• Title/Summary/Keyword: Nano gate

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Nonvolatile Memory Characteristics of Double-Stacked Si Nanocluster Floating Gate Transistor

  • Kim, Eun-Kyeom;Kim, Kyong-Min;Son, Dae-Ho;Kim, Jeong-Ho;Lee, Kyung-Su;Won, Sung-Hwan;Sok, Jung-Hyun;Hong, Wan-Shick;Park, Kyoung-Wan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.8 no.1
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    • pp.27-31
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    • 2008
  • We have studied nonvolatile memory properties of MOSFETs with double-stacked Si nanoclusters in the oxide-gate stacks. We formed Si nanoclusters of a uniform size distribution on a 5 nm-thick tunneling oxide layer, followed by a 10 nm-thick intermediate oxide and a second layer of Si nanoclusters by using LPCVD system. We then investigated the memory characteristics of the MOSFET and observed that the charge retention time of a double-stacked Si nanocluster MOSFET was longer than that of a single-layer device. We also found that the double-stacked Si nanocluster MOSFET is suitable for use as a dual-bit memory.

Electrical transport characteristics of deoxyribonucleic acid conjugated graphene field-effect transistors

  • Hwang, J.S.;Kim, H.T.;Lee, J.H.;Whang, D.;Hwang, S.W.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.482-483
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    • 2011
  • Graphene is a good candidate for the future nano-electronic materials because it has excellent conductivity, mobility, transparency, flexibility and others. Until now, most graphene researches are focused on the nano electronic device applications, however, biological application of graphene has been relatively less reported. We have fabricated a deoxyribonucleic acid (DNA) conjugated graphene field-effect transistor (FET) and measured the electrical transport characteristics. We have used graphene sheets grown on Ni substrates by chemical vapour deposition. The Raman spectra of graphene sheets indicate high quality and only a few number of layers. The synthesized graphene is transferred on top of the substrate with pre-patterned electrodes by the floating-and-scooping method [1]. Then we applied adhesive tapes on the surface of the graphene to define graphene flakes of a few micron sizes near the electrodes. The current-voltage characteristic of the graphene layer before stripping shows linear zero gate bias conductance and no gate operation. After stripping, the zero gate bias conductance of the device is reduced and clear gate operation is observed. The change of FET characteristics before and after stripping is due to the formation of a micron size graphene flake. After combined with 30 base pairs single-stranded poly(dT) DNA molecules, the conductance and gate operation of the graphene flake FETs become slightly smaller than that of the pristine ones. It is considered that DNA is to be stably binding to the graphene layer due to the ${\pi}-{\pi}$ stacking interaction between nucleic bases and the surface of graphene. And this binding can modulate the electrical transport properties of graphene FETs. We also calculate the field-effect mobility of pristine and DNA conjugated graphene FET devices.

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Design of 1,200 V Class High Efficiency Trench Gate Field Stop IGBT with Nano Trench Gate Structure (1 um 미만의 나노트렌치 게이트 구조를 갖는 1,200 V 고효율 트렌치 게이트 필드스톱 IGBT 설계에 관한 연구)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.4
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    • pp.208-211
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    • 2018
  • This paper details the design of a 1,200 V class trench gate field stop IGBT (insulated gate bipolar transistor) with a nano gate structure smaller than 1 um. Decreasing the size is important for lowering the cost and increasing the efficiency of power devices because they are high-voltage switching devices, unlike memory devices. Therefore, in this paper, we used a 2-D device and process simulations to maintain a gate width of less than 1 um, and carried out experiments to determine design and process parameters to optimize the core electrical characteristics, such as breakdown voltage and on-state voltage drop. As a result of these experiments, we obtained a wafer resistivity of $45{\Omega}{\cdot}cm$, a drift layer depth of more than 180 um, an N+ buffer resistivity of 0.08, and an N+ buffer thickness of 0.5 um, which are important for maintaining 1,200 V class IGBTs. Specially, it is more important to optimize the resistivity of the wafer than the depth of the drift layer to maintain a high breakdown voltage for these devices.

Characteristics of Si Nano-Crystal Memory

  • Kwangseok Han;Kim, Ilgweon;Hyungcheol Shin
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.1 no.1
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    • pp.40-49
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    • 2001
  • We have developed a repeatable process of forming uniform, small-size and high-density self-assembled Si nano-crystals. The Si nano-crystals were fabricated in a conventional LPCVD (low pressure chemical vapor deposition) reactor at $620^{\circ}c$ for 15 sec. The nano-crystals were spherical shaped with about 4.5 nm in diameter and density of $5{\times}l0^{11}/$\textrm{cm}^2$. More uniform dots were fabricated on nitride film than on oxide film. To take advantage of the above-mentioned characteristics of nitride film while keeping the high interface quality between the tunneling dielectrics and the Si substrate, nitride-oxide tunneling dielectrics is proposed in n-channel device. For the first time, the single electron effect at room temperature, which shows a saturation of threshold voltage in a range of gate voltages with a periodicity of ${\Delta}V_{GS}\;{\approx}\;1.7{\;}V$, corresponding to single and multiple electron storage is reported. The feasibility of p-channel nano-crystal memory with thin oxide in direct tunneling regime is demonstrated. The programming mechanisms of p-channel nano-crystal memory were investigated by charge separation technique. For small gate programming voltage, hole tunneling component from inversion layer is dominant. However, valence band electron tunneling component from the valence band in the nano-crystal becomes dominant for large gate voltage. Finally, the comparison of retention between programmed holes and electrons shows that holes have longer retention time.

