• Journal of Korea Society of Industrial Information Systems
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• v.12 no.3
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• pp.116-123
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• 2007

Despite the number of backlight manufacturer is increased as the market of flat panel display equipments and related development devices is enlarged, the inspection based on the human eye is still used in many backlight production lines. The defects such as particle, spot and scratch on the light emitting surface of the backlight prevent the LCD device from displaying the colors correctly. From that manual inspection it is difficult to maintain the quality of backlight consistently because the accuracy and the speed of the inspection may change with the physical condition of the operater. In this paper we studied on the development of automatic backlight surface defect inspection system. For this, we made up of the computer vision system and we developed the main program with various user interfaces to operate the inspection system effectively. And we developed the image processing module to extract the defect information. Furthermore, we presented the labeling process to reconstruct defect regions using the labeling table and the defect index. From the experimental results, we found that our system can detect all defect regions identified from human eye and it is sufficient to substitute for the conventional surface inspection.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.148-148
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• 2011

Recently, there have been many research activities to develop the large-area plasma source, which is able to generate the high-density plasma with relatively good uniformity, for the plasma processing in the thin-film solar cell and display panel industries. The large-area CCP sources have been applied to the PECVD process as well as the etching. Especially, the PECVD processes for the depositions of various films such as a-Si:H, ${\mu}c$-Si:H, Si3N4, and SiO2 take a significant portion of processes. In order to achieve higher deposition rate (DR), good uniformity in large-area reactor, and good film quality (low defect density, high film strength, etc.), the application of VHF (>40 MHz) CCP is indispensible. However, the electromagnetic wave effect in the VHF CCP becomes an issue to resolve for the achievement of good uniformity of plasma and film. Here, we propose a new electrode as part of a method to resolve the standing wave effect in the large-area VHF CCP. The electrode is split up a series of strip-type electrodes and the strip-type electrodes and the ground ones are arranged by turns. The standing wave effect in the longitudinal direction of the strip-type electrode is reduced by using the multi-feeding method of VHF power and the uniformity in the transverse direction of the electrodes is achieved by controlling the gas flow and the gap length between the powered electrodes and the substrate. Also, we provide the process results for the growths of the a-Si:H and the ${\mu}c$-Si:H films. The high DR (2.4 nm/s for a-Si:H film and 1.5 nm/s for the ${\mu}c$-Si:H film), the controllable crystallinity (~70%) for the ${\mu}c$-Si:H film, and the relatively good uniformity (1% for a-Si:H film and 7% for the ${\mu}c$-Si:H film) can be obtained at the high frequency of 40 MHz in the large-area discharge (280 mm${\times}$540 mm). Finally, we will discuss the issues in expanding the multi-electrode to the 8G class large-area plasma processing (2.2 m${\times}$2.4 m) and in improving the process efficiency.

• Korean Journal of Materials Research
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• v.11 no.6
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• pp.527-532
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• 2001

Dry etching of copper film using $O_2$ plasma and H(hfac) has been investigated. A one-step process consisting of copper film oxidation with an $O_2$ plasma and the removal of surface copper oxide by the reaction with H(hfac) to form volatile Cu(hfac)$_2$ and $H_2O$ was carried but. The etching rate of Cu in the range from 50 to 700 /min was obtained depending on the substrate temperature, the H(hfac)/O$_2$ flow rate ratio, and the plasma power. The copper film etch rate increased with increasing RF power at the temperatures higher than 215$^{\circ}C$. The optimum H(hfac)/O$_2$ flow rate ratio was 1:1, suggesting that the oxidation process and the reaction with H(hfac) should be in balance. Cu patterning using a Ti mask was performed at a flow rate ratio of 1:1 on 25$0^{\circ}C$\ulcorner and an isotropic etching profile with a taper slope of 30$^{\circ}$was obtained. Cu dry patterning with a tapered angle which is necessary for the advanced high resolution large area thin film transistor liquid-crystal displays was thus successfully obtained from one step process by manipulating the substrate temperature, RF power, and flow rate ratio.

• Proceedings of the Korea Contents Association Conference
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• 2006.11a
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• pp.856-859
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• 2006

Patient's position who muscle ache curer for hospital undergoes person entrance and treatment that take advantage of biological, physical force of low frequency and it is equipment that treat body muscle ache, but use equipment when use patient into compensation in hospital specially, that consider everybody is important first of all. This research question investigation with market survey of old product enforce because preference degree reflected officer a result and apply opinion tuned with product development connection engineers on DESIGN direction via typical product design development process close. This curer development research analyzed data involved directly taking advantage of FGI techniques with literature investigation collection. Investigation examined laying stress on muscle ache curer for hospital and a nurse than a doctor answered on question and purchase selection criterion or price portion to user focus. Direct market survey research that see item indicated by competition four provision shortcomings consequently in NEW MODEL development hereafter supplement and expectation. by contributing greatly in M/S security strategy hereafter because design development consisted for side that improve.

