• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 1999년도 춘계학술발표대회 논문집
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• pp.109-113
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• 1999

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.63-85
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• 1999

$\cdot$New CSP using Lead Frame and solder ball techniques. $\cdot$EMC needs high filler content, low CTE and high flexural modulus. $\cdot$Solder Joint Reliability improved by anchor leads. .Uniform inner lead shape would be better at capacitance values. $\cdot$Low Assembly cost CSP.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package)는 가전제품, 자동차, 모바일, 데스크톱 PC등을 위한 저렴한 비용의 패키지로, 리드 프레임을 사용하는 IC패키지이다. TSOP는 BGA와 flip-chip CSP에 비해 우수한 성능은 아니지만, 저렴한 가격 때문에 많은 분야에 널리 사용되고 있습니다. 그러나, TSOP 패키지에서 몰딩공정 할 때 리드프레임의 열적 처짐 현상이 빈번하게 일어나고, 반도체 다이와 패드 사이의 Au 와이어 떨어짐 현상이 이슈가 되고 있다. 이러한 문제점을 해결하기 위해서는 리드프레임의 구조를 개선하고 낮은 CTE를 갖는 재료로 대체해야 한다. 본 연구에서는 열적 안정성을 갖도록 리드프레임 구조 개선을 위해 수치해석적 방법으로 진행하였다. TSOP 패키지에서 리드프레임의 열적 처짐은 반도체와 다이 사이의 거리(198 um~366 um)에서 안티-디플렉션의 위치에 따라 시뮬레이션을 진행하였다. 안티-디플렉션으로 TSOP 패키지의 열적 처짐은 확실히 개선되는 것을 확인 했다. 안티-디플렉션의 위치가 inside(198 um)일 때 30.738 um 처짐을 보였다. 이러한 결과는 리드프레임의 열적 팽창을 제한하는데 안티-디플렉션이 기여하고 있기 때문이다. 그러므로 리드프레임 패키지에 안티-디플렉션을 적용하게 되면 낮은 CTE를 갖는 재료로 대체하지 않아도 열적 처짐을 향상시킬 수 있음을 기대할 수 있다.

• 대한치과기공학회지
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• 제31권4호
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• pp.25-30
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• 2009

Zirconia($ZrO_2$) has attracted much attention in science and technology because of its high refractive index, high melting temperature, hardness, low thermal conductivity and corrosion barrier properties. And it is widely used as the dental restoration material because of its esthetic appearance. In this research, we analyzed the particle size and composition of the imported dental porcelain for zirconia. And the glass frit was produced. To decrease the glass transition temperature and softening temperature of the glass frit, $Li_2O$ was added into it and the effect of $Li_2O$ on the firing temperature was researched. Then the glass which contains leucite crystal with a high coefficient of thermal expansion(CTE) was manufactured and it was mixed with the glass frit to control the CTE. The phase composition were analyzed using the X-ray diffraction. The morphologies of the samples were observed by the scanning electron microscope. The 4wt% $Li_2O$-added glass frit has the optimal glass transition temperature and softening temperature. And 6 wt% leucite crystal was mixed with the glass frit to control the CTE. From the experimental results of crystallization, the crystal phase was found only leucite crystal.

• 한국군사과학기술학회지
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• 제21권2호
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• pp.217-224
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• 2018

The purpose of this study is to evaluate the future potential value of CTE(Critical Technology Element)s that are evaluated to be low in TRA(Technology Readiness Assesment) and to present investment prioritization technologies in defense R&D(Research and Development) based on them. To do this, we used the DEA(Data Envelopment Analysis) method, which is useful in evaluating the efficiency of the organization. Specifically, we suggest a systematic framework to evaluate the future value of CTEs by setting the CTEs derived from the TRA process to DMU(Decision Making Unit)s, the cost and time required to develop each CTE as the input factor of the DEA and the effects of the development of each CTE as the output factor of the DEA respectively. We also conducted an illustrative case study on radar technologies to demonstrate the usefulness of the proposed approach.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.3-17
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• 2003

.Package Trend -> Memory : Lighter, Thinner, Smaller & High Density => SiP, 3D Stack -> MPU : High Pin Counts & Multi-functional => FCBGA .Interposer Trend -> Via - Unfilled Via => Filled Via - Staggered Via => Stacked Via -> Emergence of All-layer Build-up Processes -> Interposer Material Requirement => Low CTE, Low $D_{k}$, Low $D_{f}$, Halogen-free .New Technology Concept -> Embedded Passives, Imprint, MLTS, BBUL etc.

• Macromolecular Research
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• 제12권1호
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.322-322
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• 2008

Low-temperature co-fired ceramics (LTCC) have turned out to be very promising technology in accordance with the rapid developments in semiconductor technology. The demands for compact electrical assemblies, smaller power loss as well as high signal density can be fulfilled by LTCC. And for the multi-layered ceramic devices with embedded passive components such as high dielectric constant decoupling capacitor, LTCC materials require the several conditions to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental resultsn the influence of each element on the CTE change can be revealed.

• 한국고분자학회:학술대회논문집
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• 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
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• pp.227-227
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• 2006

It was attempted to synthesize polyimides from PPMDA and 3FPPMDA with mDAPPO/pPDA in order to afford CTE of 17ppm and adhesion property of 80g/mm, besides high Tg (>$300^{\circ}C$), good thermal stability (>$500^{\circ}C$), low water absorption and good solubility. The polyimides were prepared via a conventional two-step process; preparation of poly(amic-acid), followed by solution imidization by refluxing in NMP with o-DCB and the molar ratio of mDAPPO/pPDA was varied. The polyimides were characterized by FT-IR, NMR, DSC and TGA. In addition, intrinsic viscosity, solubility and coefficient of thermal expansion (CTE) were also measured.