# 온도변화에 따른 MEMS 자이로스코프 패키지의 미소변형 측정

• Joo Jin-Won (Department of Mechanical Engineering, Chungbuk National University) ;
• Choi Yong-seo (Department of Mechanical Engineering, Chungbuk National University) ;
• Choa Sung-Hoon (Samsung Advanced Institute of Technology, MEMS Lab.) ;
• Kim Jong-Seok (Samsung Advanced Institute of Technology, MEMS Lab.) ;
• Jeong Byung-Gil (Samsung Advanced Institute of Technology, MEMS Lab.)
• Published : 2004.12.01

#### Abstract

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.