• IMMUNE NETWORK
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• 제23권1호
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• pp.10.1-10.16
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• 2023

Memory T (Tm) cells protect against Ags that they have previously contacted with a fast and robust response. Therefore, developing long-lived Tm cells is a prime goal for many vaccines and therapies to treat human diseases. The remarkable characteristics of Tm cells have led scientists and clinicians to devise methods to make Tm cells more useful. Recently, Tm cells have been highlighted for their role in coronavirus disease 2019 vaccines during the ongoing global pandemic. The importance of Tm cells in cancer has been emerging. However, the precise characteristics and functions of Tm cells in these diseases are not completely understood. In this review, we summarize the known characteristics of Tm cells and their implications in the development of vaccines and immunotherapies for human diseases. In addition, we propose to exploit the beneficial characteristics of Tm cells to develop strategies for effective vaccines and overcome the obstacles of immunotherapy.

• 전기전자학회논문지
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• 제23권3호
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• pp.954-961
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• 2019

본 논문에서는 트랜지스터의 문턱전압 보다 낮은 초저전압 환경에서도 안정적으로 동작할 수 있는 8T SRAM에 대해 기술하였다. 제안한 메모리 셀은 대칭적인 8개의 트랜지스터로 구성되며, 셀 내부의 데이터 저장 래치는 열 방향의 보조라인을 통해 제어된다. 읽기동작 시, 데이터 저장노드와 비트라인이 동적으로 분리되어 비트라인으로부터 교란을 받지 않는다. 또한, 노이즈에 민감한 '0'-노드 전압상승이 낮아 dummy-read 안정도가 높다. 아울러, 제안한 셀은 쓰기능력을 높이기 위해 boosting 전압을 사용한다. 상용화된 8T SRAM 셀과 비교했을 때, 제안한 셀의 dummy-read 마진과 쓰기마진이 0.4 V 전원 전압에서 각각 65%, 3.7배 향상된 안정성을 보이며, 공정변화에 따른 안정도의 내성이 더 우수하다. 활용 예시를 위해 산업체에서 제공하는 180 nm CMOS 공정으로 SRAM 회로를 설계하여 그 동작 및 성능을 검증하였다.

• 한국산업정보학회논문지
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• 제18권5호
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• pp.19-23
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• 2013

본 논문에서는 고속 데이터 처리용 TCAM(Ternary Content Addressable Memory) 설계를 위하여 6T SRAM cell의 안정성 분석 방법에 대해 기술하였다. TCAM은 고속 데이터 처리를 목적으로 하기 때문에 동작 주파수가 높아질수록 필요 시 되는 CMOS 공정의 단위가 작아지게 된다. 공급 전압의 감소는 TCAM 동작에 불안정한 영향을 줄 수 있으므로 SRAM cell 안정성 분석을 통한 TCAM 설계가 필수적이다. 우리는 6T SRAM의 정적 노이즈 마진(SNM)을 측정하여 분석하였고, TCAM의 모든 시뮬레이션은 $0.18{\mu}m$ CMOS 공정을 사용하여 확인하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.485-488
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• 2004

As scaling down the cell channel length, the increment of B concentration in channel region is inevitable to overcome the punch-through, especially in flash memory cell with 90nm technology. This paper shows that the high dose ion implantation in channel cause the Si defect. which has been proved to be the major cause of the tailed Vth in distribution. And also mechanical stress due to SiN-anneal process can induce the Si dislocation. and get worse it. With decreasing the channel implantation dose, skipping the anneal and reducing the mechanical stress, Si defect problem is solved completely. We are verify first that the optimization of B concentration in channel must be certainly considered in order to improve Si defect. It is also certainly necessary to stabilize the distribution of cell Vth in the next generation of flash memory.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권6호
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• pp.781-792
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• 2016

This paper presents a new approach to enhance the data retention of logic-compatible embedded DRAMs. The memory bit-cell in this work consists of two logic transistors implemented in generic triple-well CMOS process. The key idea is to use the parasitic junction capacitance built between the common cell-body and the data storage node. For each write access, a voltage transition on the cell-body couples up the data storage levels. This technique enhances the data retention and the read performance without using additional cell devices. The technique also provides much strong immunity from the write disturbance in the nature. Measurement results from a 64-kbit eDRAM test chip implemented in a 130 nm logic CMOS technology demonstrate the effectiveness of the proposed circuit technique. The refresh period for 99.9% bit yield measures $600{\mu}s$ at 1.1 V and $85^{\circ}C$, enhancing by % over the conventional design approach.

