• Transactions on Electrical and Electronic Materials
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• v.4 no.2
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• pp.10-14
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• 2003

Flexible displays such as plastic-based liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDDs) have been researched and developed at KETI since 1997. The plastic film substrate is very weak to heat and pressure compared to glass substrate, that its fabrication process is limited to 110$^{\circ}C$ and low pressure. The ITO films were deposited on the bare plastic film substrate by rf-magnetron sputtering. Moreover, in order to maintain uniform cell gap and pressure on the plastic film substrate, we utilized newly-invented jig and fabrication process. Electro-optical characteristics were better than or equivalent to those of typical glass LCDs though it is thinner, lighter-weight, and more robust than glass LCDs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.11
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• pp.1767-1776
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• 2001

For the stable operation of high speed air spindle, the low rotational inertia and high damping ratio of spindle shafts as well as high fundamental natural frequency are indispensable. Conventional steel spindles are net appropriate for very high speed operation because of their high rotational inertia and low damping ratio. In this study, a high speed spindle composed of carbon fiber epoxy composite shaft and steel flange was designed for maximum critical speed considering minimum static deflection and radial expansion due to bending load and centrifugal force during high speed relation. The stacking angle and the stacking thickness of the composite shaft and the adhesive bonding length of the 7teel flange were selected through vibrational analysis considering static and thermal loads due to temperature rise.

• Journal of Environmental Science International
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• v.8 no.1
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• pp.61-67
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• 1999

Silicone oil has organic and inorganic properties, and its skeleton is polysiloxane bonding that silicon is bonded hydrogen or organic group. Silicone compounds are very smooth and lubricant properties by low surface tension, low temperature dependence, and nonadhesive properties. Because of these properties, silicone compounds are used as many parts of chemicals, softener, smooth and libricant agents, water-repellent agent, and defoaming agent, etc. Emulsion was prepared with the inversion emulsification method which adopted the agent-in-oil method dissolving the polyoxyethylene(7) tridecyl ether(HLB 12.2) into methoxy terminated poly(dimethyl-co-methyl amino) siloxane and hydroxy terminated poly(dimethyl-co-methyl amino) siloxane in water. At this time, processed emulsion was almost microemulsion. When ratio of emulsifier increases, emulsion is stable bacuause microemulsion is solubilized by emulsion drop size and zeta-potential are decreased. But, when amount of electrolyte is increase, emulsion became unstable because emulsion drop size is increased.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.743-746
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• 2003

We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer splitting of Ge, to transfer 700nm think, single-crystal Ge films to Si substrates. Optical and electrical properties have been also observed on these samples. Triple-junction solar cell structures gown on these Ge/Si heterostructure templates show comparable photoluminescence intensity and minority carrier lifetime to a control structure grown on bulk Ge. When heavily doped p$^{+}$Ge/p$^{+}$Si wafer bonded heterostructures were bonded, ohmic interfacial properties with less than 0.3Ω$\textrm{cm}^2$ specific resistance were observed indicating low loss thermal emission and tunneling processes over and through the potential barrier. Current-voltage (I-V) characteristics in p$^{+}$Ge/pSi structures show rectifying properties for room temperature bonded structures. After annealing at 40$0^{\circ}C$, the potential barrier was reduced and the barrier height no longer blocks current flow under bias. From these observations, interfacial atomic bonding structures of hydrophobically wafer bonded Ge/Si heterostructures are suggested.ested.

• Journal of the Korean Wood Science and Technology
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• v.17 no.4
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• pp.26-34
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• 1989

This study was carried out to manufacture bark board from oak bark by new processes and to examine the physical and mechanical properties of the board. This process with no addition of adhesive used higher pressure and temperature than the conventional one and was applied with or without paraformaldehyde. The results are as follows: 1. The new manufacturing process allowed a good bark board with high absorption coefficient. 2. The best manufacturing process for the mechanical properties of bark board was paraformaldehyde 10%-$250^{\circ}C$-100kg/$cm^2$-3 minutes, (bending strength 40kg/$cm^2$, internal bonding strength 2kg/$cm^2$) and the best manufacturing process for both the mechanical properties of bark board and economic point of view was $250^{\circ}C$-100kg/$cm^2$-3 minutes (bending strength 28kg/$cm^2$, internal bonding strength 1.52kg/$cm^2$). 3. Bark board showed specific gravities from 0.94 to 1.03 and air dried moisture content 9.2% to 11.7%, but Bark board needed paraffin wax emusion treatment. 4. The absorption coefficient of bark boards had two peaks along with frequency; one in 200-400 cps, the other 1200-2000 cps. The former was low but the latter great.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Korean Journal of Metals and Materials
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• v.47 no.7
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• pp.447-453
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• 2009

Isotropic conductive adhesives (ICAs) have been used or considered as an interconnect material for radio frequency identification (RFID) inlays or other flip chip assemblies due to the advantages of having a low temperature and high-speed bonding. In this work, the curing properties of commercial ICAs for the RFID tag application and the signal transmission in conductive lines that contained the ICA joints were evaluated as a function of the degree of cure at 900 MHz frequency range. The ICAs showed adequate signal transmission only after the curing process passed over the critical time. It was also found that the insertion loss of signal was more dependent on the contact states of Ag fillers in the bondline in preference to the electrical resistance of the ICA itself.

