Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2005.11a
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- Pages.793-796
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- 2005
Wafer level vertical interconnection method for microcolumn array
마이크로컬럼 어레이에 적용 가능한 웨이퍼단위의 수직 배선 방법
- Han, Chang-Ho (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Kim, Hyeon-Cheol (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Kang, Moon-Koo (School of Electrical Engineering and Computer Science, Seoul National University) ;
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Chun, Kuk-Jin
(School of Electrical Engineering and Computer Science, Seoul National University)
- 한창호 (서울대학교 공과대학 전기, 컴퓨터 공학부) ;
- 김현철 (서울대학교 공과대학 전기, 컴퓨터 공학부) ;
- 강문구 (서울대학교 공과대학 전기, 컴퓨터 공학부) ;
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전국진
(서울대학교 공과대학 전기, 컴퓨터 공학부)
- Published : 2005.11.26
Abstract
In this paper, we propose a method which can improve uniformity of a miniaturized electron beam array for inspection of very small pattern with high speed using vertical interconnection. This method enables the individual control of columns so that it can reduce the deviation of beam current, beam size, scan range and so on. The test device that used vertical interconnection method was fabricated by multiple wafer bonding and metal reflow. Two silicon and one glass wafers were bonded and metal interconnection by melting of electroplated AuSn was performed. The contact resistance was under
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