Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2009.06a
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- Pages.152-152
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- 2009
A Study on Micro-Tip Fabrication by Plating and CMP
도금 및 CMP에 의한 Micro-Tip 제작 공정 연구
- Han, Myung-Soo (Photonics Device Team, Korea Photonics Technology Institute) ;
- Park, Chang-Mo (Photonics Device Team, Korea Photonics Technology Institute) ;
- Shin, Gwang-Soo (Photonics Device Team, Korea Photonics Technology Institute) ;
- Ko, Hang-Ju (Photonics Device Team, Korea Photonics Technology Institute) ;
- Kim, Doo-Gun (Photonics Device Team, Korea Photonics Technology Institute) ;
- Hann, S-Wook (Photonics Device Team, Korea Photonics Technology Institute) ;
- Kim, Seon-Hoon (Photonics Device Team, Korea Photonics Technology Institute) ;
- Ki, Hyun-Chul (Photonics Device Team, Korea Photonics Technology Institute) ;
- Kim, Hyo-Jin (Photonics Device Team, Korea Photonics Technology Institute) ;
- Kim, Jang-Hyun (JML Co.)
- 한명수 (한국광기술원 광소자팀) ;
- 박창모 (한국광기술원 광소자팀) ;
- 신광수 (한국광기술원 광소자팀) ;
- 고항주 (한국광기술원 광소자팀) ;
- 김두근 (한국광기술원 광소자팀) ;
- 한수욱 (한국광기술원 광소자팀) ;
- 김선훈 (한국광기술원 광소자팀) ;
- 기현철 (한국광기술원 광소자팀) ;
- 김효진 (한국광기술원 광소자팀) ;
- 김장현 ((주)제이엠엘)
- Published : 2009.06.18
Abstract
We investigate micro-tip properties as Ni-Co plating and CMP processes for MEMS probe card and units. The micro-tip are fabricated by using Ni-Co plating machine, lapping machine, and chemo-mechanical polisher. In order to get high conductive and reliable micro-tip, we control Co contents and thickness by CMP speed. We have found that about 20-25% of Co contents are required and have to lapping speed of 30 rpm. Also, we investigate photolithography and Ni-Co plating processes conditions for the one-step and the three-step micro-tips.