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Novel properties of erbium-silicided n-type Schottky barrier metal-oxide-semiconductor field-effect-transistors

  • Jang, Moon-Gyu;Kim, Yark-Yeon;Shin, Jae-Heon;Lee, Seong-Jae;Park, Kyoung-Wan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.2
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    • pp.94-99
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    • 2004
  • silicided 50-nm-gate-length n-type Schottky barrier metal-oxide-semiconductor field-effect-transistors (SB-MOSFETs) with 5 nm gate oxide thickness are manufactured. The saturation current is $120{\mu}A/{\mu}m$ and on/off-current ratio is higher than $10^5$ with low leakage current less than $10{\mu}A/{\mu}m$. Novel phenomena of this device are discussed. The increase of tunneling current with the increase of drain voltage is explained using drain induced Schottky barrier thickness thinning effect. The abnormal increase of drain current with the decrease of gate voltage is explained by hole carrier injection from drain into channel. The mechanism of threshold voltage increase in SB-MOSFETs is discussed. Based on the extracted model parameters, the performance of 10-nm-gate-length SB-MOSFETs is predicted. The results show that the subthreshold swing value can be lower than 60 mV/decade.

High power gate driver design using 555 timer and photo coupler for electronic/hybrid car and electroplating rectifier (전기/하이브리드 자동차, 도금용 정류기 등에 적용이 가능한 555 timer와 Photo Coupler를 이용한 대용량 SCR/IGBT용 Gate Driver 설계)

  • Cho, Eun Seok;Ko, Jae Su;Lee, Yong Keun
    • Korea Science and Art Forum
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    • v.20
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    • pp.421-428
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    • 2015
  • Electronic/hybrid car and electroplating rectifier should have switching devices such as SCR, MOSFET, IGBT. And those switching devices should be operated by gate driver. In this paper, we propose high power gate driver that contains H-Bridge using 4 BJTs. H-Bridge and transformer generate isolate power. And gate control signal is transferred to isolated one by photo coupler and operate real switching device. We designed H-Bridge and 555-Timer by PSpice simulation and manufactured real product. Finally we succeed to operate 27V 50,000A electroplating rectifier using proposed gate driver.

Device Design Guideline for Nano-scale SOI MOSFETs (나노 스케일 SOI MOSFET를 위한 소자설계 가이드라인)

  • Lee, Jae-Ki;Yu, Chong-Gun;Park, Jong-Tae
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.7
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    • pp.1-6
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    • 2002
  • For an optimum device design of nano-scale SOI devices, this paper describes the short channel effects of multi-gate structures SOI MOSFETs such as double gate, triple gate and quadruple gate, as well as a new proposed Pi gate using computer simulation. The simulation has been performed with different channel doping concentrations, channel widths, silicon film thickness, and vertical gate extension depths of Pi gate. From the simulation results, it is found that Pi gate devices have a large margin in determination of doping concentrations, channel widths and film thickness comparing to double and triple gate devices because Pi gate devices offer a better short channel effects.

Fabrication of gate electrode for OTFT using screen-printing and wet-etching with nano-silver ink

  • Lee, Mi-Young;Song, Chung-Kun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.889-892
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    • 2009
  • We have developed a practical printing technology for the gate electrode of organic thin film transistors(OTFTs) by combining screen-printing with wet-etching process using nano-silver ink as a conducting material. The screen-printed and wet-etched Ag electrode exhibited a minimum line width of ~5 um, the thickness of ~65 nm, and a resistivity of ${\sim}10^{-6}{\Omega}{\cdot}cm$, producing good geometrical and electrical characteristics for gate electrode. The OTFTs with the screen-printed and wet-etched Ag electrode produced the saturation mobility of $0.13cm^2$/Vs and current on/off ratio of $1.79{\times}10^6$, being comparable to those of OTFT with the thermally evaporated Al gate electrode.

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Gate-Length Dependent Cutoff Frequency Extraction for Nano-Scale MOSFET (Nano-Scale MOSFET의 게이트길이 종속 차단주파수 추출)

  • Kim, Joung-Hyck;Lee, Yong-Taek;Choi, Mun-Sung;Ku, Ja-Nam;Lee, Seong-Heam
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.12
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    • pp.1-8
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    • 2005
  • The gate length-dependence of cutoff frequency is modeled by using scaling parameter equations of equivalent circuit parameters extracted from measured S-parameters of Nano-scale MOSFETs. It is observed that the modeled cutoff frequency initially increases with decreasing gate length and then the rate of increase becomes degraded at further scale-down. This is because the extrinsic charging time slightly decreases, although the intrinsic transit time greatly decreases with gate length reduction. The new gate length-dependent model will be very helpful to optimize RF performances of Nano-scale MOSFETs.