• Title/Summary/Keyword: P-P bonding

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THE EFFECTS OF COLLAGENASE AND ESTERASE ON THE MICROTENSILE BOND STRENGTH IN DENTIN BONDING (상아질 접착에서 collagenase와 esterase가 미세인장결합강도에 미치는 영향)

  • Jung, Young-Jung;Hyun, Hong-Keun;Kim, Young-Jae;Kim, Jung-Wook;Lee, Sang-Hoon;Kim, Chong-Chul;Hahn, Se-Hyun;Jang, Ki-Taeg
    • Journal of the korean academy of Pediatric Dentistry
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    • v.34 no.2
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    • pp.285-291
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    • 2007
  • The purpose of this study was to evaluate the effect of collagenase and esterase on the microtensile bond $strength({\mu}TBS)$ in dentin bonding. After resin composites were bonded to occlusal dentin. ${\mu}TBS$ specimens were formed and stored in PBS, collagenase, or esterase solution After 4-week storage, ${\mu}TBS$ was determined and, the results were as follows : 1. ${\mu}TBS$ values of Single Bond 2 were lower than those of Clearfil SE Bond for all storage medium (p<0.05). 2. In Single Bond 2 group, collagenase solution lowered bond strength more than PBS and esterase solution (p>0.05). 3. In Clearfil SE Bond group, esterase solution lowered bond strength more than PBS(p>0.05). Collagenase solution lowered bond strength more than esterase solution(p>0.05) and PBS(p<0.05).

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fabrication of the Microfluidic LOC System with Photodiode (광 다이오드를 가진 Microfluidic LOC 시스템 제작)

  • 김현기;신경식;김용국;이상렬;김태송;양은경;주병권
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.12
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    • pp.1097-1102
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    • 2003
  • In this paper, we used only PR as etching mask, while it used usually Cr/AU as etching mask, and in order to fabricate a photosensor has the increased sensitivity, we investigated on the sensitivity of general type and p-i-n type diode. we designed microchannel size width max 10um, min 5um depth max 10um, reservoir size max 100um, min 2mm. Fabrication of microfluidic devices in glass substrate by glass wet etching methods and glass to glass fusion bonding. The p-i-n diode has higher sensitivity than photodiode, Considering these results, we fabricated p-i-n diodes on the high resistive(4㏀$.$cm) wafer into rectangle and finger pattern and compared internal resistance of each pattern. The internal resistance of pin diode can be decreased by the application of finger pattern has parallel resistance structure from 571Ω to 393Ω.

Synthesis and Photoactivity of SnO2-Doped TiO2 Thin Films (SnO2가 도핑된 TiO2 박막의 합성 및 광촉매 효과)

  • Jung, Mie-Won;Kwak, Yun-Jung
    • Journal of the Korean Ceramic Society
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    • v.44 no.11
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    • pp.650-654
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    • 2007
  • [ $SnO_2$ ]-doped $TiO_2$ thin films were prepared from tin (IV) bis (acetylacetonate) dichloride and titanium diisopropoxide bis (acetylacetonate) with pluronic P123 or degussa P25 as a structural-directing agent. These hydrolyzed sol were spin coated onto Si(100) wafer substrate. The microstructure, morphology and bonding states of thin films were studied by field-emission scanning electron microscopy (FE-SEM), X-ray diffractometry (XRD), and X-ray photoelectron spectroscopy (XPS). The photocatalytic activity of these films was investigated by using indigo carmine solution.

Fabrication and separation performance of polyethersulfone/sulfonated TiO2 (PES-STiO2) ultrafiltration membranes for fouling mitigation

  • Ayyaru, Sivasankaran;Ahn, Young-Ho
    • Journal of Industrial and Engineering Chemistry
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    • v.67
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    • pp.199-209
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    • 2018
  • Polyethersulfone (PES)/sulfonated $TiO_2$ ($STiO_2$) nanoparticles (NPs) UF blended membranes were fabricated with different loadings of $STiO_2$. The modified membranes exhibited significant improvement in surface roughness, porosity, and pore size when compared to the PES membrane. The $P-STiO_2$ 1 and $P-TiO_2$ 1 blended membranes exhibited higher water flux, approximately 102.4% and 62.6%, respectively, compared to PES. SPP-$STiO_2$ and $P-STiO_2$ showed lower Rir fouling resistance than the $P-TiO_2$ blended membrane. Overall, the $STiO_2$-blended membranes provide high hydrophilicity permeability, anti-fouling performance, and improved BSA rejection attributed to the hydrogen bonding force and more electrostatic repulsion properties of $STiO_2$.

