• 한국정밀공학회지
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• 제30권6호
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• pp.638-643
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• 2013

Laser beam machining (LBM) is fast, contactless and able to machine various materials. So it is used to cut metal, drill holes, weld or pattern the imprinted surface. However, after LBM, there still leave burrs and recast layers around the machined area. In order to remove these unwanted parts, LBM process often uses electrochemical etching (ECE). But, the total thickness of workpiece is reduced because the etching process removes not only burrs and recast layers, but also the entire surface. In this paper, surface coating was performed using enamel after LBM on metal. The recast layer can be selectively removed without decreasing total thickness. Comparing with LBM process only, the surface quality of enamel coating process was better than that. And edge shape was also maintained after ECE.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.793-796
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• 2005

In this paper, we propose a method which can improve uniformity of a miniaturized electron beam array for inspection of very small pattern with high speed using vertical interconnection. This method enables the individual control of columns so that it can reduce the deviation of beam current, beam size, scan range and so on. The test device that used vertical interconnection method was fabricated by multiple wafer bonding and metal reflow. Two silicon and one glass wafers were bonded and metal interconnection by melting of electroplated AuSn was performed. The contact resistance was under $10{\Omega}$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.313-313
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• 2016

Transparent conductive oxide (TCO) films have many disadvantages, such as rarity, possible exhaustion, process temperature limitations, and brittleness on a flexible substrate. In particular, as display technology moves toward flexible displays, TCO will become completely unsuitable due to its brittleness. To address theses issue, many researchers have been studying TCO substitutes. In recent efforts, metal nanowires, conducting polymers, carbon nanotube networks, graphene films, hybrid thin films, and metal meshes/grids have been evaluated as candidates to replace TCO electrodes. In this study, we fabricated the TCO film with Ag meshes shape using polystyrene (PS) beads monolayer on the substrate. The PS beads were used as a template to create the mesh pattern. We fabricated the monolayer on the flexible substrate (PES) with the well-aligned PS beads. Electrodes with Ag mesh shape were formed using this patterned monolayer. We could fabricated the Ag mesh electrode with the sheet resistance with $8ohm{\Omega}/{\Box}$.

• 한국세라믹학회지
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• 제27권1호
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• pp.1-6
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• 1990

Preparation and heavy metal ion adsorption of sumicron hydroxy apatite were studied in this experiment. Submicron HAP was synthesized with Ca(OH)2 solution and H3PO4.Ca(OH)2 solution was made from water-quenching of CaCO3 heated at 1, 00$0^{\circ}C$ and 20%-H3PO4 was dropped into this Ca(OH)2 solution heated at 8$0^{\circ}C$. XRD pattern of prepared powder showed HAP crystal. The average particle size and sahpe of HAP were 0.25${\mu}{\textrm}{m}$ and sphere type. As a adsorbent, 1.0g of the prepared HAP powder in 1 liter of artifical 5ppm heavy matal waste water was sufficient, and more effective at pH7-9.

• 한국생산제조학회지
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• 제26권4호
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• pp.430-435
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• 2017

The effect of the surface profile on CFRP and aluminum metal bonding was studied. A small number of steps were made on the aluminum surface, and the shear stress and elongation were measured using a shear test after bonding with an autoclave method. As the number of surface steps increased, the shear stress and elongation increased. The surface bonding strength increased because of the effect of the mechanical and chemical bonding. When the number of effective stages was exceeded, the shear strength decreased again due to the aspect ratio of the step and the reduction of the penetration effect of the resin into the groove.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.859-862
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• 2001

This study describes a selective Ag etching solution for use with pattern on the surface of copper. This etching solution uses potassium iodide and potassium sulfate as the ligand that coordinates to the metal ions and ferricyanide as the oxidant. The etching rate was depended on the concentration of co-ligands and time. But the etching rate wasn't depended on the pH(2∼6), and oxidant(K$_3$Fe(CN)$\_$6/). Complete etching of silver can be achieved rapidly within 90sec for 4.46${\mu}$m thick metal films when aqueous solutions containing K$_3$Fe(CN)$\_$6/, K$_2$S$_2$O$\_$8/ and KI was used. This etching solution was characteristic of anisotropic etching.

• Transactions on Electrical and Electronic Materials
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• 제5권3호
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• pp.104-108
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• 2004

Problems of overlap errors and side-lobe printing by the design rule reduction in the lithography process using attenuated phase-shifting masks(attPSM) have been serious. Overlap errors and side-lobes can be simultaneously solved by the rule-based correction using scattering bars with the rules extracted from test patterns. Process parameters affecting the attPSM lithography simulation have been determined by the fitting method to the process data. Overlap errors have been solved applying the correction rules to the metal patterns overlapped with contact/via. Moreover, the optimal insertion rule of the scattering bars has made it possible to suppress the side-lobes and to get additional pattern fidelity at the same time.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권2호
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• pp.141-146
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• 2002

The effect of the wide-bandgap Schottky barrier enhancement cap layer on the performance of metal-semiconductor-metal photodetectors (MSMPD's) is presented. Judged by the dc characteristics, no considerable increase in recombination loss of carriers is resulted by the incorporation of the cap layer. However, about 45% of the detection efficiency is lost for the cap-layered MSMPD's even with a graded layer incorporated under pulse operation, and it was found to be due mainly to the capturing and slow release of the photocarriers at the heterointerface. The loss mechanism of the pulse detection efficiency is believed to be responsible for the intersymbol interference and the increased bit-error-rate (BER) observed in MSMPD's when used with a high bit rate pseudo-random-bit-stream (PRBS) data pattern.

• 대한전자공학회논문지
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• 제25권7호
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• pp.791-798
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• 1988

Films of Cr, Cu, and Al were deposited by the evaporation technique at the high vacuum level-high evaporation rate and the low vacuum level-low evaporation rate. We measured sheet resistance and light transmittance, and observed microstructure and diffraction pattern by TEM, and investigated oxygen content in thin film by AES. We discussed the relations among microstructure, sheet resistance, and light transmittance with AES data. We found that the films deposited at the high vacuum level-high evaporation rate have small oxygen content in thin film comparing to the films deposited at the low vacuum level-low vacuum level-low evaporation rate, and that the films having crystalline structure and larger grain size were formed in the case of the high vacuum level-high evaporation rate and they showed lower sheet resistance and lower light transmittance.

• 소성∙가공
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• 제14권3호
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• pp.224-232
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• 2005

The high-pressure die-casting is one of the most effective methods to produce a large amount of products in short cycle time. This process, however, has a problem that the gas porosity defect appears easily. The generation of gas porosity is known mainly due to the air entrapment during the injection stage. Most of numerical simulations for the molten metal flow pattern observations have done in the treating of one phase fluid flow but the gas-liquid interface is essentially multi- phase phenomenon. In this paper, the two-phase fluid flow numerical simulation methods have been adapted to predict the gas porosity generations in the molten metal. The accuracy and the usefulness of the new simulation module have been emphasized and verified through some comparison experiments.