• 대한임베디드공학회논문지
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• 제18권1호
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• pp.31-40
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• 2023

Recent advances in flash technologies, such as 3D processing and multileveling schemes, have successfully increased the flash capacity. Unfortunately, these technology advances significantly degrade flash's reliability due to a smaller cell geometry and a finer-grained cell state control. In this paper, we propose an asymmetric BER-aware reliability optimization technique (aBARO), new flash optimization that improves the flash reliability. To this end, we first reveal that bit errors of 3D NAND flash memory are highly skewed among flash cell states. The proposed aBARO exploits the unique per-state error model in flash cell states by selecting the most error-prone flash states and by forming narrow threshold voltage distributions (for the selected states only). Furthermore, aBARO is applied only when the program time (tPROG) gets shorter when a flash cell becomes aging, thereby keeping the program latency of storage systems unchanged. Our experimental results with real 3D MLC and TLC flash devices show that aBARO can effectively improve flash reliability by mitigating a significant number of bit errors. In addition, aBARO can also reduce the read latency by 40%, on average, by suppressing the read retries.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권3호
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• pp.195-203
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• 2005

Recently, a novel multi-bit nonvolatile memory based on double gate (DG) MOSFET is proposed to overcome the short channel effects and to increase the memory density. We need more complex voltage schemes for DG MOSFET devices. In view of peripheral circuits driving memory cells, one should consider various voltage sources used for several operations. It is one of the key issues to minimize the number of voltage sources. This criterion needs more caution in considering a DG nonvolatile memory cell that inevitably requires more number of events for voltage sources. Therefore figuring out the permissible range of operating bias should be preceded for reliable operation. We found that reliable operation largely depends on the depletion conditions of the silicon channel according to charge amount stored in the floating gates and the negative control gate voltages applied for read operation. We used Silvaco Atlas, a 2D numerical simulation tool as the device simulator.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.15-16
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• 2005

Chalcogenide phase change memory has high performance to be next generation memory, because it is a nonvolatile memory processing high programming speed, low programming voltage, high sensing margin, low consumption and long cycle duration. We have developed a new material of PRAM with $Ge_1Se_1Te_2$. This material has been propose to solve the high energy consumption and high programming current. We have investigated the phase transition behaviors in function of various process factor including contact size, cell size, and annealing time. As a result, we have observed that programming voltage and writing current of $Ge_1Se_1Te_2$ are more improved than $Ge_2Sb_2Te_5$ material.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.56-56
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• 2009

In this study, we fabricated the engineered $SiO_2/Si_3N_4/SiO_2$(ONO) tunnel barrier with high-k $HfO_2$ trapping layer for application high performance flash MLC(Multi Level Cell). As a result, memory device show low operation voltage and stable memory characteristics with large memory window. Therefore, the engineered tunnel barrier with ONO stacks were useful structure would be effective method for high-integrated MLC memory applications.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권5호
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• pp.566-571
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• 2014

Channel-stacked 3D NAND flash memory is very promising candidate for the next-generation NAND flash memory. However, there is an inherent issue on cell size variation between stacked channels due to the declined etch slope. In this paper, the effect of the cell variation on the incremental step pulse programming (ISPP) characteristics is studied with 3D TCAD simulation. The ISPP slope degradation of elliptical channel is investigated. To solve that problem, a new programming method is proposed, and we can alleviate the $V_T$ variation among cells and reduce the total programming time.