• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.1
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• pp.100-105
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• 2003

In this paper, we propose the novel test method effectively to detect short and open faults in CMOS op-amp. The proposed method uses a sinusoidal signal with higher frequency than unit gain bandwidth. Since the proposed test method doesn't need complex algorithm to generate test pattern, the time of test pattern generation is short, and test cost is reduced because a single test pattern is able to detect all target faults. To verify the proposed method, CMOS two-stage operational amplifier with short and open faults is designed and the simulation results of HSPICE for the circuit have shown that the proposed test method can detect short and open faults in CMOS op-amp.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.189-192
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• 2000

In this paper, we propose the novel test method to detect short and open faults in CMOS Op-amp. The proposed method is composed of two test steps - the offset and the high frequency test. Using HSPICE simulation, we get a 100％ fault coverage. To verify the proposed method, we design and fabricate the CMOS op-amp that contains various short and open faults through Hyundai 0.65$\mu\textrm{m}$ 2-poly 2-metal CMOS process. Experimental results of fabricated chip demonstrate that the proposed test method can detect short and open faults in CMOS Op-amp.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.49 no.2
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• pp.85-92
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• 2000

30 kVA rotating-field type Super-Conducting Generator is built and tested with intensive FE(Finite Element) analysis. The generator is driven by VVVF inverter-fed induction motor. Open Circuit Characteristic(OCC) and Short Circuit Characteristic(SCC) are presented in this paper. Also, the test result under the light load(up to 3.6 kW) are given. From the design stage, 2-D FE analysis coupled with the external circuit has been performed. The external circuit includes the end winding resistance and reactance as well as two dampers. When compared with the test data, the FE analysis results show a very good agreement.

• Progress in Superconductivity and Cryogenics
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• v.3 no.2
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• pp.32-38
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• 2001

A 30[kVA] superconducting generator (SCG) is built and tested at Korea Electrotechnology Research Institute (KERI) in Korea. This superconducting generator has an air-gap winding instead of the typical steel teeth structure. The rotor has 4 field coils of race-track type with NbTi superconducting wired. The rotor is composed of two dampers and a liquid helium composed of two dampers and a liquid helium container in which the field poles reside. The space between the outermost damper and the container is vacuum insulated. A ferrofluid seal is used between the stationary part connected to the couping and the rotor. A helium transfer coupling(HTC) has 3 passages of the recovered heilum gas and a gas flow control system. The open circuit test and sustained short circuit test are preformed to obtain the open circuit characteristics (OCC) and short circuit characteristics (SCC) Also. the test results usder the light load (up to 3.6[kW]) are given. The structure, manufacturing and basis test of the 30[kVA]SCG are discussed.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.269-272
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• 1988

This paper deals with the test strategy on the short-open for the printed circuit board. A group testing algorithm, which is the several testing point to be measured redefined as one of the testing points, was suggested. As a result, the total testing time was reduced to 30${\sim}$50 percent.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.2
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• pp.313-318
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• 2012

This paper presents an automatic system to detect variety of faults from fine pitch COF(chip-on-film) which is less than $30{\mu}m$. Developed system contains circuits and technique to detect fast various faults such as hard open, hard short, soft open and soft short from fine pattern. Basic principle for fault detection is to monitor fine differential voltage from pattern resistance differences between fault-free and faulty cases. The technique uses also radio frequency resonator arrays for easy detection to amplify fine differential voltage. We anticipate that proposed system is to be an alternative for conventional COF test systems since it can fast and accurately detect variety of faults from fine pattern COF test process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1259-1260
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• 2013

• Journal of the Korean Institute of Telematics and Electronics B
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• v.33B no.7
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• pp.70-79
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• 1996

To increase the functionality of the memories, previous studies have deifned faults models and proposed functional testing algorithms with low complexity. Although conventional testing depended strongly on functional (voltage) testing method, it couldn't detect short and open defects caused by gate oxide short and spot defect which can afect memory reliability. Therefore, IDDQ (quiescent power supply current) testing is required to detect defects and thus can obtain high reliability. In this paper, we consider resistive shorts on gate-source, gate-drain, and drain-source as well as opens in mOS FET and observe behavior of the memory by analyzing voltage at storge nodes of the memory and IDDQ resulting from PSPICE simulation. Finally, using this behavioral analysis, we propose a linear testing algorithm of complexity O(N) which can be applicable to both functional testing and IDDQ testing simultaneously to obtain high functionality and reliability.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.8
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• pp.1899-1907
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• 2013

This paper presents an efficient defect detection and classification system based on reference image for COF (Chip-on-Film) which encounters fatal defects after ultra fine pattern fabrication. These defects include typical ones such as open, mouse bite (near open), hard short and soft short. In order to detect these defects, conventionally it needs visual examination or electric circuits. However, these methods requires huge amount of time and money. In this paper, based on reference image, the proposed system detects fatal defect and efficiently classifies it to one of 4 types. The proposed system includes the preprocessing of the test image, the extraction of ROI, the analysis of local binary pattern and classification. Through simulations with lots of sample images, it is shown that the proposed system is very efficient in reducing huge amount of time and money for detecting the defects of ultra fine pattern COF.

• Journal of the Korea Society of Computer and Information
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• v.3 no.2
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• pp.105-112
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• 1998

In this paper, we propose a ESP(Extended Scan Path) architecture for multi-board testing. The conventional architectures for board testing are single scan path and multi-scan path. In the single scan path architecture, the scan path for test data is just one chain. If the scan path is faulty due to short or open, the test data is not valid. In the multi-scan path architecture, there are additional signals in multi-board testing. So conventional architectures are not adopted to multi-board testing. In the case of the ESP architecture, even though scan path is either short or open, it doesn't affect remaining other scan paths. As a result of executing parallel BIST and IEEE 1149.1 boundary scan test by using the proposed ESP architecture, we observed that the test time is short compared with the single scan path architecture. By comparing the ESP architecture with single scan path responding to independency of scan path, test time and with multi-scan path responding to signal, synchronization, we showed that the architecture has improved results.