• Journal of Mechanical Science and Technology
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• v.16 no.10
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• pp.1187-1200
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• 2002

This paper is concerned with the design or an LMI (Linear Matrix Inequality) -based H$\infty$ controller for a line of sight (LOS) stabilization system and with its robustness performance. The linearization of the system is necessary to analyze various nonlinear characteristics, but the linearization entails modeling uncertainties which reduce its performance. In addition, the stability of the LOS can be adversely affected by angular velocity disturbances while the vehicle is moving. As the vehicle accelerates, all the factors that are Ignored and simplified for the linearization tend to Inhibit the performance of the system. The robustness in the face of these uncertainties needs to be assured. This paper employs H$\infty$ control theory to address these problems and the LMI method to provide a suitable controller with minimal constraints for the system. Even though the system matrix does not have a full rank, the proposed method makes it possible to design a H$\infty$ controller and to deal with R and S matrices for reducing the system order. It can be also shown that the proposed robust controller has a better disturbance attenuation and tracking performance. The LMI method is also used to enhance the applicability of the proposed reduced-order H$\infty$ controller for the system given. The LMI-based H$\infty$ controller has superior disturbance attenuation and reference input tracking performance, compared with that of the conventional controller under real disturbances.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• Elastomers and Composites
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• v.47 no.3
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• pp.231-237
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• 2012

This study measured the mechanical and damping properties of EPDM compounds including fillers. Semi-reinforcing furnace black (SRF), high abrasion furnace black (HAF) and acetylene black were used as fillers. Dicumyl peroxide (DCP) were used as curing agents. The measurements were conducted using a moving die rheometer (MDR), durometer, universal testing machine (UTM), compression set and dynamic mechanical analysis (DMA). The tensile strength and elongation at break increased with increasing SRF contents in EPDM compounds. However, they decreased with increasing the amount of acetylene black. In the inspecting temperature range, EPDM compound filled acetylene black had stable storage modulus. Furthermore, the tan ${\delta}$ of the EPDM compounds obtained was enhanced by compounding with acetylene black.

• Journal of the Korean Institute of Gas
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• v.3 no.3 s.8
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• pp.39-44
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• 1999

In the study, corrosion characteristics under various corrosion environments(neutral solution, acid solution), for various hinge materials(SM20C, BsC3 and STC4H), were investigated by immersion test, and the behaviour of fretting wear under atmosphere was studied. In immersion test, corrosion potential of those materials showed to be noble in the sequence of $0.5\%HNO_3$> underground water> $0.5\%\;H_2SO_4$ solution, and potential of a sole material, except BsC3, was more noble than these of mixed materials. In same material SM20C, the fretting wear loss of rotary materials increased about 1.9 times to that of moving materials, because of surface hardening by frictional force.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of Digital Convergence
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• v.15 no.7
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• pp.13-25
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• 2017

The Korean government is pursuing technological development through nearly every government agency, and Korea's growing R&D spending is yielding good results in many fields. With the country moving from the technology development stage to the demonstration stage, it is actively implementing testbed projects to demonstrate developed technologies and services. This is, however, not without problems. There is no consistent systematic system for the testbed projects because government agencies compete against each other in the planning of execution of R&D: they do not work together. The most serious problem is that both testbeds and developed technologies die out due to poor operation management after the completion of test projects. Research should, therefore, be done on operation management and commercialization. However, the government still does not consider the system after the test: it focuses on building testbeds to verify developed technologies. This study intends to determine the basic orientation of operation management to ensure maximum performance, efficiency, and continuity of national projects through intensive analysis of ongoing national R&D testbed projects and examination of success stories of operation management at home and abroad.

• Journal of Animal Science and Technology
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• v.45 no.4
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• pp.649-658
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• 2003

Early introducing the ducks into the paddy field involves a variety of environmental changes such as new surroundings and contact with water, so that some free-ranged ducks show behavioral and physiological changes indicative of stress or die from not adapted for new circumstances. Moreover, the free-ranged ducks was tread on the rice plant, and required a great deal of labor and time for captured the ducks after finishing the introducing. The aim of the present study was to examine the effect of accustoming and imprinting of duckling on behavior patterns, body weight gain and yield of the rice plant in paddy fields. Three paddy plots were used as control (no imprinting and no contact with people), taming (imprinting and regular handling) and roughness (handling roughly and strike terror to ducks) plots. Right after introducing the ducks into the paddy field, eating and moving behaviour of taming plot ducks tended to be longer time spend than that of other treatments. However, eating and moving time tended to be longer in the control than that of other two treatments on the 2 weeks after. Flighting distance was not showed in the free-ranging period taming plot, but the control plot was significantly (P<0.05) longer than the roughness plot. The captured time of free-ranged ducks tended to be shorter in the order of taming, control and roughness plots. Body weight gains was not significant. The number of rice plants damaged by free-ranging ducks in the taming plot were significantly (P<0.05) less than that in the control plot, but the yield and yield components of the rice plant were not differ among 3 treatments. These results indicated that the imprinting or regular handling and related treatments of duckling was reducing badly damage of rice plants, captured time and labor of free-ranged ducks in paddy field, although the working behavior of ducks and yield ability of the rice plants were not affected.

• Journal of the Korean Applied Science and Technology
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• v.35 no.1
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• pp.173-185
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• 2018

Effects of three different types of dispersions and flow improving additives composed with fatty acid esters, fatty acid metal salts and amide compound on the vulcanization and the mechanical properties properties of rubber compounds of EPDM and carbon black as fillers. were investigated using Mooney viscometer, moving die rheometer, hardness tester, and universal test machine. The aging characteristics of vulcanized EPDM compounds were also investigated. The Mooney viscosity measured at $125^{\circ}C$ showed a tendency to decrease in the order of amide type> metal salt type > ester type additive. Scorch time showed little or no difference with the addition of ester or metal salt type additives, but the amide type additive shortened a scorch time more than one minute. Rheological measurement data obtained at $160^{\circ}C$ showed that the vulcanization time was faster for metal salt type and amide type additive systems. Delta torque values of EPDM compound increased with metal salt type and amide type additives, but slightly decreased with ester type additive. The tensile strength of the EPDM compound was greatly improved when an ester type additive was added, but the amide type or metal salt type additive had no significant effect. The elongation was significantly improved for metal salt type additive, while the rest were not significantly affected. The tear strength of the EPDM compounds increased with the addition of all kinds of additives, and it increased remarkably in the case of metal salt type additive. Hardness of the EPDM compounds was nearly same value regardless of additive types. The thermal aging of the EPDM blend at $100^{\circ}C$ for 24 h showed little change in the case of metal salt type or amide type additive, but the elongation tends to decrease by 10-20% for all EPDM compounds containing additives.