• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• Korean Journal of Materials Research
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• v.25 no.2
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• pp.75-80
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• 2015

The carbon dioxide($CO_2$) released while producing building materials is substantial and has been targeted as a leading contributor to global climate change. One of the most typical method to reducing $CO_2$ for building materials is the addition of slag and fly ash, like pozzolan material, while another method is reducing $CO_2$ production by carbon negative cement development. The MgO-based cement was from the low-temperature calcination of magnesite required less energy and emitted less $CO_2$ than the manufacturing of Portland cements. It is also believed that adding reactive MgO to Portland-pozzolan cements could improve their performance and also increase their capacity to absorb atmospheric $CO_2$. In this study, the basic research for magnesia cement using $MgCO_3$ and magnesium silicate ore (serpentine) as main starting materials, as well as silica fume, fly ash and blast furnace slag for the mineral admixture, were carried out for industrial waste material recycling. In order to increase the hydration activity, $MgCl_2$ was also added. To improve hydration activity, $MgCO_3$ and serpentinite were fired at $700^{\circ}C$ and autoclave treatment was conducted. In the case of $MgCO_3$ as starting material, hydration activity was the highest at firing temperature of $700^{\circ}C$. This $MgCO_3$ was completely transferred to MgO after firing. This occurred after the hydration reaction with water MgO was transferred completely to $Mg(OH)_2$ as a hydration product. In the case of using only $MgCO_3$, the compressive strength was 3.5MPa at 28 days. The addition of silica fume enhanced compressive strength to 5.5 MPa. In the composition of $MgCO_3$-serpentine, the addition of pozzolanic materials such as silica fume increased the compression strength. In particular, the addition of $MgCl_2$ compressive strength was increased to 80 MPa.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.5
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• pp.342-347
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• 2021

Phase evolution, sintering behavior, microstructure, and microwave dielectric properties of (1-x) mol Ba₃V₄O₁₃ - (x) mol BaV₂O₆ system were investigated. The sintered specimens of all compositions consisted of Ba₃V₄O₁₃ and BaV₂O₆, and no secondary phase was observed. As x increased, the linear shrinkage decreased to the composition of x=0.5, and then increased again, implying that Ba₃V₄O₁₃ and BaV₂O₆ phases interfered mutually with each other during sintering. All compositions showed a dense microstructure with a large grain growth. Cracks were observed in some compositions because of the relatively high sintering temperature of 620~640℃. As x increased, the dielectric constant increased, while the quality factor was maintained from about 50,000 GHz to about 70,000 GHz up to the composition of x=0.9, and then decreased to 20,987~27,180 GHz at the composition of x=1.0. As x increased, the temperature coefficient of the resonance frequency showed a (+) value from a (-) value. The dielectric constant, the quality factor, and the temperature coefficient of resonant frequency of x=0.7 composition sintered at 640℃ for 4 hours were 10.61, 71,126 GHz, and -4.9 ppm/℃, respectively. This composition showed a good chemical compatibility with Al powder, indicating that the Ba₃V₄O₁₃-BaV₂O₆ ceramics are a candidate material for ULTCC (Ultra-Low Temperature Co-fired Ceramics) applications.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.229-237
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• 2011

In this paper, a 60 GHz LTCC SiP with low-power CMOS OOK modulator and demodulator is presented. The 60 GHz modulator is designed in a 90-nm CMOS process. The modulator uses a current reuse technique and only consumes 14.4-mW of DC power in the on-state. The measured data rate is up to 2 Gb/s. The 60 GHz OOK demodulator is designed in a 130nm CMOS process. The demodulator consists of a gain boosting detector and a baseband amplifier, and it recovers up to 5 Gb/s while consuming low DC power of 14.7 mW. The fabricated 60 GHz modulator and demodulator are fully integrated in an LTCC SiP with 1 by 2 patch antenna. With the LTCC SiP, 648 Mb/s wireless video transmission was successfully demonstrated at wireless distance of 20-cm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.855-861
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• 2006

Sinterability and microwave dielectric properties of $xZWO_{4}-(1-x)TiO_{2}$ ceramic systems with zinc-borosilicate glass and $TiO_{2}$ contents for LTCC(Low Temperature Co-fired Ceramics) were investigated. The addition of $3{\sim}10\;wt%$ ZBS glass ensured the sinterability below $900^{\circ}C$. In general, increasing ZBS glass content seemed to enhance the sinterability, but the quality factor($Qxf_{0}$) significantly decreased due to the formation of an excessive liquid and second phases. As for the addition of $TiO_{2}$, the dielectric constant(${\varepsilon}_{r}$) and temperature coefficient of resonant frequency(${\tau}_{f}$) showed to increase, while the quality factor($Qxf_{0}$) did not show an apparent change. The composition of $0.7xZnWO_{4}-0.3TiO_{2}$ ceramics sintered at $900^{\circ}C$ with 5 wt% ZBS glass demonstrated 21.6 in dielectric constant(${\varepsilon}_{r}$), 14,800 in quality factor($Qxf_{0}$), and $+5\;ppm/^{\circ}C$ in temperature coefficient of resonant frequency(${\tau}_{f}$).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.1
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• pp.24-31
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• 2022

