• 한국전기전자재료학회논문지
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• 제33권6호
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• pp.445-449
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• 2020

Non-volatile memory is approaching its fundamental limits with the Si₃N₄ storage layer, necessitating the use of alternative materials to achieve a higher programming/erasing speed, larger storage window, and better data retention at lower operating voltage. This limitation has restricted the development of the charge-trap memory, but can be addressed by using high-k dielectrics. The paper reviews the doping of nitrogen, titanium, and yttrium on high-k dielectrics as a storage layer by comparing MONOS devices with different storage layers. The results show that nitrogen doping increases the storage window of the Gd₂O₃ storage layer and improves its charge retention. Titanium doping can increase the charge capture rate of HfO₂ storage layer. Yttrium doping increases the storage window of the BaTiO₃ storage layer and improves its fatigue characteristics. Parameters such as the dielectric constant, leakage current, and speed of the memory device can be controlled by maintaining a suitable amount of external impurities in the device.

• 대한전자공학회논문지SD
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• 제47권3호
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• pp.7-17
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• 2010

본 논문은 4-트랜지스터 래치 셀을 이용한 저전력향 신개념의 SRAM을 제안한다. 4-트랜지스터 메모리 셀은 종래의 6-트랜지스터 SRAM 셀에서 access 트랜지스터를 제거한 형태로, PMOS 트랜지스터의 소스는 비트라인 쌍에 연결되고 NMOS 트랜지스터의 소스는 두개의 워드라인에 각각 연결된다. 동작시 워드라인에 일정크기의 전압을 인가할 때 비트라인에 흐르는 전류를 감지하여 읽기동작을 수행하고, 비트라인 쌍에 전압차이를 두고 워드라인에 일정크기의 전압을 인가하여 쓰기동작을 수행한다. 이는 공급전압 보다 낮은 소신호 전압으로 워드라인과 비트라인을 구동하여 메모리 셀의 데이터를 저장하고 읽어낼 수 있어서 동작 소비전력이 적다. 아울러 셀 누셀전류 경로의 감소로 인해 대기 소모전력 또한 개선되는 장점이 있다. 0.18-${\mu}m$ CMOS 공정으로 1.8-V, 16-kbit SRAM test chip을 제작하여 제안한 회로기술을 검증하였고, 칩 면적은 $0.2156\;mm^2$이며 access 속도는 17.5 ns 이다. 동일한 환경에서 구현한 종래의 6-트랜지스터 SRAM과 비교하여 읽기동작시 30% 쓰기동작시 42% 동작소비전력이 적고, 대기전력 또한 64% 적게 소비함을 관찰하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.319-322
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• 2003

To match the charge induced by the insulators $CeO_2$ with the remanent polarization of ferro electric SBT thin films, areas of Pt/SBT/Pt (MFM) and those of $Pt/CeO_2/Si$ (MIS) capacitors were ind ependently designed. The area $S_M$ of MIS capacitors to the area $S_F$ of MFM capacitors were varied from 1 to 10, 15, and 20. Top electrode Pt and SBT layers were etched with for various area ratios of $S_M\;/\;S_F$. Bottom electrode Pt and $CeO_2$ layers were respectively deposited by do and rf sputtering in-situ process. SBT thin film were prepared by the metal orgnic decomposition (MOD) technique. $Pt(100nm)/SBT(350nm)/Pt(300nm)/CeO_2(40nm)/p-Si$ (MFMIS) gate structures have been fabricated with the various $S_M\;/\;S_F$ ratios using inductively coupled plasma reactive ion etching (ICP-RIE). The leakage current density of MFMIS gate structures were improved to $6.32{\times}10^{-7}\;A/cm^2$ at the applied gate voltage of 10 V. It is shown that in the memory window increase with the area ratio $S_M\;/\;S_F$ of the MFMIS structures and a larger memory window of 3 V can be obtained for a voltage sweep of ${\pm}9\;V$ for MFMIS structures with an area ratio $S_M\;/\;S_F\;=\;6$ than that of 0.9 V of MFS at the same applied voltage. The maximum memory windows of MFMIS structures were 2.28 V, 3.35 V, and 3.7 V with the are a ratios 1, 2, and 6 at the applied gate voltage of 11 V, respectively. It is concluded that ferroelectric gate capacitors of MFMIS are good candidates for nondestructive readout-nonvolatile memories.