• Journal of the Korean Electrochemical Society
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• v.3 no.1
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• pp.11-14
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• 2000

Transparent conducting ITO thin films have been studied and developed for the solar cell substrate or LCD substrate. ITO thin film has been mostly fabricated by high cost sputtering method. In this research, sol-gel method is applied to fabricate ITO thin film at lower cost. The research is focused on the establishment of process condition and development of precursor. Organic sol was made of indium tri-isopropoxide dissolved in ethylene glycol monoethyl ether. The hydrolysis was controled by addition of acetyl acetone. Tin(IV) chloride was added as dopant. Inorganic sol was made of indium acetate dissolve din normal propanol. Spin coating technique was applied to coat ITO on borosilicate glass. The resistivity of ITO thin film was approximately $0.01\Omega{\cdot}cm$ and the transmittance is higher than $90\%$ in a visible range.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.10
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• pp.231-238
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• 2013

This paper describes a DC-DC converter IC for Flat Panel Displays. In case of operate LCD devices various type of DC supply voltage is needed. This device can convert DC voltage from 6~14[V] single supply to -5[V], 15[V], 23[V], and 3.3[V] DC supplies. In order to meet current and voltage specification considered different type of DC-DC converter circuits. In this work a negative charge pump DC-DC converter(-5V), a positive charge pump DC-DC converter(15V), a switching Type Boost DC-DC converter(23V) and a buck DC-DC converter(3.3V). And a oscillator, a thermal shut down circuit, level shift circuits, a bandgap reference circuits are designed. This device has been designed in a 0.35[${\mu}m$] triple-well, double poly, double metal 30[V] CMOS process. The designed circuit is simulated and this one chip product could be applicable for flat panel displays.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.51-60
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• 2005

This paper describes a robust control scheme for high-speed and long stroke scanning motion of high precision linear motor system consisting of linear motor, air bearing guide and position measurement system using heterodyne interferometer. Nowadays, semiconductor process and inspection of wafer or LCD need high speed and long travel length for their high throughput and extremely small velocity fluctuations or tracking errors. In order to satisfy these conditions, linear motor system are widely used because they have large thrust force and do not need motion conversion mechanisms such as ball screw, rack & pinion or capstan with which the system are burdened. However linear motors have a problem called force ripple. Force ripple deteriorates the tracking performances and makes periodic position errors. So, force ripple must be compensated. To maximize the tracking performance of linear motor system, we propose the control scheme which is composed of a robust control method, Time Delay Controller (TDC) and a feedforward control method, Zero Phase Error Tracking Control (ZPETC) for accurate tracking a given trajectory and an adaptive force ripple compensation (AFC) algorithm fur estimating and compensating force ripple. The adaptive ripple compensation is continuously refined on the basis of tracking error. Computer simulation results based on modeled parameters verify the effectiveness of the proposed control scheme for high-speed, long stroke and high precision scanning motion and show that the proposed control scheme can achieve a sup error tracking performance in comparison to conventional TDC control.

• Design & Manufacturing
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• v.7 no.1
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• pp.55-59
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• 2013

A Light Emitting Diode(LED) is a semiconductor device which converts electricity into light. LEDs are widely used in a field of illumination, LCD(Liquid Crystal Display) backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. In general, LEDs production does die bonding and wire bonding on board, and do silicon and phosphor dispensing to protect LED chip and improve brightness. Then lens molding process is performed using mixed liquid silicon rubber(LSR) by resin and hardener. A mixture of resin and hardener affect the optical characteristics of the LED lens. In this paper, computational design of static mixer was performed for mixing of liquid silicon. To evaluate characteristic of mixing efficiency, finite element model of static mixer was generated, and fluidic analysis was performed according to length of mixing element. Finally, optimal condition of length of mixing element was applied to static mixer from result of fluidic analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.05a
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• pp.96-99
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• 1993

Electrical properties of the Thin Film Transistor(TFT) electrode metal films were investigated through the Test Elements Group(TEG) experiment. The main purpose of this investigation was to characterize the electrical resistance properties of patterned metal films with respect to the variations of film thickness and TEG metal line width. Aluminum(Al), Tantalum(Ta) and Chromium(Cr) that are currently used as TFT electrode films were selected as the probed metal films. To date, no work in the electrical characterizations of patterned electrodes of a-Si TFT was accomplished. Bulk resistance$(R_b)$, sheet resistance$(R_s)$, and resistivities($\rho$) of TEG patterned metal lines were obtained. Electrical continuity test of metal film lines was also performed in order to investigate the stability of metallization process. Almost uniform-linear variations of the electrical properties with respect to the metal line displacements was also observed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.1
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• pp.52-58
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• 2006

Single-electron transistor (SET)-based logic cells and SET/FET hybrid integrated circuits have been fabricated on SOI chips. The input-output voltage transfer characteristic of the SET-based complementary logic cell shows an inverting behavior where the output voltage gain is estimated to be about 1.2 at 4.2K. The SET/FET output driver, consisting of one SET and three FETs, yields a high voltage gain of 13 and power amplification with a wide-range output window for driving next circuit. Finally, the SET/FET literal gate for a multi-valued logic cell, comprising of an SET, an FET and a constant-current load, displays a periodic voltage output of high/low level multiple switching with a swing as high as 200mV. The multiple switching functionality of all the fabricated logic circuits could be enhanced by utilizing a side gate incorporated to each SET component to enable the phase control of Coulomb oscillations, which is one of the unique characteristics of the SET-based logic circuits.