• Journal of Ceramic Processing Research
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• v.20 no.1
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• pp.48-53
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• 2019

Carbon fiber reinforced SiC composites (C/SiC) have high-temperature stability and excellent thermal shock resistance, and are currently being applied in extreme environments, for example, as aerospace propulsion parts or in high-performance brake systems. However, their low thermal conductivity, compared to metallic materials, are an obstacle to energy efficiency improvements via utilization of regenerative cooling systems. In order to solve this problem, the present study investigated the bonding strength between carbon fiber and matrix material within ceramic matrix composite (CMC) materials, demonstrating the relation between the microstructure and bonding, and showing that the mechanical properties and thermal conductivity may be improved by treatment of the carbon fibers. When fiber surface was treated with a nitric acid solution, the observed segment crack areas within the subsequently generated CMC increased from 6 to 10%; moreover, it was possible to enhance the thermal conductivity from 10.5 to 14 W/m·K, via the same approach. However, fiber surface treatment tends to cause mechanical damage of the final composite material by fiber etching.

• Macromolecular Research
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• v.14 no.4
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• pp.408-415
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• 2006

Temperature-dependent, wide-angle, x-ray diffraction (WAXD) patterns and infrared (IR) spectra were measured for biodegradable poly(3-hydroxybutyrate) (PHB) and its copolymers, poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) P(HB-co-HHx) (HHx=2.5, 3.4, 10.5, and 12 mol%), in order to explore their crystal and lamellar structure and their pattern of C-H...O=C hydrogen bonding. The WAXD patterns showed that the P(HB-co-HHx) copolymers have the same orthorhombic system as PHB. It was found from the temperature-dependent WAXD measurements of PHB and P(HB-co-HHx) that the a lattice parameter is more enlarged than the b lattice parameter during heating and that only the a lattice parameter shows reversibility during both heating and cooling processes. These observations suggest that an interaction occurs along the a axis in PHB and P(HB-co-HHx). This interaction seems to be due to an intermolecular C-H...O=C hydrogen bonding between the C=O group in one helical structure and the $CH_3$ group in the other helical structure. The x-ray crystallographic data of PHB showed that the distance between the O atom of the C=O group in one helical structure and the H atom of one of the three C-H bonds of the $CH_3$ group in the other helix structure is $2.63{\AA}$, which is significantly shorter than the sum of the van der Waals separation ($2.72{\AA}$). This result and the appearance of the $CH_3$ asymmetric stretching band at $3009 cm^{-1}$ suggest that there is a C-H...O=C hydrogen bond between the C=O group and the $CH_3$ group in PHB and P(HB-co-HHx). The temperature-dependent WAXD and IR measurements revealed that the crystallinity of P(HB-co-HHx) (HHx =10.5 and 12 mol%) decreases gradually from a fairly low temperature, while that of PHB and P(HB-co-HHx) (HHx = 2.5 and 3.5 mol%) remains almost unchanged until just below their melting temperatures. It was also shown from our studies that the weakening of the C-H...O = C interaction starts from just above room temperature and proceeds gradually increasing temperature. It seems that the C-H...O=C hydrogen bonding stabilizes the chain holding in the lamellar structure and affects the thermal behaviour of PHB and its copolymers.

• Journal of Industrial Technology
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• v.23 no.A
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• pp.157-163
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• 2003

The properties of mechanics and durability of LMC have been performed actively. However, little studies on analysis and properties of thermal expansion has been on the temperature variation. Especially, the low of bonding strength and tensile cracking are caused by difference of thermal expansion between LMC and the substrate concrete. Therefore, this study focused on effect of thermal expansion behavior and properties of LMC according to temperature variation. To identify the property of thermal expansion of LMC, tests of modulus of thermal expansion were carried out at 28 days after casting specimen, subjected to temperature variation between $10^{\circ}C$ and $60^{\circ}C$. The results of this study showed the modulus of elastic of LMC was similar to that of ordinary portland concrete(OPC). It means that stresses caused by difference of modulus of elastic did not occur on interface between LMC and existing concrete. The modulus of thermal expansion of LMC had a little smaller than that of OPC. The modulus of thermal expansion of polymer modified concrete is generally larger than OPC, but the result of this test is disagree with the fact, which may be due to the humidity evaporation difference and aggregate properties.