• 한국결정성장학회지
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• 제8권3호
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• pp.411-418
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• 1998

LPCVD 방법으로 실리콘 산화막 두께 10nm에서 80nm인 MOS를 제작하였다. 그리고 스트레스 전계 산화막 전류의 두께 의존성을 조사하였다. 산화막 전류는 스트레스 전류와 전이전류로 구성되어 있음을 보여 주었다. 스트레스 전류는 스트레스 유기 누설전류와 직류전류로 이루어졌으며 산화막을 통하는 트립 어시스트 터널링으로 행해진다. 전이전류는 계면에서 트랩의 터널링 충전과 방전에 의해 이루어진다. 스트레스 전류는 산화막 전류의 두계 한계를 평가하는데 이용되고 전이전류는 기억소자에서 데이터 유지에 사용된다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.35-35
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• 2003

Recent progress in the integration of the ferroelectric random access memories (FRAM) has attracted much interest. Strontium bismuth tantalate(SBT) is one of the most attractive materials for use in nonvolatile-memory applications due to low-voltage operations, low leakage current, and its excellent fatigue-free property. High-density FRAMs operated at a low voltage below 1.5V are applicable to mobile devices operated by battery. SBT films thinner than 0.1 #m can be operated at a low voltage, because the coercive voltage (Vc) decreases as the film thickness is reduced. In addition, the thickness of the SBT film will have to be reduced so it can fit between adjacent storage nodes in a pedestal type capacitor in future FRAMs.

• International Journal of Railway
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• 제1권1호
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• pp.6-11
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• 2008

This paper presents a performance characteristic analysis methodology for a linear induction motor used for a lightweight train. In general, an analytical method cannot provide accurate results in a linear motor because of large airgap, end effect, transverse edge effect, 3-dimensional configurations, large leakage, and so on. Besides, a numerical method requires lots of memory and solving time for transient analysis. However, the suggested methodology which is a kind of hybrid solution with an analytical method and a numerical method is very fast and accurate. Based on the methodology, 3-D FEM analyses for various design schemes of the secondary reaction plate have been done and from the analysis results, the best configuration for an urban railway transit is chosen.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 1999년도 제1회 학술대회논문집(KIASC 1st conference 99)
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• pp.125-128
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• 1999

This paper presents the 2-D analysis of damper transient in superconducting of damper transient in superconducting synchronous generator(SCG) using finite element method. Efficient 2-D analysis model which compensates the leakage flux is proposed for the savign of computation time and memory capacity required in 3-D finite element analysis. The characteristics of damper transient in SCG and the prime role of damper also have been evaluated.

• 한국세라믹학회지
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• 제31권10호
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• pp.1115-1122
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• 1994

ZT/PZT/ZT multi-layered thin films were deposited on silicon substrate by co-sputtering method for FEMFET device application. Effects of Pb/(Zr+Ti) ratio, films thickness, annealing conditions and substrate temperature on the ferroelectric behavior of the multi-layered films were studied. The best memory device characteristics with leakage current of 2$\times$10-8 A/$\textrm{cm}^2$ and breakdown field of about 1 MV/cm could be obtained with ZT(250 $\AA$) / PZT(1000 $\AA$)/ZT(750 $\AA$) multi-layered thin film deposited at 35$0^{\circ}C$ and post-annealed at $700^{\circ}C$ for 120 sec by RTA(Rapid Thermal Annealing).

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.221-224
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• 2000

We have successfully demonstrated metal-ferroel-ectric-insulator-semiconductor (MFIS) devices using Al/LiNbO$_{3}$/SiN/Si structure. The SiN thin films were made into metal -insulator- semiconductor (MIS) devices by thermal evaporation of aluminum source in a dot away on the surface. The interface property of MFIS from 1MHz & quasistatic C-V is good and the memory window width is about 1.5V at 0.2V/s signal voltage sweep rate. The gate leakage current density of MFIS capacitors using a aluminum electrode showed the least value of 1x10$^{-8}$ A/$\textrm{cm}^2$ order at the electric field of 300㎸/cm. And the XRD patterns shows the probability of applications of LN for MFIS devices for FeRAMs on amorphous SiN buffer layer.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2002년도 춘계학술대회논문집
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• pp.71-77
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• 2002

The spectrum of impulse response signal which is obtained from an impulse hammer testing is used for frequency response function, nevertheless it has serious faults when the record length for the signal processing is not very long. The faults cannot be avoided with the conventional signal analyzer that is processing all the signals as if they are always periodic. The signals generated by the impact hammer are undoubtedly non-periodic because of the damping, and are acquired for limited recording time due to the memory as well as the computation performance of the signal analyzer. This paper will make clear the relation between the faults and the length of recording time, and propose the way for solving the faults.