• Journal of Sensor Science and Technology
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• v.18 no.6
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• pp.475-484
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• 2009

In this paper, an analysis of the complementary CMOS active pixel and readout circuit is carried out. Complementary pixel structure which is different from conventional 3TR APS structure consists of photo diode, reset PMOS, several NMOSs and PMOSs sets for complementary signals. Proposed CMOS image sensors pixel has been fabricated using 0.5 standard CMOS process. Measured results show that the output signal range is from 0.8 V to 3.8 V. This output signal range increased 125 % compared to conventional 3TR pixel in the condition of 5 V power supply.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.517-518
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• 2008

Highly integrated ISFETs require the monolithic implementation of ISFETs, CMOS electronics, and additional sensors on the same chip This paper presents novel packaging type of CMOS ISFET pH sensor using standard CMOS FET chip and extended sensing membrane which is separated from CMOS FET. This proposed packaging type will make it easy to fabricate CMOS ISFET pH sensors

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.41-52
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• 2008

In this paper, a circuit analysis of the complementary CMOS active pixel and readout circuit is carried out. Complementary pixel structure which is different from conventional 3TR APS structure is consist of photo diode, reset PMOS, several NMOSs and PMOSs sets for complementary signals. Photo diode is modelled with Medici device program. HSPICE was used to analyze the variation of the signal feature depending on light intensity using $0.5{\mu}M$ standard CMOS process. Simulation results show that the output signal range is from 0.8 V to 4.5 V. This signal range increased 135 % output dynamic range compared to conventional 3TR pixel in the condition of 5 V power supply.

• 전자공학회논문지 IE
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• v.46 no.4
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• pp.8-15
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• 2009

In this paper, we are indicated CMOS Image sensor circuit SPICE analysis for the Photo Diode and pixel Modeling. We get a characteristic of the photoelectric current using a device simulator Medici and develop the Photodiode model for applying a SPICE simulation. For verifying the result, We compared the result of SPICE simulation with the result of mixed mode simulation about the testing circuit structure consisted photodiode and NMOS.

• Journal of Sensor Science and Technology
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• v.19 no.1
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• pp.25-30
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• 2010

This paper presents a low noise CMOS regulator for a low power capacitive sensor interface in a $0.5{\mu}m$ CMOS standard technology. Proposed LDO regulator circuit consist of a voltage reference block, an error amplifier and a new buffer between error amplifier and pass transistor for a good output stability. Conventional source follower buffer structure is simple, but has a narrow output swing and a low S/N ratio. In this paper, we use a 2-stage wide band OTA instead of source follower structure for a buffer. From SPICE simulation results, we got 0.8 % line regulation and 0.18 % load regulation.

• Korean Journal of Optics and Photonics
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• v.20 no.1
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• pp.57-60
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• 2009

We consider introducing an optical thin film to the light guiding wall of a pixel in order to enhance the light guiding efficiency of a CMOS image sensor. Simulating the reflectance as a function of the incidence angle using the Essential Macleod program, we find that the range of total internal reflection is greatly increased for several materials. Particularly when air is chosen as the thin film material, the critical angle of total internal reflection could be shifted to about 50 degrees.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.12
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• pp.1-9
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• 2003

In this paper, a novel Ni silicide technology with Cobalt interlayer and Titanium Nitride(TiN) capping layer for sub 100 nm CMOS technologies is presented, and the device parameters are characterized. The thermal stability of hi silicide is improved a lot by applying co-interlayer at Ni/Si interface. TiN capping layer is also applied to prevent the abnormal oxidation of NiSi and to provide a smooth silicidc interface. The proposed NiSi structure showed almost same electrical properties such as little variation of sheet resistance, leakage current and drive current even after the post silicidation furnace annealing at $700^{\circ}C$ for 30 min. Therefore, it is confirmed that high thermal robust Ni silicide for the nano CMOS device is achieved by newly proposed Co/Ni/TiN structure.

• Proceedings of the IEEK Conference
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• 2007.07a
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• pp.341-342
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• 2007

The IRFPA (InfraRed Focal Plane Array) ROIC (ReadOut Integrated Circuit) was designed in folded-cascode Op-Amp using $0.35{\mu}m$ CMOS technology. As the folded-cascode has high open-loop voltage gain and fast settling time, that used in many analog circuit designs. In this paper, folded-cascode Op-Amp for ROIC of the $32{\times}32$ IRFPA has been designed. HSPICE simulation results are unit gain bandwidth of 13.0MHz, 90.6 dB open loop gain, 8 V/${\mu}m$ slew rate, 600 ns settling time and $66^{\circ}$ phase margin.

• Journal of the Korean Institute of Intelligent Systems
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• v.24 no.5
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• pp.457-461
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• 2014

Using $0.18{\mu}m$ CMOS process silicon neuron circuit of the pulse type for modeling biological neurons, were designed in the semiconductor integrated circuit. Neuron circuiSt providing is formed by MOS switch for initializing the input terminal of the capacitor to the input current signal, a pulse signal and an amplifier stage for generating an output voltage signal. Synapse circuit that can convert the current signal output of the input voltage signal, using a bump circuit consisting of NMOS transistors and PMOS few. Configure a chain of neurons for verification of the neuron model that provides synaptic neurons and two are connected in series, were performed SPICE simulation. Result of simulation, it was confirmed the normal operation of the synaptic transmission characteristics of the signal generation of nerve cells.

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.387-394
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• 2005

In order to design SOI CMOS image sensors, SOI MOSFET model parameters were extracted using the equation of bulk MOSFET model parameters and were optimized using SPICE level 2. Simulated I-V characteristics of the SOI NMOSFET using the extracted model parameters were compared to the experimental I-V characteristics of the fabricated SOI NMOSFET. The simulation results agreed well with experimental results. A unit pixel for SOI CMOS image sensors was designed and was simulated for the PPS, APS, and logarithmic circuit using the extracted model parameters. In these CMOS image sensors, a nano-wire MOSFET photodetector was used. The output voltage levels of the PPS and APS are well-defined as the photocurrent varied. It is confirmed that SOI CMOS image sensors are faster than bulk CMOS image sensors.