• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.124-128
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• 2001

We apply for the first time a low cost and loss wafer level packaging technology for RF-MEMS device. The proposed structure was simulated by finite element method (FEM) tool (HFSS of Ansoft). S-parameter measured of the package shows the return loss (S11) of 20dB and the insertion loss (S21) of 0.05dB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.152-152
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• 2009

We investigate micro-tip properties as Ni-Co plating and CMP processes for MEMS probe card and units. The micro-tip are fabricated by using Ni-Co plating machine, lapping machine, and chemo-mechanical polisher. In order to get high conductive and reliable micro-tip, we control Co contents and thickness by CMP speed. We have found that about 20-25% of Co contents are required and have to lapping speed of 30 rpm. Also, we investigate photolithography and Ni-Co plating processes conditions for the one-step and the three-step micro-tips.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.567-568
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• 2010

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.9
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• pp.1281-1285
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• 2014

Recently, as the wide spread of smart phone, pico projector which is used at the smart phone is appeared as a portable display device. In this paper, among several pico projectors, laser beam scanner module is dealt with in which laser is used as light source, and mems-mirror is used as optical panel. In this device, screen image quality is a special issue, and blur effect is a typical adverse effect to the quality of this device. So the enhancement of this blur effect has an important factor of the quality of the device. The definition of the blur and the main source of the blur are studied and the simulation results and way of improvement are also suggested.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

• Journal of Sensor Science and Technology
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• v.27 no.2
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• pp.99-104
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• 2018

A micro electromagnetic actuator with high vibration efficiency is proposed for use in an implantable hearing device. The actuator, which can be implanted in the middle ear, consists of membranes based on the stainless steel 304 (SUS-304), and other components. In conventional actuators, in which a thick membrane and a silicone elastomer are used, the size reduction was difficult. In order to miniaturize the size of the actuator, it is necessary to reduce the size of the actuation potion that generates the driving force, resulting in reduction of the electromagnetic force. In this paper, the electromagnetic actuator is further miniaturized by the metal membrane and the vibration amplitude is also optimized. The actuator designed according to the simulation results was fabricated by using micro-electro-mechanical systems (MEMS) technology. In particular, a $20{\mu}m$ thick metal membrane was fabricated using the erosion process, which reduced the length of the actuator by more than $400{\mu}m$. In the experiments, the vibration displacement characteristics of the optimized actuator were above 400 nm within the range of 0.1 to 1 kHz when a current of $1mA_{rms}$ was applied to the coil.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.6
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• pp.271-277
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• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.195-198
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• 2002

현재의 광통신, 이동통신 및 디지털 시대에서는 보다 소형화되고, 대용량의 데이터 저장 및 다기능 소자에 대한 요구가 많아지고 있다. 이러한 전자 산업 환경에서 MEMS 소자는 여러 요구조건을 만족시킬 수 있는 특징을 갖추고 있으며 실제 소자의 제작에 있어서 MEMS 소자를 이용하여 여러 물리 및 화학 센서 및 Actuator 제작에 응용이 되어지고 있고 Optical switch, Gyroscope, 적외선 어레이 센서, 가속도 센서, 위치 센서 등 여러 분야에서 실용화가 진행되어지고 있다. MEMS 구조물의 packaging 방법에 있어서는 내부 MEMS 소자의 동작을 위한 외부 환경으로부터의 보호를 위하여 Hermetic sealing에 대한 요구를 만족시켜야 한다. 본 발표에서는 이와 같은 MEMS device의 진공 패키지를 구현함에 있어서 기판 내부에 수동소자를 실장할 수 있는 LTCC 기술을 이용하여 진공 패키징하는 방법에 대하여 소개한다. 본 기술을 이용하는 경우 기존의 Hermetic sealing 이외에 향후 적층 기판 내부에 수동소자를 내장시켜 배선 길이 및 노이즈 성분을 감소시켜 더욱 전기적 성능을 향상시킬 수 있는 장점이 있게된다. 본 논문에서는 LTCC 기판을 이용하여 패키징 시킨 후, 내부 진공도에 영향을 줄 수 있는 계면들에서의 시간에 따른 진공도 변화의 특성치를 측정하여 LTCC 기판의 Hermetic sealing 특성에 관하여 조사하였다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.447-450
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• 2010

SAW Device 라는 Passive 소자는 ID Tag나 소형센서들을 대체할 수 있는 MEMS 기술의 초소형 Device 다. 이 SAW Device를 이용하면 독립된 공간이나 전원이 필요한 센서 제어 등을 대신할 수 있을 것이다. 이렇게 활용범위가 확대됨에 따라 다양한 SAW Device를 사용하기 위한 플랫폼이 요구된다. 하지만 현재 SAW Sensor는 많은 발전을 해왔지만 SAW Sensor를 활용할 수 있는 플랫폼의 발전은 미흡하기 때문에 본 논문에서는 이러한 SAW Device를 측정할 수 있는 SAW Reader를 FPGA를 이용하여 좀 더 간단하고 효율적인 Reader platform을 구현해 보고자 한다.