EFFECT OF FILM THICKNESS OF RESIN CEMENT ON BONDING EFFICIENCY IN INDIRECT COMPOSITE RESTORATION (레진 시멘트의 film thickness가 간접 복합 레진 수복물의 접착 효율에 미치는 영향에 관한 연구)

  • Lee, Sang-Hyuck;Choi, Gi-Woon;Choi, Kyung-Kyu
    • Restorative Dentistry and Endodontics
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    • v.35 no.2
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    • pp.69-79
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    • 2010
  • The purpose of this study was to evaluate the effect of film thickness of various resin cements on bonding efficiency in indirect composite restoration by measurement of microtensile bond strength, polymerization shrinkage, flexural strength and modulus, fractographic FE-SEM analysis. Experimental groups were divided according to film thickness (< $50\;{\mu}m$-control, $50\;{\mu}m$-T50, $100\;{\mu}m$-T100, $150\;{\mu}m$-T150) using composite- based resin cements (Variolink II, Duo-Link) and adhesive-based resin cements (Panavia F, Rely X Unicem). The data was analyzed using ANOVA and Duncan's multiple comparison test (p < 0.05). The results were as follows ; 1. Variolink II showed higher microtensile bond strength than that of adhesive-based resin cements in all film thickness (p < 0.05) but Duo-Link did not show significant difference except control group (p > 0.05). 2. Microtensile bond strength of composite-based resin cements were decreased significantly according to increasing film thickness (p < 0.05) but adhesive-based resin cements did not show significant difference among film thickness (p > 0.05). 3. Panavia F showed significantly lower polymerization shrinkage than other resin cements (p < 0.05). 4. Composite-based resin cements showed significantly higher flexural strength and modulus than adhesive-based resin cements (p < 0.05). 5. FE-SEM examination showed uniform adhesive layer and well developed resin tags in composite-based resin cements but unclear adhesive layer and poorly developed resin tags in adhesive-based resin cements. In debonded surface examination, composite-based resin cements showed mixed failures but adhesive-based resin cements showed adhesive failures.

Kinetic and Equilibrium Studies on Complex Formation Between Ni(II) and D-Penicillamine in Aqueous Media (Ni(II)와 D-Penicillamine과의 착물형성반응에 대한 속도론적 및 평형에 관한 연구)

  • Yong-Kyu Kim;Sung-Nak Choi
    • Journal of the Korean Chemical Society
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    • v.30 no.5
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    • pp.475-482
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    • 1986
  • Rates and equilibriurn of complex formation between $Ni^{2+}$ and D-penicillamine have been investigated in aqueous solutions. Kinetic study on the complex formation were performed in the pH range of 8∼9 by the use of pressure-jump technique. D-Penicillamine coordinates to the nickel(II) ion utilizing sulfur and nitrogen as donor atoms in the high pH condition (pH 9.2). However, in the pH range of 8.25∼9.07, the stepwise stability constant becomes drastically reduced and the undissociated mercapto group does not participate in bonding. The rate-determining step of the complexation reaction is found to be the release of a water molecule from the inner-coordination sphere of $Ni^{2+}$ ion.

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Adsorption of Globular Proteins to Vaccine Adjuvants

