• 전기전자학회논문지
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• 제21권1호
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• pp.1-6
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• 2017

본 논문에서는 플래너 게이트 및 트렌치 게이트의 구조를 동시에 가지고 있는 1200V급 이중 게이트 IGBT 소자를 제안함과 동시에 전기적인 특성을 분석하였으며, 분석된 결과를 가지고 플래너 게이트 및 트렌치 게이트 IGBT 소자의 전기적인 특성과 비교 분석하였다. 이중 게이트 IGBT 소자를 설계하는데 있어 문턱전압 및 온 상태 전압 강하에 영향을 주는 P-베이스 영역에 있어 P-베이스에 깊이는 트렌치 게이트 소자 영역에 영향을 주며, P-베이스에 너비는 플래너 게이트 소자 영역에 영향을 주는 것을 확인할 수 있었다. 본 연구에서 제시한 이중 게이트 IGBT 소자의 전기적인 특성인 항복전압은 1467.04V, 온 전압 강하는 3.08V, 문턱전압은 4.14V의 특성을 나타내고 있다.

• 한국전기전자재료학회논문지
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• 제26권10호
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• pp.720-725
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• 2013

Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have analyzed trench process, field limit ring process for fabrication of unified trench gate power MOSFET. And we have analyzed electrical characteristics of fabricated unified trench gate power MOSFET. The optimal trench process was based on SF6. After we carried out SEM measurement, we obtained superior trench gate and field limit ring process. And we compared electrical characteristics of planar and trench gate unified power MOSFET after completing device fabrication. As a result, the both of them was obtained 500 V breakdown voltage. However trench gate unified power MOSFET was shown improved Vth and on state voltage drop characteristics than planar gate unified power MOSFET.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.312-315
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• 2003

Basic design of RC-GCTs (Reserve-Conducting Gate-Commutated Thyristors) by novel punch-through (PT) concept with 5,500v rated voltage is described here. A PT and NPT (non punch-through) concept for the same blocking voltage has been compared in detail. The simulation work indicates that GCT with such PT design exhibits that the forward breakdown voltage is 6,400V which is enough for supporting 5500V blocking. Additionally, the real IGCT turn-off in the mode of PNP transistor has been realized. However, the carrier extraction from N-base to gate terminal will be drastic slowly in terms of NPT structure except for the high on-state voltage drop.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.101-102
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• 2005

SiC lateral power semiconductor device has high breakdown voltage and low on-state voltage drop due to the material characteristics. And, because the high breakdown voltage can be obtained, RESURF technique is mostly used in silicon power semiconductor devices. In this paper, we presents the electrical characteristics of the 4H-SiC RESURF LDMOSFET as a function of the epi-layer length, concentration and thickness. 240~780V of breakdown voltage can be obtained as a function of epi-layer length and thickness with same epi-layer concentration.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전력기술부문
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• pp.9-14
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• 2002

In front of the opening of electric distribution market in 2004. it is indispensable to have a proper estimation of power quality index and power quality cost calculation mechanism are indispensable to stabilize highly industrialized society and to vitalize the investment for electric power system. However, there were not enough measures to reflect the voltage characteristics such as voltage sags and interruptions which make electric load in unstable operation. This paper suggests power quality index(LDI) and power quality cost(LDC) which translate various kinds of voltage records into load drop index and cost based on aggregated load CBEMA curve. A sample calculation result shows that this method can produces the acceptable power quality index and costs for utilities and customers requirements.

• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.33-37
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• 2001

A vertical trench electrode type EST has been proposed in this paper. The proposed device considerably improves snapback which leads to a lot of problems of device applications. In this paper, the vertical dual gate Emitter Switched Thyristor (EST) with trench electrode has been proposed for improving snab-back effect. It is observed that the forward blocking voltage of the proposed device is 745V. The conventional EST of the same size were no more than 633V. Because the proposed device was constructed of trench-type electrodes, the electric field moved toward trench-oxide layer, and the punch through breakdown of the proposed EST is occurred at latest.

• Journal of Electrical Engineering and Technology
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• 제9권5호
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• pp.1537-1543
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• 2014

This paper presents a new DC/AC multilevel converter. This configuration uses single DC sources. The proposed converter has two stages. The first stage is a DC/DC converter that can produce several DC-links in the output. The DC/DC converter is one type of boost converter and uses single inductor. The second stage is a multilevel inverter with several capacitor links. In this paper, one single input multi output DC-DC converter is used in order to voltage balancing on multilevel converter. In addition, as compare to traditional multilevel inverter, presented DC/AC multilevel converter has less on-state voltage drop and conduction losses. Finally, in order to verify the theoretical issues, simulation and experimental results are presented.

• 한국전기전자재료학회논문지
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• 제28권4호
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• pp.222-228
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• 2015

Power MOSFETs (metal oxide semiconductor field effect transistor) operate as energy control semiconductor switches. In order to reduce energy loss of the device, it is essential to increase its conductance. However, a trade-off relationship between the breakdown voltage and conductance of the device have been the critical difficulty to improve. In this paper, theoretical analysis of electrical benefits on single floating island power MOSFET is proposed. By the method, the optimization point has set defining the doping limit under single floating island structure. The numerical multiple 2.22 was obtained which indicates the doping limit of the original device, improving its ON state voltage drop by 45%.

• Transactions on Electrical and Electronic Materials
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• 제17권4호
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• pp.222-226
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• 2016

This paper investigated the trench process, unified field limit ring, and other products for the development of a 500 V-level unified trench gate power MOSFET. The optimal base chemistry for the device was found to be SF₆. In SEM analysis, the step process of the trench gate and field limit ring showed outstanding process results. After finalizing device design, its electrical characteristics were compared and contrasted with those of a planar device. It was shown that, although both devices maintained a breakdown voltage of 500 V, the Vth and on-state voltage drop characteristics were better than those of the planar type.

• 한국전기전자재료학회논문지
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• 제21권1호
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• pp.23-28
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• 2008

In this paper, transient characteristics of the Punch Through Insulated Gate Bipolar Transistor (PT-IGBT) have been studied. On the contrary to Non-Punch Through Insulated Gate Bipolar Transistor(NPT-IGBT), it has a buffer layer and reduces switching power loss. It has a simple drive circuit controlled by the gate voltage of the MOSFET and low on-state resistance of the bipolar junction transistor. The transient characteristics of the PT-IGBT have been analyzed analytically. Excess minority carrier and charge distribution in active base region, the rate of anode voltage with time are expressed analytically by adding the influence of buffer layer. The experimental data is obtained from manufacturer. The theoretical predictions of the analysis have been compared with the experimental data obtained from the measurement of a device(600 V, 15 A) and show good agreement.