set at p < 0.05. Results: The CAD-CAM block type and block-adhesive combination had significant effects on the bond strength values (p < 0.05). Significant differences were found between the following pairs of groups: VE/CO and VE/AB, CS/CO and CS/AB, VE/CU and CS/CU, and VE/AB and CS/AB (p < 0.05). Conclusions: The ${\mu}SBS$ values were affected by hybrid block type. All tested universal adhesive treatments can be used as an alternative to the control treatment for repair, except the AB system on VE blocks (the VE/AB group). The ${\mu}SBS$ values showed variation across different adhesive treatments on different hybrid CAD-CAM block types.

• ETRI Journal
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• 제46권2호
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• pp.323-332
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• 2024

Receiver and transmitter monolithic microwave integrated circuit (MMIC) multifunction chips (MFCs) for active phased-array antennas for Ka-band satellite communication (SATCOM) terminals have been designed and fabricated using a 0.15-㎛ GaAs pseudomorphic high-electron mobility transistor (pHEMT) process. The MFCs consist of four-channel radio frequency (RF) paths and a 4:1 combiner. Each channel provides several functions such as signal amplification, 6-bit phase shifting, and 5-bit attenuation with a 44-bit serial-to-parallel converter (SPC). RF pads are implemented on the bottom side of the chip to remove the parasitic inductance induced by wire bonding. The area of the fabricated chips is 5.2 mm × 4.2 mm. The receiver chip exhibits a gain of 18 dB and a noise figure of 2.0 dB over a frequency range from 17 GHz to 21 GHz with a low direct current (DC) power of 0.36 W. The transmitter chip provides a gain of 20 dB and a 1-dB gain compression point (P1dB) of 18.4 dBm over a frequency range from 28 GHz to 31 GHz with a low DC power of 0.85 W. The P1dB can be increased to 20.6 dBm at a higher bias of +4.5 V.

• 한국진공학회지
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• 제19권2호
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• pp.81-90
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• 2010

층과 층 사이의 정전기적인력, 수소결합 또는 공유결합을 이용하여 층당 두께를 수 옹스트롱에서부터 수십 나노미터까지 제조할 수 있으며 박막의 표면 형태를 흡착시키고자 하는 물질 및 박막 후처리 공정을 통해 제어할 수 있으며 더 나아가, 삽입하는 물질의 특성에 따라 박막의 기능성을 집적화 및 다양화시킬 수 있다. 본 연구에서는 이러한 층상자기조립방법의 특성을 이용하여 반사방지막, 초소수성 필름 및 전기화학센서로의 응용가능성을 제시하였다. 반사방지막의 경우, 구형의 블록공중합체를 유리기판 위에 다층박막으로 적층시킴으로써 박막 굴절률을 1.25까지 감소시켰고 이를 통해 약 99.5%의 빛 투과도를 달성할 수 있었다. 더 나아가 바이오물질인 엔자임을 다층박막에 삽입시킬 경우, 활성 산소를 분해시키는 전기화학센서로의 제조가 가능함을 보인다. 본 연구는 본인이 이미 발표한 논문(J. Am. Chem. Soc. 128, 9935 (2006); Adv. Mater. 19, 4364 (2007); Electro. Mater. Lett. 3, 163 (2007))들을 정리하여 층상자기조립법에 관해 소개하는 논문이다.

• 소성∙가공
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• 제20권2호
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• pp.140-145
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• 2011

The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.