  • Jang, Mi-Jin;Cho, Il-Young;Callahan, Patricia
    • BMB Reports
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    • v.30 no.5
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    • pp.346-351
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    • 1997
  • The maximum adsorption/desorption conditions and the adsorption mechanism of globular proteins to vaccine adjuvants were determined. The maximum adsorption ratio of protein to the $Al^{3+}$ content of aluminum oxyhydroxide and the optimal adsorption pH are 2:1 (${\mu}g:{\mu}g$) for bovine serum albumin (BSA) at pH 6.0 and 2.5:1 (${\mu}g:{\mu}g$) for immunoglobulin G (IgG) at pH 7.0, respectively. The maximum adsorption ratio onto aluminum phosphate gel was 1.5:1 (${\mu}g$ Protein:${\mu}g$ $Al^{3+}$) at pH 5.0 for both BSA and IgG. Adsorption of the native globular proteins, BSA and IgG, to aluminum oxyhydroxide and aluminum phosphate gel was reversible as a function of pH. Complete desorption of these proteins from aluminum phosphate gel was observed at alkaline pH, whereas only 80~90% removal from aluminum oxyhydroxide was achieved with alkaline pH and 50 mM phosphate buffer. We conclude that electrostatic and hydrogen bonding interactions between the native proteins and adjuvants are important binding mechanisms for adsorption, and that the surface charge of the protein and the colloid components control the maximum adsorption conditions.

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The Effect of Bonding Resin on Bond Strength of Dual-Cure Resin Cements (접착레진의 부가도포가 레진 시멘트의 결합강도에 미치는 영향에 대한 연구)

  • Kim, Duck-Su;Park, Sang-Hyuk;Choi, Gi-Woon;Choi, Kyung-Kyu
    • Restorative Dentistry and Endodontics
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    • v.32 no.5
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    • pp.426-436
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    • 2007
  • The objective of this study is to evaluate the effect of an additional application of bonding resin on the bond strength of resin luting cements in both the light-cure (LC) and self-cure (SC) modes by means of the ${\mu}TBS$ tests. Three combinations of One-Step Plus with Choice, Single Bond with Rely X ARC, and One-Up Bond F with Bistite II were used. D/E resin and Pre-Bond resin were used for the additional application. Twelve experimental groups were made. Three mandibular $3^{rd}$ molars were used in each group. Indirect composite blocks were cemented on the tooth surface. $1\;{\times}\;1\;mm^2$ dentin-composite beam for ${\mu}TBS$ testing were made and tested. When total-etching dentin adhesives were used, an additional application of the bonding resin increased the bond strength (P < 0.05). However, this additional application didn't influence the bond strength of self-etching dentin adhesives (P > 0.05). In conclusion, the results suggest that an additional application of the bonding resin increases bond strength and enhances quality of bonding when using total-etching dentin adhesives.

Influence of Low Temperature Degradation on Bond Strength of Yttria-Stabilized Tetragonal Zirconia Polycrystal Core to Veneering Ceramic (저온열화현상이 지르코니아 코어와 전장도재의 전단결합강도에 미치는 영향)

  • Kim, Ki-Baek;Kim, Jae-Hong
    • Journal of dental hygiene science
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    • v.14 no.1
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    • pp.29-34
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    • 2014
  • The purpose of this study was to evaluate the influence of low temperature degradation (LTD) on the bonding strength of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP). The push-shear bond test method was used to investigate the core-veneer bonding strength of industrially manufactured Y-TZP core ceramic and manufacturer recommended veneering ceramic. Four groups from ceramic-zirconia specimens (n=28; n=7 per group) were assigned into four experimental aging conditions, namely storage in an autoclave at $134^{\circ}C$ for 0, 3, 5, 10 hours. Bonding strength was obtained using a universal testing machine with crosshead speed 0.5 mm/min. Data were statistically analyzed using one-way ANOVA and Tukey's test (${\alpha}=0.05$). In bonding strength test, the group which was treated with LTD showed lower bonding strength than no treated group. The ceramic-zirconia bonding strength was affected by LTD (p<0.05). Digital microscope examination of the fracture surface showed mixed failures with adhesive and cohesive types in LTD with treated Y-TZP groups.

Integration of an Optical Waveguide Isolator by Wafer Direct Bonding

  • Roh J. W.;Yang J. S.;Ok S. H.;Choi U. K.;Lee S.;Lee W. Y.
    • Proceedings of the Korean Magnestics Society Conference
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    • 2004.12a
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    • pp.175-176
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    • 2004
  • An integrated waveguide optical isolator by wafer direct bonding has been studied. The isolation ratio was found to be 2.9dB in our device. We found that wafer direct bonding between the InP and GGG is effective for the integration of a waveguide optical isolator.

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