This study investigated microstructures, crystal structures, polarization, dielectric and electromechanical properties of 0.76Bi_1/2Na_1/2TiO₃-0.24SrTiO₃ (BNT-24ST)-based piezoceramcs by adding Li₂CO₃ and B₂O₃ (LB) as sintering aids for low-temperature sintering. All samples were successfully synthesized using conventional solid-state reaction method and sintered at 950, 1,000, 1,050, 1,100 and 1,175℃ for 2 hours. Without LB, specimens required sintering temperatures over 1,175℃ for sufficient densification, while the addition of 0.10-mol LB decreased the sintering temperatures down to 950℃. The average grain size and dielectric properties of BNT-24ST-10LB ceramics were enhanced with increasing sintering temperature. We found that the low-temperature sintered BNT-24ST piezoceramics by adding LB showed the d₃₃*value of 402 pm/V at 4 kV/mm after sintering at 1,050℃, which was better than that of high-temperature fired specimens sintered at 1,175℃ without LB (242 pm/V). We believe that the results of this study promise a candidate for low-cost multilayer ceramic actuator applications.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.105-109
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• 2005

A compact antenna switch module for GSM/DCS dual band applications based on multilayer low temperature co-fired ceramic (LTCC) substrate is presented. Its size is $4.5{\times}3.2{\times}0.8 mm^3$ and insertion loss is lower than 1.0 dB at Rx mode and 1.2 dB at Tx mode. To verify the stability of the developed module to the process window, each block that is diplexer, LPF's and bias circuit is measured by probing method in the variation with the thickness of ceramic layer and the correlation between each block is quantified by calculating the VSWR In the mean while, two types of bias circuits -lumped and distributed - are compared. The measurement of each block and the calculation of VSWR give good information on the behavior of full module. The reaction of diplexer to the thickness is similar to those of LPF's and bias circuit, which means good relative matching and low value of VSWR, so total insertion loss is maintained in quite wide range of the thickness of ceramic layer at both band. And lumped type bias circuit has smaller insertion itself and better correspondence with other circuit than distributed stripline structure. Evaluated ceramic module adopting lumped type bias circuit has low insertion loss and wider stability region of thickness over than 6um and this can be suitable for the mass production. Stability characterization by probing method can be applied widely to the development of ceramic modules with embedded passives in them.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.117-117
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• 2009

Recently, low temperature co-fired ceramic (LTCC) technology has gained a remarkable application potential in sensors, actuators and microsystems fields. In this study, we investigated the effects of annealing treatment on the electrical properties of $Pb(ZrTi)O_3$ (PZT) thin films deposited on LTCC substrate. The LTCC substrates with thickness of 400 ${\mu}m$ were fabricated by laminating 12 green tapes which consist of alumina and glass particle in an organic binder. The PZT thin films were deposited on Au/LTCC substrates by RF magnetron sputtering method. Then, the change of the crystallization of the films was investigated under various annealing temperatures. The results showed that the crystallization of the films were enhanced as increasing annealing temperatures. The film, annealed at $700^{\circ}C$, 3min, was well crystallized in the ferovskite structure. The structural variation of the films were analyzed by using X-Ray diffraction (XRD) and field emmision scanning electron microscopy (FESEM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.118-118
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• 2009

Low temperature co-fired ceramic (LTCC) is one of promising materials for MEMS structures because it has very good electrical and mechanical properties as well as possibility of making various three dimensional (3D) structures. In this work, piezoelectric pressure sensors based on hybrid LTCC technology were presented. The LTCC diaphragms with thickness of 400 um were fabricated by laminating 12 green tapes which consist of alumina and glass particle in an organic binder. The piezoelectric sensing layer consists of $Pb(ZrTi)O_3$ (PZT) thin film deposited by RF magnetron sputtering method on between top and bottom Au electrodes. The results showed that the fabrication method is very suitable for pressure sensor applications. The PZT films deposited on LTCC diaphragms were successfully grown and were analyzed by using X-ray diffraction method (XRD) and field emission scanning electron microscope (FESEM).

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.3
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• pp.12-24
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• 2001

The key advantage of LTCC(low temperature co-fired ceramics) technology is the ability to integrate passive components such as resistors, capacitors, and inductors. More compact circuits with an increased scale of integration are needed with the development for advanced telecommunication system such as IMT-2000. LTCC technology can be obtained by removing these elements from the substrate surface to inside of ceramic body. And it can miniaturize the wireless phone through integration of planar patch antenna, duplexer, band pass filter, bias line, circuit of impedance matching and RF choke etc. Futhermore, with the multilayer chip process and its outstanding electrical material characteristics, LTCC is predestined for highly-integrated, cost effective wide band applications. This paper focuses on the general description of LTCC MCM technologies and the fabrication of the multilayer VCO module.